
Samsung 8GB eMMC 5.1 managed NAND flash memory device.
THGBMNG5D1LBAIL is a eMMC from Kioxia in 153-WFBGA / FBGA-153 (11.5 x 13 mm) packaging. It is commonly reviewed for Toshiba Memory / Kioxia legacy 4GB e-MMC 5.0 managed NAND flash module in 153-WFBGA package. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

THGBMNG5D1LBAIL
TCE000120412
153-WFBGA / FBGA-153 (11.5 x 13 mm)
Toshiba / Kioxia e-MMC
1
Toshiba Memory / Kioxia legacy 4GB e-MMC 5.0 managed NAND flash module in 153-WFBGA package.
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RFQ checklist
Confirm the core buying details for THGBMNG5D1LBAIL before RFQ, PO release, and shipment planning.
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Product overview
Review the sourcing context for THGBMNG5D1LBAIL from Kioxia, including product identity, application fit, package notes, and purchasing considerations.
THGBMNG5D1LBAIL is a legacy Toshiba Memory / Kioxia e-MMC managed NAND flash module for embedded boot and storage designs. Public distributor records identify it as a 32Gbit / 4GB eMMC device in a 153-WFBGA package with 200MHz class clock support, 2.7V to 3.6V VCC, VCCQ operation at either 1.8V or 3.3V class depending on host mode, and -25C to +85C operating temperature. Buyers should treat it as a lifecycle-sensitive eMMC line: confirm package, host boot behavior, EXT_CSD fields, firmware expectations, date code, tray condition, and source traceability before purchase or substitution.
Technical parameters
Compare grouped THGBMNG5D1LBAIL parameters from Kioxia, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Attribute
Mounting Type
Surface Mount
Product Attribute
Memory Type
Managed NAND eMMC
Product Attribute
Operating Temperature
-25C to +85C
Product Attribute
Package / Case
153-WFBGA / FBGA-153
Product Attribute
Series
Toshiba / Kioxia e-MMC
Product Attribute
Lifecycle Status
Obsolete / EOL in public distributor records; confirm current source before PO
| Parameter | Value |
|---|---|
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Memory Type Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed. | Managed NAND eMMC |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -25C to +85C |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 153-WFBGA / FBGA-153 |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | Toshiba / Kioxia e-MMC |
Lifecycle Status Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime. | Obsolete / EOL in public distributor records; confirm current source before PO |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Kioxia / Toshiba Memory legacy |
Manufacturer Part Number Unique alphanumeric identifier assigned by the original manufacturer to specify a particular component version. Use this number to cross-reference datasheets, verify exact specifications, and ensure compatibility with your design. Always confirm it matches the part you intend to order. | THGBMNG5D1LBAIL |
Interface Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in. | eMMC 5.0 class |
Clock Frequency Operating frequency of the clock signal that drives the device. Determines processing speed and timing accuracy. Compare with your system's required clock rate and check the datasheet for maximum and typical values. | 200 MHz class |
| Parameter | Value |
|---|---|
Inspection Focus Highlights key areas to inspect during quality control, such as solder joints, lead integrity, or marking legibility. Helps procurement teams and inspectors focus on critical parameters to ensure component reliability and compliance with specifications. | Confirm Toshiba/Kioxia label context, date code, lot code, tray condition, package marking, and new/unused status. |
Compatibility Note Provides compatibility information with other components, such as voltage levels, logic families, or connector types. Essential for avoiding integration issues in complex systems. Always verify compatibility with your specific design and reference designs. | Do not substitute by 4GB capacity alone. Review package, VCC/VCCQ rails, boot partitions, RPMB, EXT_CSD fields, firmware behavior, endurance, retention, and host validation. |
Source Evidence Describes the documentation or reference that substantiates the attribute values listed for the component. This helps buyers and engineers assess data reliability and traceability. Always check the original datasheet or manufacturer documentation for the most authoritative information. | Request source-path evidence and retain distributor or supplier records before production release. |
| Parameter | Value |
|---|---|
VCCQ Indicates the supply voltage for the I/O interface circuitry of the device. It determines the logic levels for communication with other components. Engineers must match this voltage to the bus voltage of the system to avoid signal integrity issues or damage. | 1.7V to 1.95V or 2.7V to 3.6V, host mode dependent |
Package Size Specifies the physical dimensions of the component package, such as length, width, and height. This attribute helps determine board space requirements and compatibility with assembly processes. Verify against the datasheet for precise measurements. | 11.5 x 13 mm |
VCC Specifies the core supply voltage required for the internal logic of the device. This is essential for power design and ensuring reliable operation. Engineers must verify that the power supply meets the specified voltage and tolerances under all load conditions. | 2.7V to 3.6V |
| Parameter | Value |
|---|---|
Capacity Total memory capacity of the module, typically expressed in megabytes or gigabytes. This is a primary selection criterion for system memory upgrades. Verify that the capacity is supported by the motherboard and operating system, and check for any limitations on total memory per channel. | 4GB / 32Gbit |
Memory Organization Specifies the internal arrangement of memory cells, such as rows and columns, often expressed as depth by width. This determines how addresses map to data bits. Verify against the datasheet to ensure compatibility with your system's address bus and data width requirements. | 4G x 8 |
| Parameter | Value |
|---|---|
Product Type Select the category that best describes this electronic component, such as capacitor, resistor, diode, or connector. This classification helps you filter and compare similar parts. Verify the exact type against the datasheet to ensure it matches your application requirements. | e-MMC managed NAND flash module |
Datasheet preview
Preview the THGBMNG5D1LBAIL datasheet from Kioxia to check package, electrical characteristics, application notes, and document evidence before RFQ.
Notice documents
No public product notice document is currently displayed for THGBMNG5D1LBAIL. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
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Common questions
Targeted answers for buyers verifying the exact THGBMNG5D1LBAIL ordering code, packaging, stock, datasheet, and replacement path.
THGBMNG5D1LBAIL is the exact ordering code listed for a eMMC component from Kioxia. The current package reference is 153-WFBGA / FBGA-153 (11.5 x 13 mm), with listed context including Toshiba Memory / Kioxia legacy 4GB e-MMC 5.0 managed NAND flash module in 153-WFBGA package.. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
Treat THGBMNG5D1LBAIL as the full ordering code during RFQ and engineering review. Confirm the listed 153-WFBGA / FBGA-153 (11.5 x 13 mm) package, manufacturer documentation from Kioxia, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
THGBMNG5D1LBAIL is currently listed with package reference 153-WFBGA / FBGA-153 (11.5 x 13 mm) from Kioxia. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
THGBMNG5D1LBAIL is currently marked with stock availability on this page. Before ordering, confirm the package (153-WFBGA / FBGA-153 (11.5 x 13 mm)), listed stock (36000), available quantity (18000), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
A mapped alternative list is not currently published for THGBMNG5D1LBAIL. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.