TrustCompo Website Logo | TrustCompo

Supply original MCIMX6L8DVN10AB, Embedded - Microprocessors, by NXP Semiconductors

MCIMX6L8DVN10AB is a Embedded - Microprocessors model from NXP Semiconductors, presented on TrustCompo for buyers who need clear sourcing and review context before RFQ. This listing sits in the Integrated Circuits (ICs) / Embedded - Microprocessors product path. IC MPU I.MX6SL 1.0GHZ 432MAPBGA. TrustCompo combines the available model, brand, hierarchy, and specification details around MCIMX6L8DVN10AB so buyers can move faster from review to quotation.

RoHS
Datasheet
Supply original MCIMX6L8DVN10AB, Embedded - Microprocessors, by NXP Semiconductors | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.

Traceability and authenticity checks

Fast RFQ turnaround

Documentation support

Pre-shipment inspection review

Part Number

MCIMX6L8DVN10AB

Internal code

TCE000083601

Package

-

Key specifications

Series

i.MX6SL

Min Quantity

1

Description

IC MPU I.MX6SL 1.0GHZ 432MAPBGA

key Attributes

-

Technical document

Open The Official Datasheet

Review the latest datasheet for MCIMX6L8DVN10AB from NXP Semiconductors in a separate tab so engineers and buyers can check package, electrical characteristics, and application details without leaving this product page.

View MCIMX6L8DVN10AB Datasheet

Why request a quote

Use the RFQ step to confirm the commercial and documentation details buyers usually need before placing an order.

Confirm stock and lead-time expectations
Check CoC or traceability support
Align inspection and fulfillment details

Trust signals

Globally recognized certifications

4 certifications

Visible certifications work best when they are paired with clear operational promises around traceability, handling, and inspection.

ISO 9001

Quality management processes for more consistent sourcing and handling.

AS9120B

Aerospace-focused distribution controls for traceability and reliability.

ISO 14001

Environmental management discipline across warehouse and operating workflows.

ESD Control

Electrostatic handling standards to help protect sensitive components.

Ordering workflow

Understand how to order and what policies support the purchase

Use this section to see the fastest ordering path and the policy pages buyers usually review before confirming a component order.

How to order this product

A simple B2B flow helps engineering and procurement teams move from part review to commercial confirmation.

1

Confirm part and quantity

Review the part number, package, key specs, and target quantity so the quote request reflects the exact sourcing scope your team needs.

2

Send RFQ or sample request

Use Quick Quote for commercial pricing or Request Sample when engineering validation is still in progress and a smaller evaluation quantity is needed.

3

Align delivery, payment, and documentation

Before final release, confirm stock timing, shipment method, payment arrangement, and any traceability or inspection documents required by your process.

Policies buyers usually check

These pages explain the operating rules around samples, shipping, payment, and quality support before you place the order.

Get a Sample

Request engineering samples to evaluate fit, validate alternatives, and keep design decisions moving before a larger order is placed.

Request evaluation samples

Shipping & Delivery

Review shipping origin, carrier options, delivery methods, and the practical factors that affect transit timing for global component orders.

Review shipping details

Payment Terms

Understand supported payment methods, invoice handling, quote currency, and the commercial boundaries used for international B2B orders.

Review payment terms

Quality & Traceability Center

See how incoming inspection, outgoing verification, traceability support, certifications, and additional testing fit into our quality workflow.

Review quality controls

Structured product content

Review The Product The Way Buyers Actually Evaluate It

Review overview, detailed specifications, and related sourcing content in one structured flow without scanning separate oversized sections.

Product overview

Overview

IC MPU I.MX6SL 1.0GHZ 432MAPBGA

Fast scan

Popular Specs Surfaced First

Product Attribute

Part Status

Active

Product Attribute

Packaging

Tray

Product Attribute

REACH Status

REACH Unaffected

Product Attribute

Factory Lead Time

12 Weeks

Product Attribute

Published

2002

Product Attribute

Categories

Integrated Circuits (ICs)

Part Status
Active
Packaging
Tray
REACH Status
REACH Unaffected
Factory Lead Time
12 Weeks
Published
2002
Categories
Integrated Circuits (ICs)
Peak Reflow Temperature (Cel)
260
Technology
CMOS
Qualification Status
Not Qualified
Terminal Pitch
0.5mm
HTS Code
8542.31.00.01
ECCN
5A992C
Terminal Form
BALL
Co-Processors/DSP
Multimedia; NEON™ SIMD
Number Of Cores/Bus Width
1 Core 32-Bit
Sub-Categories
Embedded - Microprocessors
Ethernet
10/100Mbps (1)
Surface Mount
YES
Reflow Temperature-Max (S)
40
Terminal Position
BOTTOM
Address Bus Width
16
Length
13mm
Graphics Acceleration
Yes
External Data Bus Width
32
Display & Interface Controllers
Keypad, LCD
Operating Temperature
0°C~95°C TJ
Manufacturer
NXP Semiconductors
USB
USB 2.0 + PHY (3)
Base Part Number
MCIMX6
Number Of Terminations
576
Security Features
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Number Of I/O
162
RAM Controllers
LPDDR2, LVDDR3, DDR3
Series
i.MX6SL
Voltage - I/O
1.2V 1.8V 3.0V
Package / Case
432-TFBGA
Manufacturer'S Part No.
MCIMX6L8DVN10AB
Additional Interfaces
AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Bus Compatibility
CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB
Height Seated (Max)
1.1mm
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
HTSUS
8542.31.0001
JESD-609 Code
e1
JESD-30 Code
S-PBGA-B
ECCN Code
5A992
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Format
FIXED POINT
UPs/UCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Low Power Mode
YES
Bit Size
32
Boundary Scan
YES
Integrated Cache
YES
RAM (Words)
32000
Supply Voltage-Min (Vsup)
1.375V
Supply Current-Max
1100mA
Supply Voltage-Max (Vsup)
1.5V
Speed
1.0GHz
Core Processor
ARM® Cortex®-A9

Common questions

Product FAQ

Quick answers for buyers reviewing MCIMX6L8DVN10AB, stock, documentation, and sourcing steps.

What is MCIMX6L8DVN10AB?

MCIMX6L8DVN10AB is a Embedded - Microprocessors component from NXP Semiconductors. This product page summarizes the core sourcing details buyers need before checking price, availability, documentation, or samples.

What package and description are listed for MCIMX6L8DVN10AB?

MCIMX6L8DVN10AB is listed with package reference -. The current product description is IC MPU I.MX6SL 1.0GHZ 432MAPBGA, and buyers should confirm package, footprint, and electrical details against the datasheet or quotation notes before approval.

Is MCIMX6L8DVN10AB available in stock?

This page currently shows 179864 units in stock and 54744 units available for MCIMX6L8DVN10AB. Because electronic component availability can change quickly, submit an RFQ to confirm live stock, lead time, and final pricing.

Can I request a quote or sample for MCIMX6L8DVN10AB?

Yes. Use the Quick Quote or Request Sample action on this page to send the quantity and sourcing requirements for MCIMX6L8DVN10AB by NXP Semiconductors. The TrustCompo team can review price, availability, and documentation support.

Is a datasheet available for MCIMX6L8DVN10AB?

Yes. This page links to the datasheet for MCIMX6L8DVN10AB by NXP Semiconductors, so engineers and buyers can review package, ratings, and application details before purchase.

How should buyers verify MCIMX6L8DVN10AB before ordering?

Buyers should confirm the manufacturer, package, quantity, target price, RoHS or compliance needs, and any Certificate of Conformance or traceability requirements for MCIMX6L8DVN10AB before approving the order.

More sourcing insights

Articles

Explore related articles around MCIMX6L8DVN10AB, Embedded - Microprocessors, and adjacent sourcing decisions so buyers can compare context before moving from evaluation to RFQ.