MC74ACT273DTR2 Logic - Flip Flops by ON Semiconductor

Specifies the logical or operational function of the component, such as switching, amplification, or regulation. This attribute helps identify the device's role in a circuit. Verify the function against the datasheet to ensure it matches your application requirements.

Highest supply voltage at which the component can operate normally without damage or performance degradation. Exceeding this limit may cause overheating or failure. Always check this parameter against your power supply design to ensure the component operates within its safe voltage range for reliable long-term performance.

Number of turns in a coil or winding. Affects inductance, transformer ratio, and impedance. Critical for designing transformers, inductors, and magnetic components. Check datasheet for tolerance.

Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency.

Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies.

Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application.

Specifies the lowest supply voltage at which the component remains fully functional. Compare this value with your system's power rail tolerance and verify it against the datasheet's recommended operating conditions to ensure reliable startup and operation.

Indicates the nominal matching of on-state resistance between multiple channels in a device, such as a dual MOSFET or analog switch. This parameter is critical for parallel operation and current sharing. Verify the specified match against the datasheet to ensure balanced performance.

Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation.

Specifies the lowest switching frequency at which the power device can operate reliably. Compare this value with your application's required switching speed to ensure proper performance. Verify against the datasheet's recommended operating conditions.

Specifies the physical medium through which signals travel, such as fiber optic, twisted pair, or coaxial cable. This attribute is critical for ensuring compatibility with your network infrastructure and for meeting performance requirements. Verify the media type against your system's specifications and the component datasheet to avoid signal integrity issues.

Specifies the maximum continuous voltage the component can safely withstand without damage or performance degradation. Critical for ensuring proper operating margins in power supplies, signal lines, and isolation barriers. Always confirm with the datasheet for absolute maximum ratings.

Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements.

Highest data transfer rate the component can reliably support, typically in bits per second. This is critical for serial interfaces, modems, or transceivers. Ensure your application's required data throughput does not exceed this limit to avoid communication errors and performance degradation.

Select the diode classification such as Schottky, Zener, or standard rectifier. This defines the device's electrical behavior and typical applications. Verify the exact type against the datasheet to ensure it meets your circuit requirements for voltage, current, and switching speed.

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Specifies the maximum duration a component can withstand at the peak reflow temperature during soldering. Critical for evaluating solder joint reliability and preventing thermal damage. Verify against the datasheet's recommended soldering profile to ensure proper assembly.

This attribute provides the component description from the Samacsys library. It summarizes key specifications and features for quick identification. Review it to understand the part's function and compare with the datasheet for detailed parameters.

Typical switching frequency of a power converter or driver. Compare this value to your application's needs to ensure efficient operation. Verify against the datasheet for exact conditions.

Select the primary classification that best describes the component type, such as semiconductor, passive, connector, or module. This helps narrow down the catalog and ensures you compare products within the same functional family. Verify the category matches the datasheet description.

Specifies the highest resistance a diode offers in the forward conduction state. Compare this value when selecting diodes for low-loss power paths or signal switching. Verify against the datasheet under specified test conditions, as forward resistance affects efficiency and heat dissipation.

Maximum power the component can safely dissipate as heat under specified conditions. Compare this rating with your circuit's expected power loss to ensure reliable operation. Verify against the datasheet for derating curves and ambient temperature limits.

Core supply voltage for digital ICs, microcontrollers, or processors. This is the main rail powering the internal logic. Engineers must match it to the power design to avoid damage or malfunction. Always check the datasheet for absolute maximum ratings.

Total gate charge required to switch the device from off to fully on. Lower Qg means faster switching and lower drive losses. Essential for MOSFET and IGBT selection in high-frequency power converters. Compare with gate driver capability to ensure efficient switching.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Specifies the maximum current the output can sink when in a low logic state. Compare this with your load requirements to ensure reliable operation. Verify against the datasheet for absolute maximum ratings and thermal conditions.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

Specifies the physical size of the component body, either its length for rectangular parts or diameter for cylindrical ones. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure clearance and proper mounting in your enclosure or assembly.

Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation.

Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.

Indicates the product family or series to which the component belongs. Helps identify related parts with similar characteristics. Verify the family name against the manufacturer's datasheet to ensure compatibility and correct sourcing.

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

Describes special mechanical characteristics for mounting, such as through-hole, surface mount, or specific clips. Ensures compatibility with your PCB layout and assembly process. Confirm before designing the footprint.

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

Review the complete technical specifications for this electronic component, including electrical ratings, mechanical dimensions, and environmental limits. Verify these parameters against your application requirements and the manufacturer's datasheet to ensure compatibility and reliable operation.

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure.

Indicates the locking mechanism used to secure the connector or terminal in place. Choose the appropriate type for your application to ensure reliable mating and vibration resistance. Verify compatibility with the mating part and datasheet specifications.

Indicates the component's compliance status with the EU REACH regulation. Buyers should verify this code against the manufacturer's declaration to ensure restricted substances are within allowable limits for their target market.

Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.

Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.

Height above board is the vertical distance from the PCB surface to the top of the component. This dimension is essential for mechanical fit in enclosures and for ensuring clearance under other components. Always check this value against your assembly's height constraints.

The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature.

Specifies the communication protocol used by the component to exchange data with a host controller or other devices. Common examples include I2C, SPI, UART, USB, and CAN. Verify compatibility with your system's bus architecture and voltage levels before integration.

Select the broad classification that best matches the component type, such as capacitor, resistor, connector, or IC. This helps filter the catalog and ensures you compare similar parts. Verify the category against the manufacturer's datasheet or product page.

Indicates the total count of programmable logic elements or blocks in an FPGA, CPLD, or similar device. This figure directly impacts the complexity of designs the component can implement. Engineers compare this value to estimate logic capacity and resource availability for their specific application requirements.

Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment.

Specifies the coil's operational mode, such as latching or non-latching. This determines how the relay or solenoid maintains its state after power is removed. Verify the coil type against your circuit requirements to ensure proper latching behavior and power consumption.

Specifies the metal alloy used for the electrical contact surfaces, affecting conductivity, wear resistance, and corrosion behavior. Compare materials like silver, gold, or palladium for signal integrity and durability. Verify against datasheet for application-specific requirements.

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.