LCMXO1200C-3TN100C Embedded - FPGAs (Field Programmable Gate Array) by Lattice Semiconductor

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Specifies the maximum duration a component can withstand at the peak reflow temperature during soldering. Critical for evaluating solder joint reliability and preventing thermal damage. Verify against the datasheet's recommended soldering profile to ensure proper assembly.

Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.

Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.

Describes the logical or electrical function performed by the output pin, such as push-pull, open-drain, or tri-state. This affects how the output interfaces with other circuits. Verify the output type and drive capability in the datasheet.

Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.

Specifies the architecture of the programmable logic device, such as FPGA or CPLD. This determines the design methodology, configuration storage, and typical application complexity. Verify the exact family and part number in the datasheet to ensure compatibility with your development tools and system requirements.

Indicates the total count of programmable logic elements or cells in the FPGA or CPLD. This parameter determines the device's logic capacity and complexity. Compare this value with your design requirements to ensure sufficient resources. Always verify against the datasheet for exact specifications.

Total amount of random-access memory available on the device, expressed in bits. This determines the data storage capacity for buffering, lookup tables, or configuration. Compare with your application's memory footprint to ensure sufficient resources for operation.

Indicates the count of logic array blocks or configurable logic blocks in an FPGA or CPLD. This metric helps compare logic capacity and complexity across devices. Verify against the datasheet for your specific design requirements.

This is the on-state resistance between the drain and source terminals of a MOSFET. It affects power dissipation and efficiency. Lower values are preferred for high-current switching. Always check the datasheet for the specified test conditions, as RDS(on) varies with gate voltage and temperature.

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Harmonized Tariff Schedule code used for customs classification of electronic components. Helps determine duties and regulatory requirements. Buyers should confirm the code with a customs broker for accurate shipping.

Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity.

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

The amount of current the device draws from its power supply during normal operation. This is essential for power budget calculations, thermal management, and selecting appropriate power sources. Check datasheet for typical and maximum values under specified conditions.

Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed.

Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.

Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

Specifies the count of input pins reserved for dedicated functions on programmable logic devices. Compare this number when selecting FPGAs or CPLDs to ensure sufficient dedicated inputs for your design. Verify against the datasheet pinout to avoid conflicts with configurable I/O.

Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.