
CONFIG MEMORY, 1M BITS, SERIAL ALIAS: XC17S150LPC
XC17S50APC is a Memory - Configuration Proms for FPGAs from Xilinx in DIP packaging. It is commonly reviewed for IC PROM SER 50000 C-TEMP 8-DIP ALIAS: XC17S50APD8C. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

XC17S50APC
TCE000120848
DIP
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1
IC PROM SER 50000 C-TEMP 8-DIP ALIAS: XC17S50APD8C
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Trust signals
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
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Aerospace-focused distribution controls for traceability and reliability.
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RFQ checklist
Confirm the core buying details for XC17S50APC before RFQ, PO release, and shipment planning.
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Technical parameters
Compare grouped XC17S50APC parameters from Xilinx, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Attribute
Categories
Integrated Circuits (ICs)
Product Attribute
Surface Mount
NO
Product Attribute
Peak Reflow Temperature (Cel)
225
Product Attribute
Manufacturer
Xilinx
Product Attribute
Standby Current-Max
0.001A
Product Attribute
Sub-Categories
Memory - Configuration Proms for FPGAs
| Parameter | Value |
|---|---|
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Surface Mount Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process. | NO |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | 225 |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Xilinx |
Standby Current-Max Maximum current drawn by the component when in standby or sleep mode. Lower values extend battery life in portable designs. Verify against datasheet conditions, as standby current can vary with supply voltage and temperature. | 0.001A |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Memory - Configuration Proms for FPGAs |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 9.3599mm |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | XC17S50A |
Memory Organization Specifies the internal arrangement of memory cells, typically expressed as words by bits. This affects how data is accessed and stored. Engineers compare this to ensure compatibility with their system's bus width and addressing scheme. Always verify against the datasheet for exact configuration. | 559200X1 |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | XC17S50APD8C |
| Parameter | Value |
|---|---|
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | Not Applicable |
| Parameter | Value |
|---|---|
Voltage - Supply (Vcc/Vdd) Supply voltage is the DC voltage required to power the device, typically denoted as Vcc for bipolar or Vdd for CMOS circuits. It defines the operating range and logic levels. Designers must ensure the supply is within the specified limits to guarantee proper functionality and avoid damage. | 500kb |
| Parameter | Value |
|---|---|
Height Seated (Max) Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts. | 4.5974mm |
Datasheet preview
Preview the XC17S50APC datasheet from Xilinx to check package, electrical characteristics, application notes, and document evidence before RFQ.
Notice documents
No public product notice document is currently displayed for XC17S50APC. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
Explore related Memory - Configuration Proms for FPGAs products to compare fit, stock status, datasheets, and sourcing options.

CONFIG MEMORY, 1M BITS, SERIAL ALIAS: XC17S150LPC





Common questions
Targeted answers for buyers verifying the exact XC17S50APC ordering code, packaging, stock, datasheet, and replacement path.
XC17S50APC is the exact ordering code listed for a Memory - Configuration Proms for FPGAs component from Xilinx. The current package reference is DIP, with listed context including IC PROM SER 50000 C-TEMP 8-DIP ALIAS: XC17S50APD8C. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
Treat XC17S50APC as the full ordering code during RFQ and engineering review. Confirm the listed DIP package, manufacturer documentation from Xilinx, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
XC17S50APC is currently listed with package reference DIP from Xilinx. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
XC17S50APC is currently marked with stock availability on this page. Before ordering, confirm the package (DIP), listed stock (10865), available quantity (10865), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
A mapped alternative list is not currently published for XC17S50APC. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.