MR25H40CDC Toggle MRAM by Everspin Technologies

Indicates qualification for automotive applications, typically meeting AEC-Q standards and extended temperature ranges. Essential for designs requiring high reliability under harsh conditions. Confirm specific grade and certifications in the datasheet.

Indicates whether Production Part Approval Process documentation is available for this component. Buyers and engineers should verify PPAP availability when sourcing parts for automotive or safety-critical applications to ensure supplier quality and traceability.

Indicates whether the component complies with the EU Restriction of Hazardous Substances directive. Check this attribute to ensure regulatory compliance for products sold in the European market. Verify against the latest RoHS certificate or datasheet.

The US Export Control Classification Number determines export licensing requirements for electronic components. Verify the current ECCN from the manufacturer or datasheet, as it affects international shipping and compliance with US regulations.

Maximum time from address or control signal to valid data output. Critical for memory speed and system timing. Compare with your required cycle time and verify against datasheet for worst-case conditions.

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

Specifies the number of bits transferred simultaneously on the data bus. This affects data throughput and interface compatibility. Verify against the datasheet to ensure the device matches your system's bus architecture and performance requirements.

Typical current drawn by the component during normal operation. Compare this value with your power budget and check the datasheet for maximum ratings and variations across supply voltage and load conditions.

Total memory capacity of the chip in bits. Compare this value to your application's storage requirements. Verify against the datasheet to ensure the exact density and organization match your design.

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Specifies the minimum and maximum ambient temperatures at which the component operates reliably. Compare this range with your application's thermal environment to ensure performance and longevity. Always verify against the datasheet for derating curves and absolute maximum ratings.

Specifies the communication protocol used by the component to exchange data with a host controller or other devices. Common examples include I2C, SPI, UART, USB, and CAN. Verify compatibility with your system's bus architecture and voltage levels before integration.

Specifies the internal arrangement of memory cells, typically expressed as words by bits. This affects how data is accessed and stored. Engineers compare this to ensure compatibility with their system's bus width and addressing scheme. Always verify against the datasheet for exact configuration.

Specifies the supply voltage range within which the component functions correctly. Engineers compare this to the system's power rails to ensure compatibility. Always verify the absolute maximum ratings in the datasheet to prevent damage from overvoltage or undervoltage conditions.

Indicates the physical configuration of component leads, such as gull-wing, J-lead, or through-hole. This affects PCB footprint design, soldering process, and mechanical reliability. Verify against the package drawing to ensure compatibility with your assembly line and layout.

Physical dimensions of the component package, typically length, width, and height. Essential for PCB layout and mechanical design. Compare with the datasheet to ensure proper fit and clearance in your application.

Package name as designated by the manufacturer, such as SOIC-8 or QFN-32. Use this to identify the exact package variant and footprint. Cross-reference with the datasheet for pin layout and thermal pad details.