
Samsung 8GB eMMC 5.1 managed NAND flash memory device.
KLM8G1GEME-B041 is a eMMC from Samsung in FBGA packaging. It is commonly reviewed for Legacy eMMC managed NAND memory device. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

KLM8G1GEME-B041
TCE000040772
FBGA
eMMC
1
Legacy eMMC managed NAND memory device.
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Trust signals
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
Quality management processes for more consistent sourcing and handling.
Aerospace-focused distribution controls for traceability and reliability.
Environmental management discipline across warehouse and operating workflows.
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Confirm the core buying details for KLM8G1GEME-B041 before RFQ, PO release, and shipment planning.
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Product overview
Review the sourcing context for KLM8G1GEME-B041 from Samsung, including product identity, application fit, package notes, and purchasing considerations.
KLM8G1GEME-B041 is a Samsung legacy eMMC managed NAND device used as a sourcing anchor for industrial and embedded maintenance programs. Confirm exact capacity, package code, lifecycle status, date code, and packaging condition before purchase.
Technical parameters
Compare grouped KLM8G1GEME-B041 parameters from Samsung, including package, series, key attributes, and technical values used for engineering and sourcing review.
Electrical And Mechanical
Target Application
Legacy embedded storage
Product Attribute
Mounting Type
Surface Mount
Product Attribute
ECCN
Confirm before export
Product Attribute
Package / Case
FBGA
Product Attribute
Memory Type
eMMC
Product Attribute
Interface
eMMC
| Parameter | Value |
|---|---|
Target Application Specifies the intended use case for the component, such as automotive, industrial, or consumer electronics. Helps engineers select parts that meet environmental and reliability requirements. Always cross-check with the datasheet for specific application notes. | Legacy embedded storage |
| Parameter | Value |
|---|---|
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | Confirm before export |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | FBGA |
Memory Type Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed. | eMMC |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | eMMC |
Lifecycle Status Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime. | Verify before purchase |
| Parameter | Value |
|---|---|
Capacity Total memory capacity of the module, typically expressed in megabytes or gigabytes. This is a primary selection criterion for system memory upgrades. Verify that the capacity is supported by the motherboard and operating system, and check for any limitations on total memory per channel. | 8GB |
| Parameter | Value |
|---|---|
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | Confirm before export |
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | Verify before purchase |
Datasheet preview
Preview the KLM8G1GEME-B041 datasheet from Samsung to check package, electrical characteristics, application notes, and document evidence before RFQ.
Notice documents
No public product notice document is currently displayed for KLM8G1GEME-B041. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
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Common questions
Targeted answers for buyers verifying the exact KLM8G1GEME-B041 ordering code, packaging, stock, datasheet, and replacement path.
KLM8G1GEME-B041 is the exact ordering code listed for a eMMC component from Samsung. The current package reference is FBGA, with listed context including Legacy eMMC managed NAND memory device.. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
Treat KLM8G1GEME-B041 as the full ordering code during RFQ and engineering review. Confirm the listed FBGA package, manufacturer documentation from Samsung, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
KLM8G1GEME-B041 is currently listed with package reference FBGA from Samsung. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
KLM8G1GEME-B041 is currently marked with stock availability on this page. Before ordering, confirm the package (FBGA), listed stock (68685), available quantity (38370), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
A mapped alternative list is not currently published for KLM8G1GEME-B041. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.