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EP9307-IR Embedded - Microprocessors by Cirrus Logic

EP9307-IR is a Embedded - Microprocessors from Cirrus Logic in manufacturer-listed packaging. It is commonly reviewed for IC MPU EP9 200MHZ 272TFBGA. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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EP9307-IR Embedded - Microprocessors by Cirrus Logic | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

EP9307-IR

Internal code

TCE000117473

Package

-

Manufacturer
Cirrus Logic

Key specifications

Series

EP9

Min Quantity

1

Description

IC MPU EP9 200MHZ 272TFBGA

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for EP9307-IR before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: EP9307-IR
  • Package to verify: -

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Technical parameters

Parameters

Compare grouped EP9307-IR parameters from Cirrus Logic, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Export Classifications & Environmental

    JESD-609 Code

    e0

  • Export Classifications & Environmental

    RoHS Status

    Non-RoHS Compliant

  • Export Classifications & Environmental

    Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Product Parameter

    Terminal Finish

    Tin/Lead (Sn/Pb)

  • Product Parameter

    UPs/UCs/Peripheral ICs Type

    MICROPROCESSOR, RISC

  • Product Parameter

    Time At Peak Reflow Temperature (Max)

    NOT SPECIFIED

EP9307-IR Export Classifications & Environmental
ParameterValue
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e0
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

Non-RoHS Compliant
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

3 (168 Hours)
EP9307-IR Product Parameter
ParameterValue
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Tin/Lead (Sn/Pb)
UPs/UCs/Peripheral ICs Type

Specifies the functional category of the integrated circuit, such as microprocessor, microcontroller, or peripheral controller. This classification helps engineers quickly identify the device's role in a system. Verify the exact type against the datasheet to ensure compatibility with your application's processing and interface requirements.

MICROPROCESSOR, RISC
Time At Peak Reflow Temperature (Max)

Specifies the maximum duration a component can withstand at the peak reflow temperature during soldering. Critical for evaluating solder joint reliability and preventing thermal damage. Verify against the datasheet's recommended soldering profile to ensure proper assembly.

NOT SPECIFIED
Bit Size

Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements.

32
Data Bus Width

Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance.

32b
Boundary Scan

Indicates whether the device supports JTAG boundary scan for testing interconnections and internal logic. Useful for board-level testing and debugging. Confirm the boundary scan description in the datasheet to ensure compatibility with your test tools and chain configuration.

YES
Supply Voltage Limit-Max

Specifies the absolute maximum supply voltage that can be applied to the device without causing damage or malfunction. Engineers must verify this limit against the datasheet to ensure safe operating conditions and avoid overvoltage stress in the application.

YES
Integrated Cache

Shows whether the component includes an integrated cache memory to speed up data access for the processor. Compare cache presence and size to assess performance for real-time or high-throughput tasks. Verify details in the datasheet.

YES
Peak Reflow Temperature-Max (S)

Specifies the maximum duration in seconds that a component can withstand at its peak reflow temperature during soldering. Critical for PCB assembly process control to prevent thermal damage. Verify against the datasheet for your specific soldering profile.

ARM
UART Channel Count

Number of independent UART interfaces for serial communication. Each channel supports bidirectional data transfer with configurable baud rate. Ensure the count meets your connectivity needs for peripherals, debugging, or inter-processor links. Verify pin availability in the datasheet.

FLOATING POINT
Frequency Compensation Method

Technique used to ensure amplifier stability and prevent oscillation. Common methods include internal or external compensation. Choose the right method for your gain configuration and bandwidth needs. Verify stability in your circuit with the recommended compensation network from the datasheet.

1
Standby Voltage-Min

Specifies the minimum supply voltage required for the device to maintain standby operation. This is crucial for low-power designs where the component must retain state or wake-up capability. Check this value against your power rail to ensure reliable standby performance and avoid unintended shutdown.

Yes
Ti

Ti is a specific parameter value for this component. Engineers compare it to datasheet specifications to ensure the part meets design requirements. Verify Ti against the manufacturer's datasheet for your application.

AC'97, I2S, IrDA, SPI, UART
Number Of Ethernet Channels

Indicates how many independent Ethernet interfaces the component supports. Compare this with your system's networking requirements to ensure sufficient connectivity. Verify against the datasheet for exact port configurations and supported protocols.

1/10/100Mbps (1)
Number Of Serial I/Os

Indicates the total count of serial input/output lines available on the component. Compare this specification when selecting microcontrollers, FPGAs, or interface ICs to ensure sufficient connectivity for your communication peripherals. Verify against the datasheet pinout and alternate function mappings.

200 μs
Manufacturer

Identifies the brand or company that fabricated the electronic component. Buyers and engineers use this to verify sourcing, quality standards, and datasheet availability. Always confirm the manufacturer matches the part number and packaging for authenticity.

ARM920T
RAM Size

Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering.

4B
EP9307-IR Product Attribute
ParameterValue
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tray
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Contains Lead
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2004
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Obsolete
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

CMOS
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

0.8mm
Qualification Status

Shows if the component meets a specific industry standard or reliability level. Buyers should verify this against the datasheet to ensure the part is suitable for their application's environmental and performance requirements.

Not Qualified
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-40°C~85°C TA
Terminal Form

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

BALL
Number Of Cores/Bus Width

Specifies the number of processor cores and the width of the data bus in bits. This determines the processing capability and data throughput of the component. Compare with your system requirements and verify against the datasheet for compatibility.

1 Core 32-Bit
Voltage - I/O

I/O interface voltage level for digital circuits, microcontrollers, and logic devices. Specifies the voltage range for input and output pins to ensure compatibility with other components. Check datasheet to match logic levels and avoid damage or unreliable operation.

1.8V 3.3V
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Embedded - Microprocessors
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Microprocessors
Surface Mount

Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process.

YES
REACH Compliance Code

Indicates the component's compliance status with the EU REACH regulation. Buyers should verify this code against the manufacturer's declaration to ensure restricted substances are within allowable limits for their target market.

unknown
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

NOT SPECIFIED
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

BOTTOM
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

1.8V
Operating Supply Voltage

Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.

1.8V
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Cirrus Logic
Frequency

Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.

200MHz
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

272
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

272
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

272
Address Bus Width

Specifies the number of address lines used to access memory or registers. Wider buses address more locations, affecting maximum memory capacity. Verify against the datasheet for compatibility with your microcontroller or processor design.

26
Data Interface

Specifies the communication protocol used by the component for data exchange. Common interfaces include I2C, SPI, UART, CAN, and USB. Verify the supported protocol and voltage levels in the datasheet to ensure compatibility with your system design.

Keypad, LCD, Touchscreen
Co-Processors/DSP

Indicates whether the component integrates a co-processor or digital signal processor for specialized tasks. Compare processing capabilities and supported algorithms when selecting devices for compute-intensive applications. Verify architecture and instruction set against your software requirements.

Math Engine; MaverickCrunch™
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

EP9307
Supplied Contents

Indicates the items included in the product package, such as cables, connectors, mounting hardware, or documentation. Verify this list against the datasheet or manual to ensure you have all necessary components for installation and operation.

Hardware ID
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

EP9
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

272-LFBGA
Connector Type

Specifies the connector series or family, such as USB, RJ45, or D-Sub. This determines mechanical compatibility, pin layout, and mating standards. Verify against the datasheet to ensure the connector matches your board design and mating counterpart.

SDRAM
Interface

Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in.

Ethernet, SPI, UART, USB
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

EP9307-IR
EP9307-IR Parameter
ParameterValue
Supply Voltage - Max

Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the application's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings, as exceeding this limit may cause permanent failure.

USB 2.0 (3)

Datasheet preview

Datasheet PDF viewer

Preview the EP9307-IR datasheet from Cirrus Logic to check package, electrical characteristics, application notes, and document evidence before RFQ.

Cirrus Logic

EP9307-IR

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Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for EP9307-IR. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact EP9307-IR ordering code, packaging, stock, datasheet, and replacement path.

What does EP9307-IR mean?

EP9307-IR is the exact ordering code listed for a Embedded - Microprocessors component from Cirrus Logic. The current package reference is -, with listed context including IC MPU EP9 200MHZ 272TFBGA. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the EP9307-IR ordering code?

Treat EP9307-IR as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Cirrus Logic, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is EP9307-IR supplied in?

EP9307-IR is currently listed with package reference - from Cirrus Logic. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is EP9307-IR currently available?

EP9307-IR is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (56292), available quantity (25157), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare EP9307-IR alternatives?

A mapped alternative list is not currently published for EP9307-IR. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.