XC17S30XLPD8C Memory - Configuration Proms for FPGAs by Xilinx
XC17S30XLPD8C is a Memory - Configuration Proms for FPGAs from Xilinx in DIP packaging. It is commonly reviewed for IC PROM PROG C-TEMP 3.3V 8-DIP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for XC17S30XLPD8C before RFQ, PO release, and shipment planning.
1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
Exact MPN confirmed: XC17S30XLPD8C
Package to verify: DIP
Commercial confirmation
Live stock and lead time confirmed by RFQ
Final price and tax terms confirmed before PO release
Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for XC17S30XLPD8C from Xilinx, including product identity, application fit, package notes, and purchasing considerations.
XC17S200APD8C Description
The General Purpose Timer Unit blocks GPT1 and GPT2 have very flexible multifunctional timer structures which may be used for timing, event counting, pulse width measurement, pulse generation, frequency multiplication, and other purposes. They incorporate five 16-bit timers that are grouped into the two timer blocks GPT1 and GPT2. Each timer in each block may operate independently in a number of different modes such as gated timer or counter mode, or may be concatenated with another timer of the same block. Each block has alternate input/output functions and specific interrupts associated with it.Block GPT1 contains three timers/counters: The core timer T3 and the two auxiliary timers T2 and T4. The maximum resolution is fGPT/4. The auxiliary timers of GPT1 may optionally be configured as reload or capture registers for the core timer. These registers are listed in Section 14.1.6.
XC17S200APD8C Features
• fGPT/4 maximum resolution • 3 independent timers/counters • Timers/counters can be concatenated • 4 operating modes:– Timer Mode– Gated Timer Mode– Counter Mode– Incremental Interface Mode • Reload and Capture functionality • Separate interrupt linesBlock GPT2 contains two timers/counters: The core timer T6 and the auxiliary timer T5. The maximum resolution is fGPT/2. An additional Capture/Reload register (CAPREL) supports capture and reload operation with extended functionality. These registers are listed in Section 14.2.7. The core timer T6 may be concatenated with timers of the CAPCOM units (T0, T1, T7, and T8). The following list summarizes the features which are supported: • fGPT/2 maximum resolution • 2 independent timers/counters • Timers/counters can be concatenated • 3 operating modes:– Timer Mode– Gated Timer Mode– Counter Mode • Extended capture/reload functions via 16-bit capture/reload register CAPREL • Separate interrupt lines
Technical parameters
Parameters
Compare grouped XC17S30XLPD8C parameters from Xilinx, including package, series, key attributes, and technical values used for engineering and sourcing review.
Package Parameter
Height Seated (Max)
4.5974mm
Export Classifications & Environmental
Moisture Sensitivity Level (MSL)
Not Applicable
Product Attribute
Categories
Integrated Circuits (ICs)
Product Attribute
REACH Compliance Code
not_compliant
Product Attribute
Surface Mount
NO
Product Attribute
Manufacturer
Xilinx
XC17S30XLPD8C Package Parameter
Parameter
Value
Height Seated (Max)
Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
Not Applicable
XC17S30XLPD8C Product Attribute
Parameter
Value
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
REACH Compliance Code
Indicates the component's compliance status with the EU REACH regulation. Buyers should verify this code against the manufacturer's declaration to ensure restricted substances are within allowable limits for their target market.
not_compliant
Surface Mount
Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process.
NO
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
Xilinx
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Memory - Configuration Proms for FPGAs
Maximum Input Frequency
Specifies the highest frequency signal that can be applied to the input without causing malfunction or performance degradation. Compare this value with your system's operating frequency to ensure reliable operation. Always verify against the datasheet for your specific part.
MEMORY CIRCUIT
Length
Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.
9.3599mm
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
XC17S30XL
Manufacturer'S Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
XC17S30XLPD8C
XC17S30XLPD8C Product Parameter
Parameter
Value
Supply Current-Max
Maximum current drawn from the power supply under specified operating conditions. Use this to estimate power dissipation and design your power supply and thermal management. Always check the datasheet for test conditions, as current can vary with voltage, frequency, and load.
0.005mA
Voltage - Supply (Vcc/Vdd)
Supply voltage is the DC voltage required to power the device, typically denoted as Vcc for bipolar or Vdd for CMOS circuits. It defines the operating range and logic levels. Designers must ensure the supply is within the specified limits to guarantee proper functionality and avoid damage.
300kb
Datasheet preview
Datasheet PDF viewer
Preview the XC17S30XLPD8C datasheet from Xilinx to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for XC17S30XLPD8C. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Targeted answers for buyers verifying the exact XC17S30XLPD8C ordering code, packaging, stock, datasheet, and replacement path.
What does XC17S30XLPD8C mean?
XC17S30XLPD8C is the exact ordering code listed for a Memory - Configuration Proms for FPGAs component from Xilinx. The current package reference is DIP, with listed context including IC PROM PROG C-TEMP 3.3V 8-DIP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the XC17S30XLPD8C ordering code?
Treat XC17S30XLPD8C as the full ordering code during RFQ and engineering review. Confirm the listed DIP package, manufacturer documentation from Xilinx, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is XC17S30XLPD8C supplied in?
XC17S30XLPD8C is currently listed with package reference DIP from Xilinx. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is XC17S30XLPD8C currently available?
XC17S30XLPD8C is currently marked with stock availability on this page. Before ordering, confirm the package (DIP), listed stock (10854), available quantity (10854), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare XC17S30XLPD8C alternatives?
A mapped alternative list is not currently published for XC17S30XLPD8C. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.