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XC2S150-5FG256C Embedded - FPGAs (Field Programmable Gate Array) by Xilinx

XC2S150-5FG256C is a Embedded - FPGAs (Field Programmable Gate Array) from Xilinx in BGA packaging. It is commonly reviewed for IC FPGA 176 I/O 256FBGA. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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XC2S150-5FG256C Embedded - FPGAs (Field Programmable Gate Array) by Xilinx | TrustCompo
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Key specifications

Part Number

XC2S150-5FG256C

Internal code

TCE000120808

Package

BGA

Manufacturer
Xilinx

Key specifications

Series

Spartan®-II

Min Quantity

1

Description

IC FPGA 176 I/O 256FBGA

key Attributes

-

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Quality and trust signals

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4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for XC2S150-5FG256C before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

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Before PO release

Part confirmation

  • Exact MPN confirmed: XC2S150-5FG256C
  • Package to verify: BGA

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Product overview

Product overview

Review the sourcing context for XC2S150-5FG256C from Xilinx, including product identity, application fit, package notes, and purchasing considerations.

General Device Information
The XC226x derivatives are high-performance members of the Infineon XC2000 Family of full featured single-chip CMOS microcontrollers.
These devices extend the functionality and performance of the C166 Family in terms of instructions (MAC unit), peripherals, and speed.
They combine high CPU performance (up to 66 million instructions per second) with high peripheral functionality and enhanced IO-capabilities. Optimized peripherals can be adapted to the application’s requirements in a flexible way.
These derivatives also provide clock generation via PLL and internal or external clock sources, and various on-chip memory modules such as program Flash, program RAM, and data RAM.Summary of
FeaturesFor a quick overview or reference, the XC226x’s properties are listed here in a condensed way.
• High Performance 16-bit CPU with 5-Stage Pipeline
– 15 ns Instruction Cycle Time at 66 MHz CPU Clock (Single-Cycle Execution)
– 1-Cycle 32-bit Addition and Subtraction with 40-bit result
– 1-Cycle Multiplication (16 × 16 bit)
– 1-Cycle Multiply-and-Accumulate (MAC) Instructions
– Background Division (32 / 16 bit) in 21 Cycles
– Enhanced Boolean Bit Manipulation Facilities
– Zero-Cycle Jump Execution
– Additional Instructions to Support HLL and Operating Systems
– Register-Based Design with Multiple Variable Register Banks
– Fast Context Switching Support with Two Additional Local Register Banks
– 16 Mbytes Total Linear Address Space for Code and Data
– 1024 Bytes On-Chip Special Function Register Area (C166 Family Compatible)
• 16-Priority-Level Interrupt System with up to 87 Sources, Selectable External Inputs for Interrupt Generation and Wake-Up, Sample-Rate down to 15 ns
• 8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via Peripheral Event Controller (PEC), 24-Bit Pointers Cover Total Address Space
• Clock Generation from Internal or External Clock Sources, via on-chip PLL or via Prescaler
• On-Chip Memory Modules
– 1 Kbyte On-Chip Stand-By RAM (SBRAM)
– 2 Kbytes On-Chip Dual-Port RAM (DPRAM)
– 16 Kbytes On-Chip Data SRAM (DSRAM)
– Up to 64 Kbytes On-Chip Program/Data SRAM (PSRAM)
– Up to 768 Kbytes On-Chip Program Memory (Flash Memory)
• On-Chip Peripheral Modules
– Two Synchronizable A/D Converters with a total of 16 Channels, 10-bit Resolution, Conversion Time down to 1.2 µs, Optional Data Preprocessing (Data Reduction, Range Check)
– 16-Channel General Purpose Capture/Compare Unit (CAPCOM2)
– Up to four Capture/Compare Units for flexible PWM Signal Generation (CCU6x)
– Multi-Functional General Purpose Timer Unit with 5 Timers
– Six Serial Interface Channels to be used as UART, LIN, High-Speed Synchronous Channel (SPI/QSPI), IIC Bus Interface (10-bit addressing, 400 kbit/s), IIS Interface
– On-Chip MultiCAN Interface (Rev. 2.0B active) with up to 128 Message Objects (Full CAN/Basic CAN) on up to 5 CAN Nodes and Gateway Functionality
– On-Chip Real Time Clock
• Up to 12 Mbytes External Address Space for Code and Data
– Programmable External Bus Characteristics for Different Address Ranges
– Multiplexed or Demultiplexed External Address/Data Buses
– Selectable Address Bus Width
– 16-Bit or 8-Bit Data Bus Width
– Four Programmable Chip-Select Signals
• Single Power Supply from 3.0 V to 5.5 V
• Power Reduction Modes with Flexible Power Management
• Programmable Watchdog Timer and Oscillator Watchdog
• Up to 75 General Purpose I/O Lines
• On-Chip Bootstrap Loader
• Supported by a Large Range of Development Tools like C-Compilers, Macro-Assembler Packages, Emulators, Evaluation Boards, HLL-Debuggers, Simulators, Logic Analyzer Disassemblers, Programming Boards
• On-Chip Debug Support via JTAG Interface
• 100-Pin Green LQFP Package, 0.5 mm (19.7 mil) pitch

Technical parameters

Parameters

Compare grouped XC2S150-5FG256C parameters from Xilinx, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Parameter

    Triac Type

    Active

  • Product Parameter

    Typical Quiescent Current (MA)

    CMOS

  • Product Parameter

    Drain To Source Resistance

    EAR99

  • Product Parameter

    On-State Resistance Match-Nom

    Not Qualified

  • Product Parameter

    Transformer Type

    no

  • Product Parameter

    Total Resistance

    Tray

XC2S150-5FG256C Product Parameter
ParameterValue
Triac Type

Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements.

Active
Typical Quiescent Current (MA)

Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency.

CMOS
Drain To Source Resistance

This is the on-state resistance between the drain and source terminals of a MOSFET. It affects power dissipation and efficiency. Lower values are preferred for high-current switching. Always check the datasheet for the specified test conditions, as RDS(on) varies with gate voltage and temperature.

EAR99
On-State Resistance Match-Nom

Indicates the nominal matching of on-state resistance between multiple channels in a device, such as a dual MOSFET or analog switch. This parameter is critical for parallel operation and current sharing. Verify the specified match against the datasheet to ensure balanced performance.

Not Qualified
Transformer Type

Indicates the construction or configuration of the transformer, such as flyback, forward, or planar. Affects performance, size, and application suitability. Refer to datasheet for detailed specifications and recommended usage.

no
Total Resistance

Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation.

Tray
Transmission Media Type

Specifies the physical medium through which signals travel, such as fiber optic, twisted pair, or coaxial cable. This attribute is critical for ensuring compatibility with your network infrastructure and for meeting performance requirements. Verify the media type against your system's specifications and the component datasheet to avoid signal integrity issues.

2.5V
Accessory Type

Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application.

BOTTOM
Minimum Operating Supply Voltage

Specifies the lowest supply voltage at which the component remains fully functional. Compare this value with your system's power rail tolerance and verify it against the datasheet's recommended operating conditions to ensure reliable startup and operation.

BALL
Nominal Attenuation

Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies.

e0
Voltage Rating

Specifies the maximum continuous voltage the component can safely withstand without damage or performance degradation. Critical for ensuring proper operating margins in power supplies, signal lines, and isolation barriers. Always confirm with the datasheet for absolute maximum ratings.

30
Maximum Data Rate

Highest data transfer rate the component can reliably support, typically in bits per second. This is critical for serial interfaces, modems, or transceivers. Ensure your application's required data throughput does not exceed this limit to avoid communication errors and performance degradation.

1mm
Output Peak Current Limit

Specifies the maximum instantaneous output current the device can deliver without damage or shutdown. Compare this limit with your inrush and transient load requirements. Verify against the datasheet's safe operating area and pulse conditions to ensure reliable operation.

2mm
Maximum Operating Supply Voltage

Highest supply voltage at which the component can operate normally without damage or performance degradation. Exceeding this limit may cause overheating or failure. Always check this parameter against your power supply design to ensure the component operates within its safe voltage range for reliable long-term performance.

225
Speed Grade

Speed grade indicates the maximum operating frequency or propagation delay category for digital ICs, memory, or programmable logic. Compare grades when selecting parts for timing-critical designs. Verify the exact speed rating in the datasheet to ensure it meets your system's clock and signal integrity requirements.

5
Typical Switching Frequency (KHz)

Typical switching frequency of a power converter or driver. Compare this value to your application's needs to ensure efficient operation. Verify against the datasheet for exact conditions.

Field Programmable Gate Arrays
Filter Type

Specifies the filter topology used in the component, such as low-pass, high-pass, band-pass, or notch. This determines the frequency response and attenuation characteristics. Engineers must verify the filter type against the datasheet to ensure it meets the required signal conditioning and interference rejection for the application.

256
Number Of Turns

Number of turns in a coil or winding. Affects inductance, transformer ratio, and impedance. Critical for designing transformers, inductors, and magnetic components. Check datasheet for tolerance.

17mm
Collector-Emitter Voltage-Max

Maximum voltage that can be applied between collector and emitter without breakdown. Critical for BJT and IGBT selection. Verify against datasheet to ensure safe operation within your circuit's supply and transient conditions.

FIELD PROGRAMMABLE GATE ARRAY
Number Of LABs/CLBs

Indicates the count of logic array blocks or configurable logic blocks in an FPGA or CPLD. This metric helps compare logic capacity and complexity across devices. Verify against the datasheet for your specific design requirements.

864
Number Of Logic Elements/Cells

Indicates the total count of programmable logic elements or cells in the FPGA or CPLD. This parameter determines the device's logic capacity and complexity. Compare this value with your design requirements to ensure sufficient resources. Always verify against the datasheet for exact specifications.

3888
Power Supplies

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

Spartan®-II
Terminal Block Type

Specifies the mechanical configuration of the terminal block, such as pluggable, fixed, or barrier style. This affects mounting, wiring, and compatibility with mating connectors. Verify the exact type against the datasheet to ensure proper fit and reliable electrical connections in your assembly.

6kB
Configuration

Specifies the internal circuit topology or arrangement of the component, such as single, dual, or bridge configuration. This attribute helps engineers select the right part for their circuit design. Always verify the exact configuration against the datasheet to ensure compatibility with your application.

150000
Output High Voltage-Min

Specifies the minimum voltage level that the output can drive when in a high logic state. Compare this value with the input high threshold of the receiving device to ensure proper logic compatibility. Verify against the datasheet for your operating conditions.

49152
Capacitance

Capacitance value of the component, typically expressed in farads (pF, nF, µF). This parameter determines energy storage and filtering characteristics. Compare capacitance when selecting capacitors for power supply decoupling, signal coupling, or timing applications. Always check the rated voltage and tolerance in the datasheet.

176
XC2S150-5FG256C Product Attribute
ParameterValue
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Surface Mount
Max Supply Voltage

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

Surface Mount
Converter Type

Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.

3 (168 Hours)
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

256-BGA
Housing Material

Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure.

Non-RoHS Compliant
Locking Feature

Indicates the locking mechanism used to secure the connector or terminal in place. Choose the appropriate type for your application to ensure reliable mating and vibration resistance. Verify compatibility with the mating part and datasheet specifications.

Contains Lead
Interface Type

Specifies the communication protocol used by the component to exchange data with a host controller or other devices. Common examples include I2C, SPI, UART, USB, and CAN. Verify compatibility with your system's bus architecture and voltage levels before integration.

not_compliant
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Embedded - FPGAs (Field Programmable Gate Array)
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

1999
Input Power-Max (CW)

Indicates the maximum continuous wave input power the component can safely handle without damage or excessive distortion. Exceeding this limit may cause failure. Verify this value against your signal power and consider peak-to-average ratio in modulated systems.

10 Weeks
Resistance

Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation.

2.5V
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Xilinx
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

0°C~85°C TJ
Specifications

Review the complete technical specifications for this electronic component, including electrical ratings, mechanical dimensions, and environmental limits. Verify these parameters against your application requirements and the manufacturer's datasheet to ensure compatibility and reliable operation.

Tin/Lead (Sn63Pb37)
Number Of I/O

Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.

176
Temperature Grade

Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.

256
Threshold Voltage

The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature.

17mm
Data Rate

Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.

256
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

Spartan®-II
Programmable Flags Support

Indicates whether the device supports user-configurable flags for status or control. Check the datasheet to see which flags are programmable and how they behave during operation.

864
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

263MHz
Bus Directional

Indicates whether the bus supports data flow in one direction only or in both directions. This affects signal routing and buffer design. Verify against the datasheet to ensure compatibility with your system's communication requirements.

0.7 ns
Temperature Coefficient

Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment.

2.375V~2.625V
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

XC2S150
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

XC2S150-5FG256C

Datasheet preview

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XC2S150-5FG256C

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PCN / product notice documents

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Common questions

Product FAQ

Targeted answers for buyers verifying the exact XC2S150-5FG256C ordering code, packaging, stock, datasheet, and replacement path.

What does XC2S150-5FG256C mean?

XC2S150-5FG256C is the exact ordering code listed for a Embedded - FPGAs (Field Programmable Gate Array) component from Xilinx. The current package reference is BGA, with listed context including IC FPGA 176 I/O 256FBGA. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the XC2S150-5FG256C ordering code?

Treat XC2S150-5FG256C as the full ordering code during RFQ and engineering review. Confirm the listed BGA package, manufacturer documentation from Xilinx, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is XC2S150-5FG256C supplied in?

XC2S150-5FG256C is currently listed with package reference BGA from Xilinx. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is XC2S150-5FG256C in stock at TrustCompo?

This page currently displays 1 public stock records for XC2S150-5FG256C with 28 listed pieces. Before ordering, confirm the package (BGA), required quantity, live availability, lead time, final price, date code, MOQ, packaging evidence, and RFQ documentation.

Where can I compare XC2S150-5FG256C alternatives?

A mapped alternative list is not currently published for XC2S150-5FG256C. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.