XC17S50XLPD8C Memory - Configuration Proms for FPGAs by Xilinx
XC17S50XLPD8C is a Memory - Configuration Proms for FPGAs from Xilinx in DIP packaging. It is commonly reviewed for Memory - Configuration Proms for FPGAs. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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Key specifications
- Part Number
XC17S50XLPD8C
- Internal code
TCE000120917
- Package
DIP
- Manufacturer
- Xilinx
Key specifications
- Series
-
- Min Quantity
1
- Category
- Integrated Circuits (ICs)
- Sub Category
- Memory - Configuration Proms for FPGAs
- Description
-
- key Attributes
-
Trust signals
Quality and trust signals
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for XC17S50XLPD8C before RFQ, PO release, and shipment planning.
- 1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
- 2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
- 3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
- 4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
- Exact MPN confirmed: XC17S50XLPD8C
- Package to verify: DIP
Commercial confirmation
- Live stock and lead time confirmed by RFQ
- Final price and tax terms confirmed before PO release
Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Technical parameters
Parameters
Compare grouped XC17S50XLPD8C parameters from Xilinx, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Attribute
Categories
Integrated Circuits (ICs)
Product Attribute
Manufacturer
Xilinx
Product Attribute
Sub-Categories
Memory - Configuration Proms for FPGAs
Product Attribute
Manufacturer'S Part No.
XC17S50XLPD8C
| Parameter | Value |
|---|---|
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Xilinx |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Memory - Configuration Proms for FPGAs |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | XC17S50XLPD8C |
Notice documents
PCN / product notice documents
0 documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for XC17S50XLPD8C. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
Recommended products
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XC17S150XLPD8C198 purchasedDIPIn StockCONFIG MEMORY, 1M BITS, SERIAL ALIAS: XC17S150LPC
Reference price$29.41
Common questions
Product FAQ
Targeted answers for buyers verifying the exact XC17S50XLPD8C ordering code, packaging, stock, datasheet, and replacement path.
What does XC17S50XLPD8C mean?
XC17S50XLPD8C is the exact ordering code listed for a Memory - Configuration Proms for FPGAs component from Xilinx. The current package reference is DIP, with listed context including -. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the XC17S50XLPD8C ordering code?
Treat XC17S50XLPD8C as the full ordering code during RFQ and engineering review. Confirm the listed DIP package, manufacturer documentation from Xilinx, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is XC17S50XLPD8C supplied in?
XC17S50XLPD8C is currently listed with package reference DIP from Xilinx. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is XC17S50XLPD8C currently available?
XC17S50XLPD8C is currently marked with stock availability on this page. Before ordering, confirm the package (DIP), listed stock (62690), available quantity (59404), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare XC17S50XLPD8C alternatives?
A mapped alternative list is not currently published for XC17S50XLPD8C. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.