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EPF10K200EBC600-1 Embedded - FPGAs (Field Programmable Gate Array) by Intel

EPF10K200EBC600-1 is a Embedded - FPGAs (Field Programmable Gate Array) from Intel in BGA packaging. It is commonly reviewed for IC FPGA 470 I/O 600BGA. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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EPF10K200EBC600-1 Embedded - FPGAs (Field Programmable Gate Array) by Intel | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

EPF10K200EBC600-1

Internal code

TCE000117478

Package

BGA

Manufacturer
Intel

Key specifications

Series

FLEX-10KE®

Min Quantity

1

Description

IC FPGA 470 I/O 600BGA

key Attributes

-

Globally recognized certifications

4 certifications

Visible certifications work best when they are paired with clear operational promises around traceability, handling, and inspection.

  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

How to order EPF10K200EBC600-1

Confirm the core buying details for this exact ordering code before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO Release

Part confirmation

  • Exact MPN confirmed: EPF10K200EBC600-1
  • Package to verify: BGA

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Technical Details

Review overview, detailed specifications, and related sourcing content in one structured flow without scanning separate oversized sections.

Overview

ALTERAGeneral DescriptionAltera FLEX 10KE devices are enhanced versions of FLEX 10K devices. Based on reconfigurable CMOS SRAM elements, the FLEX architecture incorporates all features necessary to implement common gate array megafunctions. With up to 200,000 typical gates, FLEX 10KE devices provide the density, speed, and features to integrate entire systems, including multiple 32-bit buses, into a single device.
Features...
• Embedded programmable logic devices (PLDs), providing system-on-a-programmable-chip (SOPC) integration in a single device
– Enhanced embedded array for implementing megafunctions such as efficient memory and specialized logic functions
– Dual-port capability with up to 16-bit width per embedded array block (EAB)
– Logic array for general logic functions
• High density
– 30,000 to 200,000 typical gates (see Tables 1 and 2)
– Up to 98,304 RAM bits (4,096 bits per EAB), all of which can be used without reducing logic capacity
• System-level features
– MultiVoltTM I/O pins can drive or be driven by 2.5-V, 3.3-V, or 5.0-V devices
– Low power consumption
– Bidirectional I/O performance (tSU and tCO) up to 212 MHz
– Fully compliant with the PCI Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 for 3.3-V operation at 33 MHz or 66 MHz
– -1 speed grade devices are compliant with PCI Local Bus Specification, Revision 2.2, for 5.0-V operation
– Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming additional device logic
– Fabricated on an advanced process and operate with a 2.5-V internal supply voltage
– In-circuit reconfigurability (ICR) via external configuration devices, intelligent controller, or JTAG port
– ClockLockTM and ClockBoostTM options for reduced clock delay/skew and clock multiplication
– Built-in low-skew clock distribution trees
– 100% functional testing of all devices; test vectors or scan chains are not required
– Pull-up on I/O pins before and during configuration
• Flexible interconnect
– FastTrack® Interconnect continuous routing structure for fast, predictable interconnect delays
– Dedicated carry chain that implements arithmetic functions such as fast adders, counters, and comparators (automatically used by software tools and megafunctions)
– Dedicated cascade chain that implements high-speed, high-fan-in logic functions (automatically used by software tools and megafunctions)
– Tri-state emulation that implements internal tri-state buses
– Up to six global clock signals and four global clear signals
• Powerful I/O pins
– Individual tri-state output enable control for each pin
– Open-drain option on each I/O pin
– Programmable output slew-rate control to reduce switching noise
– Clamp to VCCIO user-selectable on a pin-by-pin basis
– Supports hot-socketing
• Software design support and automatic place-and-route provided by Altera’s development systems for Windows-based PCs and Sun SPARCstation, and HP 9000 Series 700/800
• Flexible package options
– Available in a variety of packages with 144 to 672 pins, including the innovative FineLine BGATM packages (see Tables 3 and 4)
– SameFrameTM pin-out compatibility between FLEX 10KA and FLEX 10KE devices across a range of device densities and pin counts
• Additional design entry and simulation support provided by EDIF 2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM), DesignWare components, Verilog HDL, VHDL, and other interfaces to popular EDA tools from manufacturers such as Cadence, Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity, VeriBest, and Viewlogic

Popular Specs Surfaced First

Open The Official Datasheet

Review the latest datasheet for EPF10K200EBC600-1 from Intel in a separate tab so engineers and buyers can check package, electrical characteristics, and application details without leaving this product page.

View EPF10K200EBC600-1 Datasheet
  • Package Parameter

    Height Seated (Max)

    1.93mm

  • Product Attribute

    REACH Status

    REACH Unaffected

  • Product Attribute

    Packaging

    Bulk

  • Product Attribute

    Lead Free

    Contains Lead

  • Product Attribute

    Published

    1998

  • Product Attribute

    Part Status

    Discontinued

EPF10K200EBC600-1 Package Parameter
ParameterValue
Height Seated (Max)1.93mm
EPF10K200EBC600-1 Product Attribute
ParameterValue
REACH StatusREACH Unaffected
PackagingBulk
Lead FreeContains Lead
Published1998
Part StatusDiscontinued
Max Operating Temperature85°C
CategoriesIntegrated Circuits (ICs)
TechnologyCMOS
Reach Compliance Codenot_compliant
Qualification StatusNot Qualified
Length45mm
Terminal FormBALL
HTS Code8542.39.00.01
Pbfree Codeno
Reflow Temperature-Max (S)30
Supply Voltage2.5V
MountSurface Mount
Terminal Pitch1.27mm
Terminal PositionBOTTOM
Peak Reflow Temperature (Cel)220
Operating Supply Voltage2.5V
Operating Supply Current10mA
Min Operating Temperature0°C
Min Supply Voltage2.3V
Frequency250MHz
Temperature GradeCOMMERCIAL
Width45mm
Sub-CategoriesEmbedded - FPGAs (Field Programmable Gate Array)
SubcategoryField Programmable Gate Arrays
ManufacturerIntel
ECCN3A991D
Max Supply Voltage2.7V
Package / CaseBGA
Number Of Pins600
SeriesFLEX-10KE®
Manufacturer'S Part No.EPF10K200EBC600-1
Number Of Terminations600
Number Of I/O470
Number Of Outputs470
Pin Count600
EPF10K200EBC600-1 Product Parameter
ParameterValue
Memory Size12kB
Power Supplies2.52.5/3.3V
Terminal FinishTin/Lead (Sn63Pb37)
Programmable Logic TypeLOADABLE PLD
Output FunctionMIXED
Propagation Delay0.4 ns
RAM Size12kB
Number Of Logic Blocks (LABs)1248
Number Of Logic Elements/Cells9984
Number Of Gates513000
EPF10K200EBC600-1 Export Classifications & Environmental
ParameterValue
RoHS StatusRoHS non-compliant
JESD-609 Codee0
HTSUS8542.39.0001
Moisture Sensitivity Level (MSL)3 (168 Hours)
ECCN Code3A991

Product FAQ

Targeted answers for buyers verifying the exact EPF10K200EBC600-1 ordering code, packaging, stock, datasheet, and replacement path.

What does EPF10K200EBC600-1 mean?

EPF10K200EBC600-1 is the exact ordering code listed for a Embedded - FPGAs (Field Programmable Gate Array) component from Intel. The current package reference is BGA, with listed context including IC FPGA 470 I/O 600BGA. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

Is EPF10K200EBC600-1 the same as EPF10K200EBC600-1?

EPF10K200EBC600-1 may share the same base part family as EPF10K200EBC600-1, but the suffix can identify ordering, reel, tape, packing, or logistics details. Confirm the BGA package, manufacturer code from Intel, datasheet ordering table, and reel quantity before treating the two codes as interchangeable.

What package is EPF10K200EBC600-1 supplied in?

EPF10K200EBC600-1 is currently listed with package reference BGA from Intel. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is EPF10K200EBC600-1 currently available?

EPF10K200EBC600-1 is currently marked with stock availability on this page. Before ordering, confirm the package (BGA), listed stock (11443), available quantity (11443), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare EPF10K200EBC600-1 alternatives?

A mapped alternative list is not currently published for EPF10K200EBC600-1. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.