Supply original 147324-9, Rectangular Connectors - Headers, Male Pins, by TE Connectivity

Supply original 147324-9, Rectangular Connectors - Headers, Male Pins, by TE Connectivity | TrustCompo Electronic

Pictures are for reference only. Please contact us for the latest pictures.

Part Number
147324-9
Internal code
TCE000000934
Package
-
Serise
AMPMODU MTE
key Attributes
-
Description
CONN HEADER SMD R/A 10POS 2.54MM
Min Quantity
1
Manufacturer
TE Connectivity
Category
Connectors, Interconnects
Sub Categroy
Rectangular Connectors - Headers, Male Pins
Datasheet
-

Availability

In Stock839,257
Avaliable410,434

Price Range

QualityUnit Price
1
10
30
100
500
1,000

Due to different local policies, please contact us for the latest quotation.

Certified Quality Assurance
Responsive 24/7 Support
Free Shipping & Sample Provision
30-Day Return Policy

We are ISO 9001, AS 9120B, IOS 14001 certified, ensuring that our quality management system meets international standards. This certification guarantees that every electronic component we supply is authentic, reliable, and traceable. Our dedicated inspection team conducts rigorous quality checks to prevent counterfeit products and reduce failure rates. By adhering to these stringent quality controls, we provide our customers with peace of mind and products they can trust.

Product Attribute

Sub-Categories
Rectangular Connectors - Headers, Male Pins
UL Flammability Code
94V-0
Termination
SOLDER
Number of Positions
10
Total Number of Contacts
10
Part Status
Active
MIL Conformance
NO
Filter Feature
NO
Pbfree Code
NO
DIN Conformance
NO
Mixed Contacts
NO
IEC Conformance
NO
Manufacturer
TE Connectivity
Flammability Rating
UL94 V-0
Material Flammability Rating
UL94 V-0
Contact Type
Male Pin
Categories
Connectors, Interconnects
PCB Contact Pattern
RECTANGULAR
Insulation Material
Thermoplastic
Insulation Color
BLACK
Approval Agency
CSA
PCB Mount Alignment
Without
Contact Gender
MALE
Number of Positions Loaded
All
Contact Material
Brass
Reliability
COMMERCIAL
Contact Shape
Square
Style
Board to Board or Cable
Number of Conductors
ONE
Additional Feature
POLARIZED
ECCN
EAR99
Number of Rows
1
Number Of PCB Rows
1
Mating Retention
With
Pitch - Mating
0.100 2.54mm
Connector Type
Header
Polarization Key
POLARIZED HOUSING
Contact Finish - Mating
Tin-Lead
PCB Mounting Orientation
Right Angle
Orientation
Right Angle
Mating Information
MULTIPLE MATING PARTS AVAILABLE
Contact Current Rating
3A
Current Rating
3A
Rated Current (Signal)
3A
REACH Status
REACH Affected
Lead Free
Contains Lead
Insulation Resistance
5GOhm
ELV
Non-Compliant
Contact Finish Thickness - Post
100.0μin 2.54μm
Contact Finish Thickness - Mating
100.0μin 2.54μm
Operating Temperature
-65°C~105°C
Shrouding
Shrouded - 4 Wall
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Mount
Surface Mount
Withdrawl Force-Min
.278 N
Applications
Automotive, General Purpose, Medical, Telecommunications
Series
AMPMODU MTE
Insulation Height
0.200 5.08mm
Height
13.59mm
Mating Post Length
5.842mm
Row Spacing
2.54 mm
Fastening Type
Latch Holder
Dielectric Withstanding Voltage
600VAC V
Contact Length - Mating
0.230 5.84mm
Length - Tail
3.048mm
Durability
30 Cycles
Packaging
Tape & Reel (TR)
Contact Plating
Lead, Tin
Plating Thickness
5.08μm
Mounting Type
Surface Mount, Right Angle
Published
2010
Feature
Board Lock, Keying Slot, Solder Retention
Body Breadth
0.262 inch
Body Depth
0.535 inch
Length
30.48mm
Factory Lead Time
42 Weeks
Insertion Force-Max
3.892 N
Manufacturer's Part No.
147324-9

Export Classifications & Environmental

Moisture Sensitivity Level (MSL)
1 (Unlimited)
HTSUS
8536.69.4040
RoHS Status
RoHS non-compliant
JESD-609 Code
e0

Articles

This guide provides a direct comparison of HBM generations (up to HBM3e), analyzes the market landscape dominated by SK Hynix, Samsung, and Micron, and offers a crucial procurement checklist. It concludes with a practical case study, advising on capacity and bandwidth requirements (e.g., for a 175B parameter LLM), ensuring businesses can make informed decisions for their high-performance AI systems.

The Nexperia geopolitical crisis, involving legal takeover and counter-sanctions, poses the most severe recent risk to the global semiconductor supply chain, demanding immediate analysis of supply bottlenecks and price impacts for all component buyers.

With its unique properties of radiation hardening, unlimited read/write endurance, and low power consumption, MRAM is becoming the preferred choice for next-generation aerospace memory. This article will provide an in-depth analysis of MRAM's key advantages and applications in the aerospace field.

Comprehensive overview of MR25H40CDF SPI MRAM: specs, applications, case studies, and our real-stock advantages.