Supply original ATSAMA5D31A-CU, Embedded - Microprocessors, by Microchip Technology

Supply original ATSAMA5D31A-CU, Embedded - Microprocessors, by Microchip Technology | TrustCompo Electronic

Pictures are for reference only. Please contact us for the latest pictures.

Part Number
ATSAMA5D31A-CU
Internal code
TCE000012763
Package
-
Serise
SAMA5D3
key Attributes
-
Description
IC MCU 32BIT 160KB ROM 324LFBGA
Min Quantity
1
Manufacturer
Microchip Technology
Category
Integrated Circuits (ICs)
Sub Categroy
Embedded - Microprocessors
Datasheet
-

Availability

In Stock352,395
Avaliable134,188

Price Range

QualityUnit Price
1
10
30
100
500
1,000

Due to different local policies, please contact us for the latest quotation.

Certified Quality Assurance
Responsive 24/7 Support
Free Shipping & Sample Provision
30-Day Return Policy

We are ISO 9001, AS 9120B, IOS 14001 certified, ensuring that our quality management system meets international standards. This certification guarantees that every electronic component we supply is authentic, reliable, and traceable. Our dedicated inspection team conducts rigorous quality checks to prevent counterfeit products and reduce failure rates. By adhering to these stringent quality controls, we provide our customers with peace of mind and products they can trust.

Overview

The ATSAMA5D31A-CU is a microcontroller from Microchip Technology, part of the SAMA5 family, which is designed for high-performance applications requiring efficient processing and low power consumption. This microcontroller is based on the ARM Cortex-A5 architecture, which provides a balance of performance and power efficiency, making it suitable for a variety of embedded applications, including industrial control, consumer electronics, and IoT devices.

Product Attribute

Part Status
Active
Graphics Acceleration
NO
Packaging
Tray
Surface Mount
Yes
Pbfree Code
Yes
REACH Status
REACH Unaffected
Lead Free
Lead Free
Number of ADC Channels
12
Factory Lead Time
10 Weeks
Number of I/O
160
Terminal Position
Bottom
Categories
Integrated Circuits (ICs)
Technology
CMOS
Width
15.05mm
Length
15.05mm
Terminal Pitch
0.8mm
Published
2015
Operating Temperature
-40°C~85°C TA
Operating Supply Voltage
1.2V
Supply Voltage
1.2V
Voltage - I/O
1.2V 1.8V 3.3V
Manufacturer
Microchip Technology
Height
1.1mm
ECCN
5A992C
Max Supply Voltage
1.32V
Terminal Form
BALL
Number of Cores/Bus Width
1 Core 32-Bit
Sub-Categories
Embedded - Microprocessors
Number of Pins
324
Number of Terminations
324
Subcategory
Microprocessors
Package / Case
324-LFBGA
Display & Interface Controllers
LCD, Touchscreen
Series
SAMA5D3
Base Part Number
ATSAMA5D31
Manufacturer's Part No.
ATSAMA5D31A-CU
RAM Controllers
LPDDR, LPDDR2, DDR2
Additional Interfaces
I2C, MMC/SD/SDIO, SPI, SSC, UART, USART
Min Supply Voltage
1.08V
USB
USB 2.0 (3)
Memory Type
FLASH, ROM
Security Features
AES, SHA, TDES, TRNG
Interface
CAN, Ethernet, LIN, SPI, UART, USB
Ethernet
10/100Mbps (1)
Frequency
536MHz

Product Parameter

Number of Timers/Counters
2
Boundary Scan
Yes
Integrated Cache
Yes
Watchdog Timer
Yes
Low Power Mode
Yes
Number of Ethernet Channels
1
Number of PWM Channels
4
Number of I2C Channels
3
Number of SPI Channels
6
Number of UART Channels
7
Bit Size
32
Data Bus Width
32b
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Core Architecture
ARM
RAM Size
128kB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Memory Size
160kB
Peripherals
DMA, LCD, POR, PWM, WDT
Format
FLOATING POINT
Core Processor
ARM® Cortex®-A5

Export Classifications & Environmental

RoHS Status
ROHS3 Compliant
REACH SVHC
No SVHC
Moisture Sensitivity Level (MSL)
3 (168 Hours)
HTSUS
8542.31.0001
JESD-609 Code
e1

Articles

With its unique properties of radiation hardening, unlimited read/write endurance, and low power consumption, MRAM is becoming the preferred choice for next-generation aerospace memory. This article will provide an in-depth analysis of MRAM's key advantages and applications in the aerospace field.

Comprehensive overview of MR25H40CDF SPI MRAM: specs, applications, case studies, and our real-stock advantages.

Key developments and expert insights in the global electronic components industry for the fourth week of June 2025.