Supply original 1-440054-4, Rectangular Connectors - Headers, Male Pins, by TE Connectivity

Supply original 1-440054-4, Rectangular Connectors - Headers, Male Pins, by TE Connectivity | TrustCompo Electronic

Pictures are for reference only. Please contact us for the latest pictures.

Part Number
1-440054-4
Internal code
TCE000000320
Package
-
Serise
High Performance Interconnect (HPI)
key Attributes
-
Description
CONN HEADER VERT 14POS 2MM
Min Quantity
1
Manufacturer
TE Connectivity
Category
Connectors, Interconnects
Sub Categroy
Rectangular Connectors - Headers, Male Pins
Datasheet
-

Availability

In Stock959,011
Avaliable62,939

Price Range

QualityUnit Price
1
10
30
100
500
1,000

Due to different local policies, please contact us for the latest quotation.

Certified Quality Assurance
Responsive 24/7 Support
Free Shipping & Sample Provision
30-Day Return Policy

We are ISO 9001, AS 9120B, IOS 14001 certified, ensuring that our quality management system meets international standards. This certification guarantees that every electronic component we supply is authentic, reliable, and traceable. Our dedicated inspection team conducts rigorous quality checks to prevent counterfeit products and reduce failure rates. By adhering to these stringent quality controls, we provide our customers with peace of mind and products they can trust.

Product Attribute

Contact Finish - Mating
Tin
Sub-Categories
Rectangular Connectors - Headers, Male Pins
UL Flammability Code
94V-0
Part Status
Active
IEC Conformance
NO
Radiation Hardening
NO
MIL Conformance
NO
Filter Feature
NO
Mixed Contacts
NO
DIN Conformance
NO
Contact Style
STRAIGHT
Pitch - Mating
0.079 2.00mm
Manufacturer
TE Connectivity
Flammability Rating
UL94 V-0
Material Flammability Rating
UL94 V-0
Contact Type
Male Pin
Categories
Connectors, Interconnects
PCB Contact Pattern
RECTANGULAR
PCB Mounting Orientation
Vertical
Mounting Type
Through Hole
Mount
Through Hole
Mating Retention
Without
Contact Gender
MALE
Number of Positions Loaded
All
ELV
Compliant
Contact Material
Brass
Reliability
COMMERCIAL
Contact Shape
Square
Mating Contact Pitch
0.079 inch
Number of Conductors
ONE
Housing Material
Nylon
Circuit Application
Signal
ECCN
EAR99
Number of Rows
1
Number Of PCB Rows
1
Operating Supply Voltage
250V
Contact Finish Thickness - Post
80.0μin 2.03μm
Contact Finish Thickness - Mating
80.0μin 2.03μm
PCB Mount Retention
With
Packaging
Bulk
Connector Type
Header
Polarization Key
POLARIZED HOUSING
Style
Board to Cable/Wire
HTS Code
8536.69.40.40
Rated Current (Signal)
3A
Contact Current Rating
3A
Current Rating
3A
Insulation Height
0.238 6.05mm
REACH Status
Vendor Undefined
Reference Standard
UL
Shrouding
Shrouded - 4 Wall
Insulation Diameter
900 μm
Published
2006
Insulation Color
Natural
Factory Lead Time
13 Weeks
Lifecycle Status
ACTIVE (Last Updated: 5 days ago)
Contact Resistance
20mOhm
Insulation Material
Polyamide (PA66), Nylon 6/6
Length
29.9974mm
Number of Positions
14
Wire/Cable Type
Discrete
Durability
30 Cycles
Wire/Cable Gauge
24 AWG
Width
4.7mm
Depth
4.7mm
Lead Length
3.4036mm
PCB Thickness
1.6mm
Series
High Performance Interconnect (HPI)
Length - Tail
3.4mm
Contact Length - Post
0.134 3.40mm
Operating Temperature
-25°C~85°C
Contact Plating
Brass, Tin
Applications
Automotive, General Purpose, Industrial, Medical
Termination
Press-Fit, Solder
Contact Length - Mating
0.132 3.35mm
Manufacturer's Part No.
1-440054-4
Max Voltage Rating (AC)
150V
Mating Post Length
3.3274mm
Height
6.0452mm
Overall Contact Length
0.335 8.51mm

Export Classifications & Environmental

JESD-609 Code
e3
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN Code
EAR99
HTSUS
8536.69.4040
RoHS Status
ROHS3 Compliant

Articles

This guide provides a direct comparison of HBM generations (up to HBM3e), analyzes the market landscape dominated by SK Hynix, Samsung, and Micron, and offers a crucial procurement checklist. It concludes with a practical case study, advising on capacity and bandwidth requirements (e.g., for a 175B parameter LLM), ensuring businesses can make informed decisions for their high-performance AI systems.

The Nexperia geopolitical crisis, involving legal takeover and counter-sanctions, poses the most severe recent risk to the global semiconductor supply chain, demanding immediate analysis of supply bottlenecks and price impacts for all component buyers.

With its unique properties of radiation hardening, unlimited read/write endurance, and low power consumption, MRAM is becoming the preferred choice for next-generation aerospace memory. This article will provide an in-depth analysis of MRAM's key advantages and applications in the aerospace field.

Comprehensive overview of MR25H40CDF SPI MRAM: specs, applications, case studies, and our real-stock advantages.