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XC17S40XLPD8C Memory - Configuration Proms for FPGAs by Xilinx

XC17S40XLPD8C is a Memory - Configuration Proms for FPGAs from Xilinx in DIP packaging. It is commonly reviewed for IC PROM PROG C-TEMP 3.3V 8-DIP ALIAS: XC17S40LPC. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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XC17S40XLPD8C Memory - Configuration Proms for FPGAs by Xilinx | TrustCompo
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Key specifications

Part Number

XC17S40XLPD8C

Internal code

TCE000120873

Package

DIP

Manufacturer
Xilinx

Key specifications

Series

-

Min Quantity

1

Description

IC PROM PROG C-TEMP 3.3V 8-DIP ALIAS: XC17S40LPC

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for XC17S40XLPD8C before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: XC17S40XLPD8C
  • Package to verify: DIP

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Technical parameters

Parameters

Compare grouped XC17S40XLPD8C parameters from Xilinx, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Parameter

    Supply Current-Max

    0.005mA

  • Product Parameter

    Voltage - Supply (Vcc/Vdd)

    400kb

  • Product Parameter

    Integrated Cache

    323 kb

  • Export Classifications & Environmental

    Moisture Sensitivity Level (MSL)

    Not Applicable

  • Product Attribute

    Categories

    Integrated Circuits (ICs)

  • Product Attribute

    Surface Mount

    NO

XC17S40XLPD8C Product Parameter
ParameterValue
Supply Current-Max

Maximum current drawn from the power supply under specified operating conditions. Use this to estimate power dissipation and design your power supply and thermal management. Always check the datasheet for test conditions, as current can vary with voltage, frequency, and load.

0.005mA
Voltage - Supply (Vcc/Vdd)

Supply voltage is the DC voltage required to power the device, typically denoted as Vcc for bipolar or Vdd for CMOS circuits. It defines the operating range and logic levels. Designers must ensure the supply is within the specified limits to guarantee proper functionality and avoid damage.

400kb
Integrated Cache

Shows whether the component includes an integrated cache memory to speed up data access for the processor. Compare cache presence and size to assess performance for real-time or high-throughput tasks. Verify details in the datasheet.

323 kb
XC17S40XLPD8C Export Classifications & Environmental
ParameterValue
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Not Applicable
XC17S40XLPD8C Product Attribute
ParameterValue
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Surface Mount

Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process.

NO
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Xilinx
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Memory - Configuration Proms for FPGAs
Maximum Input Frequency

Specifies the highest frequency signal that can be applied to the input without causing malfunction or performance degradation. Compare this value with your system's operating frequency to ensure reliable operation. Always verify against the datasheet for your specific part.

MEMORY CIRCUIT
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

9.3599mm
Memory Organization

Specifies the internal arrangement of memory cells, typically expressed as words by bits. This affects how data is accessed and stored. Engineers compare this to ensure compatibility with their system's bus width and addressing scheme. Always verify against the datasheet for exact configuration.

330696X1
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

XC17S40XL
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

XC17S40XLPD8C
XC17S40XLPD8C Package Parameter
ParameterValue
Height Seated (Max)

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.

4.5974mm

Datasheet preview

Datasheet PDF viewer

Preview the XC17S40XLPD8C datasheet from Xilinx to check package, electrical characteristics, application notes, and document evidence before RFQ.

Xilinx

XC17S40XLPD8C

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Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for XC17S40XLPD8C. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact XC17S40XLPD8C ordering code, packaging, stock, datasheet, and replacement path.

What does XC17S40XLPD8C mean?

XC17S40XLPD8C is the exact ordering code listed for a Memory - Configuration Proms for FPGAs component from Xilinx. The current package reference is DIP, with listed context including IC PROM PROG C-TEMP 3.3V 8-DIP ALIAS: XC17S40LPC. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the XC17S40XLPD8C ordering code?

Treat XC17S40XLPD8C as the full ordering code during RFQ and engineering review. Confirm the listed DIP package, manufacturer documentation from Xilinx, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is XC17S40XLPD8C supplied in?

XC17S40XLPD8C is currently listed with package reference DIP from Xilinx. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is XC17S40XLPD8C currently available?

XC17S40XLPD8C is currently marked with stock availability on this page. Before ordering, confirm the package (DIP), listed stock (87013), available quantity (69908), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare XC17S40XLPD8C alternatives?

A mapped alternative list is not currently published for XC17S40XLPD8C. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.