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EPF10K50EFC484-2 Embedded - FPGAs (Field Programmable Gate Array) by Intel

EPF10K50EFC484-2 is a Embedded - FPGAs (Field Programmable Gate Array) from Intel in manufacturer-listed packaging. It is commonly reviewed for IC FPGA 220 I/O 484FBGA. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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EPF10K50EFC484-2 Embedded - FPGAs (Field Programmable Gate Array) by Intel | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

EPF10K50EFC484-2

Internal code

TCE000107453

Package

-

Manufacturer
Intel

Key specifications

Series

FLEX-10KE®

Min Quantity

1

Description

IC FPGA 220 I/O 484FBGA

key Attributes

-

Globally recognized certifications

4 certifications

Visible certifications work best when they are paired with clear operational promises around traceability, handling, and inspection.

  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

How to order EPF10K50EFC484-2

Confirm the core buying details for this exact ordering code before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO Release

Part confirmation

  • Exact MPN confirmed: EPF10K50EFC484-2
  • Package to verify: -

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Technical Details

Review overview, detailed specifications, and related sourcing content in one structured flow without scanning separate oversized sections.

Product Overview

ALTERAGeneral DescriptionAltera FLEX 10KE devices are enhanced versions of FLEX 10K devices. Based on reconfigurable CMOS SRAM elements, the FLEX architecture incorporates all features necessary to implement common gate array megafunctions. With up to 200,000 typical gates, FLEX 10KE devices provide the density, speed, and features to integrate entire systems, including multiple 32-bit buses, into a single device.
Features...
• Embedded programmable logic devices (PLDs), providing system-on-a-programmable-chip (SOPC) integration in a single device
– Enhanced embedded array for implementing megafunctions such as efficient memory and specialized logic functions
– Dual-port capability with up to 16-bit width per embedded array block (EAB)
– Logic array for general logic functions
• High density
– 30,000 to 200,000 typical gates (see Tables 1 and 2)
– Up to 98,304 RAM bits (4,096 bits per EAB), all of which can be used without reducing logic capacity
• System-level features
– MultiVoltTM I/O pins can drive or be driven by 2.5-V, 3.3-V, or 5.0-V devices
– Low power consumption
– Bidirectional I/O performance (tSU and tCO) up to 212 MHz
– Fully compliant with the PCI Special Interest Group (PCI SIG) PCI Local Bus Specification, Revision 2.2 for 3.3-V operation at 33 MHz or 66 MHz
– -1 speed grade devices are compliant with PCI Local Bus Specification, Revision 2.2, for 5.0-V operation
– Built-in Joint Test Action Group (JTAG) boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming additional device logic
– Fabricated on an advanced process and operate with a 2.5-V internal supply voltage
– In-circuit reconfigurability (ICR) via external configuration devices, intelligent controller, or JTAG port
– ClockLockTM and ClockBoostTM options for reduced clock delay/skew and clock multiplication
– Built-in low-skew clock distribution trees
– 100% functional testing of all devices; test vectors or scan chains are not required
– Pull-up on I/O pins before and during configuration
• Flexible interconnect
– FastTrack® Interconnect continuous routing structure for fast, predictable interconnect delays
– Dedicated carry chain that implements arithmetic functions such as fast adders, counters, and comparators (automatically used by software tools and megafunctions)
– Dedicated cascade chain that implements high-speed, high-fan-in logic functions (automatically used by software tools and megafunctions)
– Tri-state emulation that implements internal tri-state buses
– Up to six global clock signals and four global clear signals
• Powerful I/O pins
– Individual tri-state output enable control for each pin
– Open-drain option on each I/O pin
– Programmable output slew-rate control to reduce switching noise
– Clamp to VCCIO user-selectable on a pin-by-pin basis
– Supports hot-socketing
• Software design support and automatic place-and-route provided by Altera’s development systems for Windows-based PCs and Sun SPARCstation, and HP 9000 Series 700/800
• Flexible package options
– Available in a variety of packages with 144 to 672 pins, including the innovative FineLine BGATM packages (see Tables 3 and 4)
– SameFrameTM pin-out compatibility between FLEX 10KA and FLEX 10KE devices across a range of device densities and pin counts
• Additional design entry and simulation support provided by EDIF 2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM), DesignWare components, Verilog HDL, VHDL, and other interfaces to popular EDA tools from manufacturers such as Cadence, Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity, VeriBest, and Viewlogic

Open The Official Datasheet

Review the latest datasheet for EPF10K50EFC484-2 from Intel in a separate tab so engineers and buyers can check package, electrical characteristics, and application details without leaving this product page.

View EPF10K50EFC484-2 Datasheet

Popular Specs Surfaced First

  • Package Parameter

    Height Seated (Max)

    2.1mm

  • Product Attribute

    REACH Status

    REACH Unaffected

  • Product Attribute

    Lead Free

    Contains Lead

  • Product Attribute

    Factory Lead Time

    12 Weeks

  • Product Attribute

    Published

    1998

  • Product Attribute

    Part Status

    Discontinued

EPF10K50EFC484-2 Package Parameter
ParameterValue
Height Seated (Max)2.1mm
EPF10K50EFC484-2 Product Attribute
ParameterValue
REACH StatusREACH Unaffected
Lead FreeContains Lead
Factory Lead Time12 Weeks
Published1998
Part StatusDiscontinued
CategoriesIntegrated Circuits (ICs)
TechnologyCMOS
Terminal FormBALL
HTS Code8542.39.00.01
Width23mm
ECCN3A001A2A
Number Of Pins484
Pbfree Codeno
Reflow Temperature-Max (S)30
Radiation HardeningNo
Supply Voltage2.5V
MountSurface Mount
Terminal PositionBOTTOM
Peak Reflow Temperature (Cel)220
Operating Supply Voltage2.5V
Operating Supply Current10mA
Frequency200MHz
Min Operating Temperature0°C
Min Supply Voltage2.3V
Terminal Pitch1mm
Number Of Terminations484
Pin Count484
Length23mm
Max Operating Temperature70°C
Temperature GradeCOMMERCIAL
Package / CaseFBGA
Sub-CategoriesEmbedded - FPGAs (Field Programmable Gate Array)
SubcategoryField Programmable Gate Arrays
ManufacturerIntel
Max Supply Voltage2.7V
Manufacturer'S Part No.EPF10K50EFC484-2
SeriesFLEX-10KE®
Number Of I/O220
Number Of Outputs254
Organization254 I/O
EPF10K50EFC484-2 Product Parameter
ParameterValue
Power Supplies2.52.5/3.3V
Terminal FinishTin/Lead (Sn63Pb37)
RAM Size5kB
Programmable Logic TypeLOADABLE PLD
Output FunctionMIXED
Frequency (Max)200MHz
Memory Size2.5kB
Propagation Delay0.6 ns
Number Of Gates199000
Number Of Logic Elements/Cells2880
Number Of Logic Blocks (LABs)360
EPF10K50EFC484-2 Export Classifications & Environmental
ParameterValue
RoHS StatusRoHS Compliant
JESD-609 Codee0
HTSUS8542.39.0001
Moisture Sensitivity Level (MSL)3 (168 Hours)
ECCN Code3A991

Product FAQ

Targeted answers for buyers verifying the exact EPF10K50EFC484-2 ordering code, packaging, stock, datasheet, and replacement path.

What does EPF10K50EFC484-2 mean?

EPF10K50EFC484-2 is the exact ordering code listed for a Embedded - FPGAs (Field Programmable Gate Array) component from Intel. The current package reference is -, with listed context including IC FPGA 220 I/O 484FBGA. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the EPF10K50EFC484-2 ordering code?

Treat EPF10K50EFC484-2 as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Intel, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is EPF10K50EFC484-2 supplied in?

EPF10K50EFC484-2 is currently listed with package reference - from Intel. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is EPF10K50EFC484-2 currently available?

EPF10K50EFC484-2 is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (48724), available quantity (19353), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare EPF10K50EFC484-2 alternatives?

A mapped alternative list is not currently published for EPF10K50EFC484-2. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.