MAX4854HETE+T Interface - Analog Switches, Multiplexers, Demultiplexers by Maxim Integrated

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges.

Charge injection is the amount of charge transferred into a load during switching. It affects glitch energy and settling accuracy in sample-and-hold circuits. Compare values when selecting analog switches or multiplexers, and verify against the datasheet for your operating conditions.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

Specifies the total number of independent electrical paths or circuits within the component. This is critical for connectors, switches, and relay arrays to match the required wiring scheme. Always verify against the datasheet to ensure the circuit count meets your application's needs.

Specifies the number of output positions per pole in a switch, such as SPST or DPDT. This determines the switching logic and circuit routing. Verify against the datasheet to ensure the switch matches your application's required contact arrangement and signal path.

Indicates the frequency range where the component's gain or response remains within 3 dB of its nominal value. Engineers compare this to ensure signal fidelity in amplifiers, filters, and communication circuits. Verify against the datasheet for your operating frequency.

Maximum current drawn from the power supply under specified operating conditions. Compare this value across similar components to estimate power consumption and thermal load. Always verify against the datasheet for your exact supply voltage and load scenario.

Specifies the single positive supply voltage required for the component's operation. This is a key parameter for power design and compatibility. Always verify the absolute maximum ratings and recommended operating range in the datasheet to avoid damage and ensure stable performance.

Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation.

Maximum turn-on and turn-off time for the switching device. Compare this parameter when evaluating switching speed for power supplies or converters. Verify against the datasheet under specified test conditions to ensure it meets your application's timing requirements.

Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Defines the electrical configuration of a switch, such as SPST, SPDT, or DPDT, indicating how many poles and throws are available. This determines the switching logic and wiring options in your circuit design. Always check the datasheet for contact ratings.

Specifies the nominal resistance between isolated circuits when the component is off. Higher values indicate better isolation and lower leakage. Verify this parameter against the datasheet for applications requiring high voltage or safety isolation.

Defines the switch topology, such as 2:1, 4:1, or 8:1, indicating how many inputs are routed to outputs. Essential for selecting the correct multiplexer for signal routing in your design. Check the datasheet for channel count and switching characteristics.

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Maximum leakage current flowing through the switch when it is in the off state. This parameter affects power consumption and signal integrity in high-impedance circuits. Compare values to ensure the device meets your system's standby or off-state requirements, and verify against the datasheet for operating conditions.

Capacitance between source and drain terminals when the switch is off. This parasitic capacitance affects high-frequency performance, switching speed, and signal integrity. Lower values are preferred for RF and high-speed digital applications. Verify against datasheet for voltage and frequency conditions.

Indicates the nominal matching of on-state resistance between multiple channels in a device, such as a dual MOSFET or analog switch. This parameter is critical for parallel operation and current sharing. Verify the specified match against the datasheet to ensure balanced performance.

Indicates the maximum difference in on-resistance between any two channels in a multi-channel switch or multiplexer. This parameter affects signal integrity and accuracy in analog routing applications. Compare this value when selecting devices for precision measurement or audio systems.

Unwanted signal coupling between adjacent channels in a multi-channel device. This parameter indicates how much a signal on one channel can interfere with another. Critical for analog switches, multiplexers, and audio or precision measurement applications. Check datasheet for frequency-dependent behavior.

Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections.

Indicates the required power source, such as AC or DC, for the component. Engineers compare this to ensure compatibility with the system's power architecture. Verify the supply type against the datasheet to avoid incorrect power connections.

Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.

Measures the time from when the turn-off command is applied to when the device actually begins to switch off. This delay affects switching losses and timing in power circuits. Engineers compare this parameter to ensure proper synchronization and to minimize power dissipation during high-frequency operation.

Maximum time from signal arrival at the receive input to its appearance at the output. Compare this delay across devices to ensure timing margins in your system. Verify against the datasheet for your operating conditions.

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.