Supply original MR2A16AMA35, Toggle MRAM, by Everspin Technologies

Supply original MR2A16AMA35, Toggle MRAM, by Everspin Technologies | TrustCompo Electronic

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Part Number
MR2A16AMA35
Internal code
TCE000012982
Package
FBGA
Serise
MR2A16A
key Attributes
-
Description
MRAM 4Mbit Parallel Interface 3.3V
Min Quantity
1
Manufacturer
Everspin Technologies
Category
MRAM
Sub Categroy
Toggle MRAM
Datasheet
-

Availability

In Stock1,000,000,487
Avaliable1,000,000,317

Price Range

No Data Yet

Due to different local policies, please contact us for the latest quotation.

Certified Quality Assurance
Responsive 24/7 Support
Free Shipping & Sample Provision
30-Day Return Policy

We are ISO 9001, AS 9120B, IOS 14001 certified, ensuring that our quality management system meets international standards. This certification guarantees that every electronic component we supply is authentic, reliable, and traceable. Our dedicated inspection team conducts rigorous quality checks to prevent counterfeit products and reduce failure rates. By adhering to these stringent quality controls, we provide our customers with peace of mind and products they can trust.

Overview

The MR2A16AMA35 is a 4,194,304-bit magnetoresistive random access memory (MRAM) device organized as 262,144 words of 16 bits. It offers high-performance parallel interface operation with a fast 35 ns access time, making it ideal for applications requiring high-speed, non-volatile data storage.

Built on 180nm process technology, this device provides unlimited read/write endurance and data retention for over 20 years. Its commercial temperature range (0°C to +70°C) ensures reliable operation in standard operating environments.

The FBGA package offers a compact footprint with 48-ball configuration, suitable for space-constrained designs. The device features low-voltage operation (3.3V typical) and includes power-loss protection to prevent data corruption during unexpected shutdowns.

Export Classifications & Environmental

Automotive
NO
PPAP
NO
EU RoHS
Compliant
SVHC
Yes
SVHC Exceeds Threshold
Yes
ECCN (US)
EAR99
HTS
8542.32.00.71

Package Parameter

Mounting
Surface Mount
Lead Shape
BALL
Supplier Package
FBGA
Package Dimensions
8 x 8 x 1.02 mm

Product Attribute

Part Status
Active
Packaging
Tray
Data Bus Width (bit)
16
Pin Count
48
Max. Access Time (ns)
35
Interface Type
Parallel
Chip Density (bit)
4M
Operating Voltage (V)
3.3 (3 to 3.6)
Process Technology
180nm
Endurance
Unlimited
Data Retention
>20 years
Organization
256Kx16
Temperature Range
0°C to +70°C
Operating Current (mA)
155

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