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MC14023BDR2G Logic - Gates and Inverters by ON Semiconductor

MC14023BDR2G is a Logic - Gates and Inverters from ON Semiconductor in 14SOIC packaging. It is commonly reviewed for IC GATE NAND 3CH 3-INP 14SOIC. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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MC14023BDR2G Logic - Gates and Inverters by ON Semiconductor | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

MC14023BDR2G

Internal code

TCE000117350

Package

14SOIC

Manufacturer
ON Semiconductor

Key specifications

Series

4000B

Min Quantity

1

Description

IC GATE NAND 3CH 3-INP 14SOIC

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for MC14023BDR2G before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: MC14023BDR2G
  • Package to verify: 14SOIC

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Product overview

Product overview

Review the sourcing context for MC14023BDR2G from ON Semiconductor, including product identity, application fit, package notes, and purchasing considerations.

B-Suffix Series CMOS Gates
The B Series logic gates are constructed with P and N channel enhancement mode devices in a single monolithic structure (Complementary MOS).
Their primary use is where low power dissipation and/or high noise immunity is desired.
Features
• Supply Voltage Range = 3.0 Vdc to 18 Vdc
• All Outputs Buffered
• Capable of Driving Two Low−power TTL Loads or One Low−power Schottky TTL Load Over the Rated Temperature Range.
• Double Diode Protection on All Inputs Except: Triple Diode Protection on MC14011B and MC14081B
• Pin−for−Pin Replacements for Corresponding CD4000 Series B Suffix Devices

These Devices are Pb−Free and are RoHS Compliant
• NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable

Technical parameters

Parameters

Compare grouped MC14023BDR2G parameters from ON Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Export Classifications & Environmental

    JESD-609 Code

    e3

  • Export Classifications & Environmental

    Moisture Sensitivity Level (MSL)

    1 (Unlimited)

  • Export Classifications & Environmental

    RoHS Status

    ROHS3 Compliant

  • Export Classifications & Environmental

    REACH SVHC

    No SVHC

  • Export Classifications & Environmental

    HTSUS

    8542.39.0001

  • Export Classifications & Environmental

    ECCN Code

    EAR99

MC14023BDR2G Export Classifications & Environmental
ParameterValue
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

1 (Unlimited)
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
REACH SVHC

Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.

No SVHC
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.39.0001
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99
MC14023BDR2G Product Attribute
ParameterValue
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Active
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Lifecycle Status

Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.

ACTIVE (Last Updated: 2 days ago)
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2006
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tape & Reel (TR)
Halogen Free

Confirms whether the component is manufactured without halogenated compounds, such as bromine or chlorine, which are restricted in many industries due to environmental and safety regulations. Important for compliance with green standards and for use in sensitive applications.

Halogen Free
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-55°C~125°C
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

DUAL
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

260
Terminal Form

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

GULL WING
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

5V
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

CMOS
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

2 Weeks
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

8.65mm
Packing Method

Specifies the packaging format for delivery, such as tube, reel, tray, or tape and reel. This affects handling, storage, and assembly processes. Verify the packing method against your production requirements and the datasheet to ensure compatibility with your pick-and-place equipment.

TAPE AND REEL
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

ON Semiconductor
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

14-SOIC (0.154, 3.90mm Width)
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

4000B
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

No
Reflow Temperature-Max (S)

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

40
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

14
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

14
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

14
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Surface Mount
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Number Of Outputs

Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.

1
Number Of Functions

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

3
Load Capacitance

Specifies the capacitive load the component is designed to drive, affecting signal integrity and timing. Compare this value with your circuit's trace and input capacitance to ensure stable operation. Verify against the datasheet for optimal performance.

50pF
Quiescent Current

Quiescent current is the current drawn by the device when it is in standby or no-load condition. It affects battery life in portable applications. Compare this value across similar components to ensure low power consumption. Always verify against the datasheet for your specific operating conditions.

1μA
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Gates
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Logic - Gates and Inverters
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

MC14023BDR2G
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

4023
MC14023BDR2G Product Parameter
ParameterValue
Propagation Delay

Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.

100 ns
Turn On Delay Time

Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.

300 ns
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Tin (Sn)
Supply Voltage-Min (Vsup)

Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures.

3V
Schmitt Trigger

Indicates whether the component includes a Schmitt trigger input, which provides hysteresis for noise-immune switching. This is important for digital inputs with slow or noisy signals. Verify this feature in the datasheet to ensure reliable logic level transitions in your application.

No
Supply Voltage

Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.

3V~18V
Number Of Elements

Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements.

3
Logic Type

Specifies the logic family or functional type of the integrated circuit, such as AND, OR, inverter, or buffer. This determines voltage levels, speed, and compatibility with other logic families. Verify the exact type against the datasheet to ensure correct circuit operation and signal integrity.

NAND Gate
Logic Function

Specifies the Boolean operation performed by the logic IC, such as AND, OR, NAND, or XOR. Engineers compare this to match the required signal processing in their circuit. Verify the exact function against the datasheet to ensure correct logic behavior.

NAND
Logic Level - High

Specifies the minimum input voltage recognized as a logic high for digital ICs. Compare with the device's supply voltage and output levels to ensure proper interfacing. Verify against the datasheet's electrical characteristics table.

3.5V ~ 11V
Logic Level - Low

Voltage threshold that defines a logic low input for digital ICs. Essential for interfacing with microcontrollers and other logic families. Check datasheet to ensure signal compatibility and avoid unreliable switching.

1.5V ~ 4V
Max Propagation Delay @ V, Max CL

Specifies the worst-case time for a signal to travel through the device from input to output, measured at a given supply voltage and load capacitance. Compare this value with your system's timing budget to ensure reliable operation, and verify it against the datasheet for your specific operating conditions.

100ns @ 15V, 50pF
Output Current High/Low

Specifies the maximum current the output can source or sink in high and low logic states. Compare with the load requirements to ensure reliable logic levels. Verify against the datasheet for absolute maximum ratings and derating conditions.

8.8mA 8.8mA

Datasheet preview

Datasheet PDF viewer

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Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for MC14023BDR2G. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact MC14023BDR2G ordering code, packaging, stock, datasheet, and replacement path.

What does MC14023BDR2G mean?

MC14023BDR2G is the exact ordering code listed for a Logic - Gates and Inverters component from ON Semiconductor. The current package reference is 14SOIC, with listed context including IC GATE NAND 3CH 3-INP 14SOIC. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the MC14023BDR2G ordering code?

Treat MC14023BDR2G as the full ordering code during RFQ and engineering review. Confirm the listed 14SOIC package, manufacturer documentation from ON Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is MC14023BDR2G supplied in?

MC14023BDR2G is currently listed with package reference 14SOIC from ON Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is MC14023BDR2G currently available?

MC14023BDR2G is currently marked with stock availability on this page. Before ordering, confirm the package (14SOIC), listed stock (10780), available quantity (10173), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare MC14023BDR2G alternatives?

A mapped alternative list is not currently published for MC14023BDR2G. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.