Supply original MR256A08BYS35, Toggle MRAM, by Everspin Technologies

Supply original MR256A08BYS35, Toggle MRAM, by Everspin Technologies | TrustCompo Electronic

Pictures are for reference only. Please contact us for the latest pictures.

Part Number
MR256A08BYS35
Internal code
TCE000012984
Package
TSOP-II
Serise
MR256A08
key Attributes
-
Description
MRAM 256Kbit Parallel Interface 3.3V
Min Quantity
1
Manufacturer
Everspin Technologies
Category
MRAM
Sub Categroy
Toggle MRAM
Datasheet
-

Availability

In Stock1,000,000,313
Avaliable1,000,000,470

Price Range

QualityUnit Price
270
540
1,080
1,350
2,160
2,700
5,400
5,940
10,800

Due to different local policies, please contact us for the latest quotation.

Certified Quality Assurance
Responsive 24/7 Support
Free Shipping & Sample Provision
30-Day Return Policy

We are ISO 9001, AS 9120B, IOS 14001 certified, ensuring that our quality management system meets international standards. This certification guarantees that every electronic component we supply is authentic, reliable, and traceable. Our dedicated inspection team conducts rigorous quality checks to prevent counterfeit products and reduce failure rates. By adhering to these stringent quality controls, we provide our customers with peace of mind and products they can trust.

Product Attribute

Part Status
Active
Packaging
Tray
Data Bus Width (bit)
8
Pin Count
44
Max. Access Time (ns)
35
Interface Type
Parallel
Operating Voltage (V)
3.3 (3 to 3.6)
Temperature Range
0°C to +70°C
Chip Density (bit)
256K
Organization
32Kx8
Operating Current (mA)
65

Export Classifications & Environmental

Automotive
NO
PPAP
NO
EU RoHS
Compliant
ECCN (US)
EAR99
HTS
8542.32.00.71

Package Parameter

Mounting
Surface Mount
Lead Shape
Gull-wing
Package Dimensions
18.54 x 10.29 x 1.05 mm (Max)
Supplier Package
TSOP-II

Articles

This guide provides a direct comparison of HBM generations (up to HBM3e), analyzes the market landscape dominated by SK Hynix, Samsung, and Micron, and offers a crucial procurement checklist. It concludes with a practical case study, advising on capacity and bandwidth requirements (e.g., for a 175B parameter LLM), ensuring businesses can make informed decisions for their high-performance AI systems.

The Nexperia geopolitical crisis, involving legal takeover and counter-sanctions, poses the most severe recent risk to the global semiconductor supply chain, demanding immediate analysis of supply bottlenecks and price impacts for all component buyers.

With its unique properties of radiation hardening, unlimited read/write endurance, and low power consumption, MRAM is becoming the preferred choice for next-generation aerospace memory. This article will provide an in-depth analysis of MRAM's key advantages and applications in the aerospace field.

Comprehensive overview of MR25H40CDF SPI MRAM: specs, applications, case studies, and our real-stock advantages.