Supply original MT65B12G16080A00QG-60:A, High Bandwidth Memory, by Micron Technology
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Overview
HBM3E memory component in WFPGA package with 192M x1088 configuration. Operates at 1.1V with 1500MHz clock speed and supports -10°C to +105°C temperature range. Suitable for next-generation computing platforms.
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Articles
This guide provides a direct comparison of HBM generations (up to HBM3e), analyzes the market landscape dominated by SK Hynix, Samsung, and Micron, and offers a crucial procurement checklist. It concludes with a practical case study, advising on capacity and bandwidth requirements (e.g., for a 175B parameter LLM), ensuring businesses can make informed decisions for their high-performance AI systems.
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