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XC1765ESO8I Memory - Configuration Proms for FPGAs by Xilinx

XC1765ESO8I is a Memory - Configuration Proms for FPGAs from Xilinx in SOP packaging. It is commonly reviewed for IC SER CFG PROM 65K 8-SOIC. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

In StockDatasheet

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XC1765ESO8I Memory - Configuration Proms for FPGAs by Xilinx | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

XC1765ESO8I

Internal code

TCE000121033

Package

SOP

Manufacturer
Xilinx

Key specifications

Series

-

Min Quantity

1

Description

IC SER CFG PROM 65K 8-SOIC

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for XC1765ESO8I before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: XC1765ESO8I
  • Package to verify: SOP

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Technical parameters

Parameters

Compare grouped XC1765ESO8I parameters from Xilinx, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Attribute

    Categories

    Integrated Circuits (ICs)

  • Product Attribute

    REACH Compliance Code

    not_compliant

  • Product Attribute

    Peak Reflow Temperature (Cel)

    225

  • Product Attribute

    Width

    3.937mm

  • Product Attribute

    Manufacturer

    Xilinx

  • Product Attribute

    Sub-Categories

    Memory - Configuration Proms for FPGAs

XC1765ESO8I Product Attribute
ParameterValue
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
REACH Compliance Code

Indicates the component's compliance status with the EU REACH regulation. Buyers should verify this code against the manufacturer's declaration to ensure restricted substances are within allowable limits for their target market.

not_compliant
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

225
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

3.937mm
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Xilinx
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Memory - Configuration Proms for FPGAs
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

XC1765ESO8I
Additional Feature

Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

XC1765E
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

4.9276mm
XC1765ESO8I Package Parameter
ParameterValue
Height Seated (Max)

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.

1.7272mm
XC1765ESO8I Product Parameter
ParameterValue
Supply Current-Max

Maximum current drawn from the power supply under specified operating conditions. Use this to estimate power dissipation and design your power supply and thermal management. Always check the datasheet for test conditions, as current can vary with voltage, frequency, and load.

0.01mA

Datasheet preview

Datasheet PDF viewer

Preview the XC1765ESO8I datasheet from Xilinx to check package, electrical characteristics, application notes, and document evidence before RFQ.

Xilinx

XC1765ESO8I

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Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for XC1765ESO8I. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact XC1765ESO8I ordering code, packaging, stock, datasheet, and replacement path.

What does XC1765ESO8I mean?

XC1765ESO8I is the exact ordering code listed for a Memory - Configuration Proms for FPGAs component from Xilinx. The current package reference is SOP, with listed context including IC SER CFG PROM 65K 8-SOIC. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the XC1765ESO8I ordering code?

Treat XC1765ESO8I as the full ordering code during RFQ and engineering review. Confirm the listed SOP package, manufacturer documentation from Xilinx, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is XC1765ESO8I supplied in?

XC1765ESO8I is currently listed with package reference SOP from Xilinx. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is XC1765ESO8I in stock at TrustCompo?

This page currently displays 1 public stock records for XC1765ESO8I with 10 listed pieces. Before ordering, confirm the package (SOP), required quantity, live availability, lead time, final price, date code, MOQ, packaging evidence, and RFQ documentation.

Where can I compare XC1765ESO8I alternatives?

A mapped alternative list is not currently published for XC1765ESO8I. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.