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Supply original OMAPL137DZKBD4, Embedded - Microprocessors, by Texas Instruments

OMAPL137DZKBD4 is a Embedded - Microprocessors model from Texas Instruments, presented on TrustCompo for buyers who need clear sourcing and review context before RFQ. This listing sits in the Integrated Circuits (ICs) / Embedded - Microprocessors product path. Known package information currently points to BGA under the Texas Instruments brand listing. IC MPU OMAP-L1X 456MHZ 256BGA. TrustCompo combines the available model, brand, hierarchy, and specification details around OMAPL137DZKBD4 so buyers can move faster from review to quotation.

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Supply original OMAPL137DZKBD4, Embedded - Microprocessors, by Texas Instruments | TrustCompo
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Part Number

OMAPL137DZKBD4

Internal code

TCE000087255

Package

BGA

Manufacturer

Texas Instruments

Key specifications

Series

OMAP-L1x

Min Quantity

1

Description

IC MPU OMAP-L1X 456MHZ 256BGA

key Attributes

-

Why request a quote

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Trust signals

Globally recognized certifications

4 certifications

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ISO 9001

Quality management processes for more consistent sourcing and handling.

AS9120B

Aerospace-focused distribution controls for traceability and reliability.

ISO 14001

Environmental management discipline across warehouse and operating workflows.

ESD Control

Electrostatic handling standards to help protect sensitive components.

Ordering workflow

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How to order this product

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1

Confirm part and quantity

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2

Send RFQ or sample request

Use Quick Quote for commercial pricing or Request Sample when engineering validation is still in progress and a smaller evaluation quantity is needed.

3

Align delivery, payment, and documentation

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Policies buyers usually check

These pages explain the operating rules around samples, shipping, payment, and quality support before you place the order.

Get a Sample

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Shipping & Delivery

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Payment Terms

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Quality & Traceability Center

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Structured product content

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Product overview

Overview

IC MPU OMAP-L1X 456MHZ 256BGA

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Popular Specs Surfaced First

Product Parameter

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Product Parameter

Core Architecture

ARM

Product Parameter

UPs/UCs/Peripheral ICs Type

DIGITAL SIGNAL PROCESSOR, OTHER

Product Parameter

Core Processor

ARM926EJ-S

Product Parameter

Format

FLOATING POINT

Product Parameter

Low Power Mode

YES

Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Core Architecture
ARM
UPs/UCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
Core Processor
ARM926EJ-S
Format
FLOATING POINT
Low Power Mode
YES
Boundary Scan
YES
Integrated Cache
YES
Number Of Timers
3
Number Of UART Channels
3
Part Status
Active
Lifecycle Status
ACTIVE (Last Updated: 4 days ago)
Packaging
Tray
REACH Status
REACH Unaffected
Lead Free
Lead Free
Factory Lead Time
6 Weeks
Height
2.05mm
Categories
Integrated Circuits (ICs)
Peak Reflow Temperature (Cel)
260
Technology
CMOS
Manufacturer
Texas
ECCN
3A991A2
Terminal Form
BALL
Number Of Cores/Bus Width
1 Core 32-Bit
Voltage - I/O
1.8V 3.3V
Sub-Categories
Embedded - Microprocessors
Operating Temperature
-40°C~90°C TJ
Display & Interface Controllers
LCD
Ethernet
10/100Mbps (1)
Surface Mount
YES
Pbfree Code
yes
Terminal Position
BOTTOM
Barrel Shifter
NO
Length
17mm
Width
17mm
Number Of Cores
1
RAM Controllers
SDRAM
Graphics Acceleration
No
Internal Bus Architecture
SINGLE
Supply Voltage
1.3V
Package / Case
256-BGA
Additional Interfaces
HPI, I2C, McASP, MMC/SD, SPI, UART
Base Part Number
OMAPL137
Number Of Pins
256
Series
OMAP-L1x
USB
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Number Of Terminations
256
Max Supply Voltage
1.35V
Subcategory
Other Microprocessor ICs
Frequency
456MHz
Co-Processors/DSP
Signal Processing; C674x, System Control; CP15
Thickness
1.36mm
Operating Supply Voltage
1.3V
Min Supply Voltage
1.25V
Manufacturer'S Part No.
OMAPL137DZKBD4
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
HTSUS
8542.31.0001
JESD-609 Code
e1

Common questions

Product FAQ

Quick answers for buyers reviewing OMAPL137DZKBD4, stock, documentation, and sourcing steps.

What is OMAPL137DZKBD4?

OMAPL137DZKBD4 is a Embedded - Microprocessors component from Texas Instruments. This product page summarizes the core sourcing details buyers need before checking price, availability, documentation, or samples.

What package and description are listed for OMAPL137DZKBD4?

OMAPL137DZKBD4 is listed with package reference BGA. The current product description is IC MPU OMAP-L1X 456MHZ 256BGA, and buyers should confirm package, footprint, and electrical details against the datasheet or quotation notes before approval.

Is OMAPL137DZKBD4 available in stock?

This page currently shows 38466 units in stock and 60063 units available for OMAPL137DZKBD4. Because electronic component availability can change quickly, submit an RFQ to confirm live stock, lead time, and final pricing.

Can I request a quote or sample for OMAPL137DZKBD4?

Yes. Use the Quick Quote or Request Sample action on this page to send the quantity and sourcing requirements for OMAPL137DZKBD4 by Texas Instruments. The TrustCompo team can review price, availability, and documentation support.

Is a datasheet available for OMAPL137DZKBD4?

A dedicated datasheet link is not currently listed for OMAPL137DZKBD4 by Texas Instruments. Contact us with the part number and required parameters so the team can help confirm documentation during quotation.

How should buyers verify OMAPL137DZKBD4 before ordering?

Buyers should confirm the manufacturer, package, quantity, target price, RoHS or compliance needs, and any Certificate of Conformance or traceability requirements for OMAPL137DZKBD4 before approving the order.

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