TrustCompo Electronic Website Logo | TrustCompo Electronic

Supply original 1-103916-7, Rectangular Connectors - Headers, Male Pins, by TE Connectivity

Supply original 1-103916-7, Rectangular Connectors - Headers, Male Pins, by TE Connectivity | TrustCompo Electronic

Pictures are for reference only. Please contact us for the latest pictures.

Part Number
1-103916-7
Internal code
TCE000000960
Package
-
Serise
AMPMODU System 50
key Attributes
-
Description
CONN HEADER VERT 100POS 1.27MM
Min Quantity
1
Manufacturer
TE Connectivity
Category
Connectors, Interconnects
Sub Categroy
Rectangular Connectors - Headers, Male Pins
Datasheet
-

Availability

In Stock299,008
Avaliable295,625

Price Range

QualityUnit Price
1
10
30
100
500
1,000

Due to different local policies, please contact us for the latest quotation.

Certified Quality Assurance
Responsive 24/7 Support
Free Shipping & Sample Provision
30-Day Return Policy

We are ISO 9001, AS 9120B, IOS 14001 certified, ensuring that our quality management system meets international standards. This certification guarantees that every electronic component we supply is authentic, reliable, and traceable. Our dedicated inspection team conducts rigorous quality checks to prevent counterfeit products and reduce failure rates. By adhering to these stringent quality controls, we provide our customers with peace of mind and products they can trust.

Product Attribute

Contact Finish Thickness - Mating
30.0μin 0.76μm
Contact Current Rating
1A
Rated Current (Signal)
1A
Sub-Categories
Rectangular Connectors - Headers, Male Pins
UL Flammability Code
94V-0
Termination
SOLDER
Part Status
Active
MIL Conformance
NO
Keyed
NO
IEC Conformance
NO
Mixed Contacts
NO
Filter Feature
NO
DIN Conformance
NO
Pbfree Code
NO
Orientation
STRAIGHT
Contact Finish - Mating
Gold
Fastening Type
Push-Pull
Manufacturer
TE Connectivity
Flammability Rating
UL94 V-0
Material Flammability Rating
UL94 V-0
Shrouding
Unshrouded
Contact Type
Male Pin
Number Of PCB Rows
2
Number of Rows
2
Categories
Connectors, Interconnects
PCB Contact Pattern
RECTANGULAR
PCB Mounting Orientation
Vertical
Mounting Type
Through Hole
Mount
Through Hole
Insulation Material
Thermoplastic
Housing Color
BLACK
Approval Agency
CSA
Number of Positions Loaded
All
ELV
Compliant
Reliability
COMMERCIAL
Contact Shape
Square
Plating Thickness
30μin
Style
Board to Board or Cable
Number of Conductors
ONE
ECCN
EAR99
Factory Lead Time
19 Weeks
Insulation Resistance
5000000000Ohm
Contact Material
Copper Alloy
Contact Finish Thickness - Post
150.0μin 3.81μm
Contact Length - Post
0.100 2.54mm
Insulation Height
0.100 2.54mm
Lead Length
2.54mm
Mating Post Length
2.54mm
Connector Type
Header
Contact Finish - Post
Tin-Lead
Mating Information
MULTIPLE MATING PARTS AVAILABLE
HTS Code
8536.69.40.40
Packaging
Tube
REACH Status
REACH Affected
Row Spacing - Mating
0.100 (2.54mm)
Lead Free
Contains Lead
Number of Positions
100
Operating Temperature
-65°C~105°C
Voltage - Rated AC
30V
Max Voltage Rating (AC)
30V
Operating Supply Voltage
30V
Contact Length - Mating
0.125 3.18mm
Applications
Automotive, General Purpose, Medical, Telecommunications
Dielectric Withstanding Voltage
300VAC V
Pitch - Mating
0.050 1.27mm
Mating Contact Pitch
0.05 inch
Published
2005
Insertion Force-Max
1.39 N
Series
AMPMODU System 50
Voltage - Rated
30VAC
PCB Thickness
1.397mm
Body Breadth
0.196 inch
Length
63.88mm
Depth
4.97mm
Manufacturer's Part No.
1-103916-7
Width
4.98mm
Overall Contact Length
0.325 8.26mm

Export Classifications & Environmental

Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN Code
EAR99
HTSUS
8536.69.4040
JESD-609 Code
e0
RoHS Status
Not applicable

Articles

HBM Technology Leads the AI Era: Selection and Procurement Guide

This guide provides a direct comparison of HBM generations (up to HBM3e), analyzes the market landscape dominated by SK Hynix, Samsung, and Micron, and offers a crucial procurement checklist. It concludes with a practical case study, advising on capacity and bandwidth requirements (e.g., for a 175B parameter LLM), ensuring businesses can make informed decisions for their high-performance AI systems.

Supply Chain Earthquake! In-Depth Analysis of the Nexperia Takeover and Material Price Alert (TrustCompo Exclusive)

The Nexperia geopolitical crisis, involving legal takeover and counter-sanctions, poses the most severe recent risk to the global semiconductor supply chain, demanding immediate analysis of supply bottlenecks and price impacts for all component buyers.

Core Advantages of MRAM in Aerospace: Radiation Hardening, Unlimited Read/Write, and Low Power Consumption

With its unique properties of radiation hardening, unlimited read/write endurance, and low power consumption, MRAM is becoming the preferred choice for next-generation aerospace memory. This article will provide an in-depth analysis of MRAM's key advantages and applications in the aerospace field.

MR25H40CDF SPI MRAM – Product Overview & Stock Advantages

Comprehensive overview of MR25H40CDF SPI MRAM: specs, applications, case studies, and our real-stock advantages.