Supply original MSP430F2002IN, Embedded - Microcontrollers, by texas
Pictures are for reference only. Please contact us for the latest pictures.
Availability
Price Range
| Quality | Unit Price |
|---|---|
| 1 | |
| 10 | |
| 30 | |
| 100 | |
| 500 | |
| 1,000 |
Due to different local policies, please contact us for the latest quotation.
We are ISO 9001, AS 9120B, IOS 14001 certified, ensuring that our quality management system meets international standards. This certification guarantees that every electronic component we supply is authentic, reliable, and traceable. Our dedicated inspection team conducts rigorous quality checks to prevent counterfeit products and reduce failure rates. By adhering to these stringent quality controls, we provide our customers with peace of mind and products they can trust.
Overview
The MSP430F2121IDW is a Texas Instruments Integrated Circuits (ICs) Microcontroller with a series of MSP430F2xx. It has a 20-SOIC (0.295", 7.50mm Width) package and operates at a temperature range of -40°C ~ 85°C (TA). It has a voltage supply of 1.8 V ~ 3.6 V and a data ROM size of 256 B. It has 16 I/O and a unit weight of 0.017662 oz. It is packaged in a tube alternate packaging.
Features:
• Series: MSP430F2xx
• Supplier-Device-Package: 20-SOIC
• Operating temperature range: -40°C ~ 85°C (TA)
• Voltage-Supply-Vcc-Vdd: 1.8 V ~ 3.6 V
• Package-Case: 20-SOIC (0.295", 7.50mm Width)
• Data-ROM-Size: 256 B
• Packaging: Tube Alternate Packaging
• Number-of-I-O: 16 I/O
• Unit-Weight: 0.017662 ozApplications:
The MSP430F2121IDW is suitable for applications such as consumer electronics, industrial automation, medical devices, and automotive. It can be used for low-power applications such as battery-powered systems, wireless sensor networks, and portable devices.
Product Parameter
Product Attribute
Export Classifications & Environmental
Articles
This guide provides a direct comparison of HBM generations (up to HBM3e), analyzes the market landscape dominated by SK Hynix, Samsung, and Micron, and offers a crucial procurement checklist. It concludes with a practical case study, advising on capacity and bandwidth requirements (e.g., for a 175B parameter LLM), ensuring businesses can make informed decisions for their high-performance AI systems.
The Nexperia geopolitical crisis, involving legal takeover and counter-sanctions, poses the most severe recent risk to the global semiconductor supply chain, demanding immediate analysis of supply bottlenecks and price impacts for all component buyers.
With its unique properties of radiation hardening, unlimited read/write endurance, and low power consumption, MRAM is becoming the preferred choice for next-generation aerospace memory. This article will provide an in-depth analysis of MRAM's key advantages and applications in the aerospace field.
Comprehensive overview of MR25H40CDF SPI MRAM: specs, applications, case studies, and our real-stock advantages.