Supply original MSP430F2112TRHBT, Embedded - Microcontrollers, by texas

Supply original MSP430F2112TRHBT, Embedded - Microcontrollers, by texas | TrustCompo Electronic

Pictures are for reference only. Please contact us for the latest pictures.

Part Number
MSP430F2112TRHBT
Internal code
TCE000009416
Package
-
Serise
MSP430F2xx
key Attributes
-
Description
IC MCU 16BIT 2KB FLASH 32VQFN
Min Quantity
1
Manufacturer
texas
Category
Integrated Circuits (ICs)
Sub Categroy
Embedded - Microcontrollers
Datasheet
-

Availability

In Stock640,114
Avaliable522,053

Price Range

QualityUnit Price
1
10
30
100
500
1,000

Due to different local policies, please contact us for the latest quotation.

Certified Quality Assurance
Responsive 24/7 Support
Free Shipping & Sample Provision
30-Day Return Policy

We are ISO 9001, AS 9120B, IOS 14001 certified, ensuring that our quality management system meets international standards. This certification guarantees that every electronic component we supply is authentic, reliable, and traceable. Our dedicated inspection team conducts rigorous quality checks to prevent counterfeit products and reduce failure rates. By adhering to these stringent quality controls, we provide our customers with peace of mind and products they can trust.

Overview

Description:
The MSP430F2121IDW is a Texas Instruments Integrated Circuits (ICs) Microcontroller with a series of MSP430F2xx. It has a 20-SOIC (0.295", 7.50mm Width) package and operates at a temperature range of -40°C ~ 85°C (TA). It has a voltage supply of 1.8 V ~ 3.6 V and a data ROM size of 256 B. It has 16 I/O and a unit weight of 0.017662 oz. It is packaged in a tube alternate packaging.
Features:
• Series: MSP430F2xx
• Supplier-Device-Package: 20-SOIC
• Operating temperature range: -40°C ~ 85°C (TA)
• Voltage-Supply-Vcc-Vdd: 1.8 V ~ 3.6 V
• Package-Case: 20-SOIC (0.295", 7.50mm Width)
• Data-ROM-Size: 256 B
• Packaging: Tube Alternate Packaging
• Number-of-I-O: 16 I/O
• Unit-Weight: 0.017662 ozApplications:
The MSP430F2121IDW is suitable for applications such as consumer electronics, industrial automation, medical devices, and automotive. It can be used for low-power applications such as battery-powered systems, wireless sensor networks, and portable devices.

Product Attribute

Part Status
Active
Radiation Hardening
NO
Surface Mount
Yes
Pbfree Code
Yes
REACH Status
REACH Unaffected
ECCN
EAR99
Lifecycle Status
ACTIVE (Last Updated: 1 day ago)
Lead Free
Lead Free
Mounting Type
Surface Mount
Number of I/O
24
Width
5mm
Length
5mm
Factory Lead Time
6 Weeks
Packaging
Tape & Reel (TR)
Number of Pins
32
Number of Terminations
32
Pin Count
32
Height
1mm
Termination
SMD/SMT
Categories
Integrated Circuits (ICs)
Peak Reflow Temperature (Cel)
260
Technology
CMOS
Manufacturer
Texas
Terminal Position
QUAD
Subcategory
Microcontrollers
Sub-Categories
Embedded - Microcontrollers
Thickness
900μm
Series
MSP430F2xx
Interface
I2C, IrDA, LIN, SCI, SPI, UART, USART
Frequency
16MHz
Operating Temperature
-40°C~105°C TA
Package / Case
32-VFQFN Exposed Pad
Weight
71.809342mg
Manufacturer's Part No.
MSP430F2112TRHBT

Product Parameter

DMA Channels
NO
Integrated Cache
NO
DAC Channels
NO
Number of Timers/Counters
2
Watchdog Timer
Yes
Boundary Scan
Yes
PWM Channels
Yes
Has ADC
Yes
Low Power Mode
Yes
Number of UART Channels
1
Number of Serial I/Os
1
Bit Size
16
Number of Programmable I/O
24
Program Memory Type
Flash
Number of A/D Converters
8
Supply Voltage-Min (Vsup)
3.3V
Data Bus Width
16b
Format
FIXED-POINT
Core Processor
MSP430
RAM (bytes)
256
Voltage - Supply (Vcc/Vdd)
1.8V~3.6V
Supply Voltage-Max (Vsup)
3.6V
Oscillator Type
Internal
RAM Size
256 x 8
Core Size
16-Bit
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Data Converter
A/D 8x10b
Connectivity
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Density
16 kb
Program Memory Size
2KB 2K x 8 + 256B
Memory Size
2kB

Export Classifications & Environmental

RoHS Status
ROHS3 Compliant
REACH SVHC
No SVHC
JESD-609 Code
e4
Moisture Sensitivity Level (MSL)
2 (1 Year)
HTSUS
8542.31.0001

Articles

This guide provides a direct comparison of HBM generations (up to HBM3e), analyzes the market landscape dominated by SK Hynix, Samsung, and Micron, and offers a crucial procurement checklist. It concludes with a practical case study, advising on capacity and bandwidth requirements (e.g., for a 175B parameter LLM), ensuring businesses can make informed decisions for their high-performance AI systems.

The Nexperia geopolitical crisis, involving legal takeover and counter-sanctions, poses the most severe recent risk to the global semiconductor supply chain, demanding immediate analysis of supply bottlenecks and price impacts for all component buyers.

With its unique properties of radiation hardening, unlimited read/write endurance, and low power consumption, MRAM is becoming the preferred choice for next-generation aerospace memory. This article will provide an in-depth analysis of MRAM's key advantages and applications in the aerospace field.

Comprehensive overview of MR25H40CDF SPI MRAM: specs, applications, case studies, and our real-stock advantages.