Supply original KHAS84901X-MN12, High Bandwidth Memory, by Samsung

Supply original KHAS84901X-MN12, High Bandwidth Memory, by Samsung | TrustCompo Electronic

Pictures are for reference only. Please contact us for the latest pictures.

Part Number
KHAS84901X-MN12
Internal code
TCE000026944
Package
MPGA
Serise
-
key Attributes
-
Description
8GB HBM Memory Component
Min Quantity
1
Manufacturer
Samsung
Category
Memory
Sub Categroy
High Bandwidth Memory
Datasheet
-

Availability

In Stock9,192
Avaliable2,938

Price Range

No Data Yet

Due to different local policies, please contact us for the latest quotation.

Certified Quality Assurance
Responsive 24/7 Support
Free Shipping & Sample Provision
30-Day Return Policy

We are ISO 9001, AS 9120B, IOS 14001 certified, ensuring that our quality management system meets international standards. This certification guarantees that every electronic component we supply is authentic, reliable, and traceable. Our dedicated inspection team conducts rigorous quality checks to prevent counterfeit products and reduce failure rates. By adhering to these stringent quality controls, we provide our customers with peace of mind and products they can trust.

Overview

8GB HBM memory component in MPGA package with 2.0 Gbps speed. Features 32 ms latency, 1024-bit interface, and is in Mass Production status. Industrial-grade memory for harsh environments.

Product Attribute

Interface Width
1024
Latency
32 ms
Part Status
Mass Production
Technology
HBM
Component Density
8 GB

Package Parameter

Package Type
MPGA

Product Parameter

Speed
2.0 Gbps

Articles

This guide provides a direct comparison of HBM generations (up to HBM3e), analyzes the market landscape dominated by SK Hynix, Samsung, and Micron, and offers a crucial procurement checklist. It concludes with a practical case study, advising on capacity and bandwidth requirements (e.g., for a 175B parameter LLM), ensuring businesses can make informed decisions for their high-performance AI systems.

The Nexperia geopolitical crisis, involving legal takeover and counter-sanctions, poses the most severe recent risk to the global semiconductor supply chain, demanding immediate analysis of supply bottlenecks and price impacts for all component buyers.

With its unique properties of radiation hardening, unlimited read/write endurance, and low power consumption, MRAM is becoming the preferred choice for next-generation aerospace memory. This article will provide an in-depth analysis of MRAM's key advantages and applications in the aerospace field.

Comprehensive overview of MR25H40CDF SPI MRAM: specs, applications, case studies, and our real-stock advantages.