
CD74HCT365MT Logic - Buffers, Drivers, Receivers, Transceivers by Texas Instruments
CD74HCT365MT is a Logic - Buffers, Drivers, Receivers, Transceivers from Texas Instruments in 16SOIC packaging. It is commonly reviewed for IC BUF NON-INVERT 5.5V 16SOIC. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
Pictures are for reference only. Please contact us for the latest pictures.

- 365-Day GuaranteeAfter-sales support helps buyers handle quality questions with a clearer return and review window.
- Ships within 24-48 HoursAvailable items can move quickly once the quote, quantity, and delivery details are confirmed.
- 100% Anti-Counterfeit TestedParts are checked through authenticity-focused handling and inspection before shipment.
Key specifications
- Part Number
CD74HCT365MT
- Internal code
TCE000106106
- Package
16SOIC
- Manufacturer
- Texas Instruments
Key specifications
- Series
74HCT
- Min Quantity
1
- Category
- Integrated Circuits (ICs)
- Sub Category
- Logic - Buffers, Drivers, Receivers, Transceivers
- Description
IC BUF NON-INVERT 5.5V 16SOIC
- key Attributes
-
Trust signals
Quality and trust signals
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for CD74HCT365MT before RFQ, PO release, and shipment planning.
- 1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
- 2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
- 3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
- 4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
- Exact MPN confirmed: CD74HCT365MT
- Package to verify: 16SOIC
Commercial confirmation
- Live stock and lead time confirmed by RFQ
- Final price and tax terms confirmed before PO release
Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for CD74HCT365MT from Texas Instruments, including product identity, application fit, package notes, and purchasing considerations.
The Harris CD74HC373, CD74HCT373, CD54HC573, CD74HC573, and CD74HCT573 are high speed Octal Transparent Latches manufactured with silicon gate CMOS technology. They possess the low power consumption of standard CMOS integrated circuits, as well as the ability to drive 15 LSTTL devices. The CD74HCT373 and CD74HCT573 are functionally as well as pin compatible with the standard 74LS373 and 74LS573.
Features
• Common Latch Enable Control
• Common Three-State Output Enable Control
• Buffered Inputs
• Three-State Outputs
• Bus Line Driving Capacity
• Typical Propagation Delay = 12ns at VCC= 5V, CL= 15pF, TA= 25°C (Data to Output for HC373)
• Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . -55°C to 125°C
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL Logic ICs
• HC Types - 2V to 6V Operation - High Noise Immunity: NIL= 30%, NIH= 30% of VCC at VCC= 5V
• HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH= 2V (Min) - CMOS Input Compatibility, Il ≤1µA at VOL, VOH
Technical parameters
Parameters
Compare grouped CD74HCT365MT parameters from Texas Instruments, including package, series, key attributes, and technical values used for engineering and sourcing review.
Export Classifications & Environmental
RoHS Status
ROHS3 Compliant
Export Classifications & Environmental
REACH SVHC
No SVHC
Export Classifications & Environmental
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Export Classifications & Environmental
JESD-609 Code
e4
Product Attribute
Lead Free
Lead Free
Product Attribute
Mounting Type
Surface Mount
| Parameter | Value |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
REACH SVHC Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status. | No SVHC |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 1 (Unlimited) |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e4 |
| Parameter | Value |
|---|---|
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tape & Reel (TR) |
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Obsolete |
Termination Describes the method used to connect the component to the circuit board, such as solder, press-fit, or wire wrap. This affects assembly processes, reliability, and repairability. Check the termination type against your PCB footprint and soldering process to ensure compatibility. | SMD/SMT |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Terminal Position Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line. | DUAL |
Peak Reflow Temperature (Cel) Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level. | 260 |
Terminal Form Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint. | GULL WING |
Supply Voltage Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage. | 5V |
Technology Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions. | CMOS |
Qualification Status Shows if the component meets a specific industry standard or reliability level. Buyers should verify this against the datasheet to ensure the part is suitable for their application's environmental and performance requirements. | Not Qualified |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Texas |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -55°C~125°C TA |
Polarity Specifies whether the component or signal has a defined positive and negative orientation, such as for diodes, electrolytic capacitors, or connectors. Incorrect polarity can cause failure or unsafe operation. Always check the datasheet and board markings before installation. | Non-Inverting |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 16-SOIC (0.154, 3.90mm Width) |
Packing Method Specifies the packaging format for delivery, such as tube, reel, tray, or tape and reel. This affects handling, storage, and assembly processes. Verify the packing method against your production requirements and the datasheet to ensure compatibility with your pick-and-place equipment. | TAPE AND REEL |
Width Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure. | 3.9mm |
Quiescent Current Quiescent current is the current drawn by the device when it is in standby or no-load condition. It affects battery life in portable applications. Compare this value across similar components to ensure low power consumption. Always verify against the datasheet for your specific operating conditions. | 8μA |
Subcategory A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications. | Bus Driver/Transceivers |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Logic - Buffers, Drivers, Receivers, Transceivers |
Contact Plating Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment. | Gold |
Number Of Functions Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements. | 1 |
Operating Supply Voltage Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction. | 5V |
Number Of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 16 |
Pin Count Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process. | 16 |
Number Of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 16 |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Surface Mount |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | yes |
Length Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design. | 9.9mm |
Load Capacitance Specifies the capacitive load the component is designed to drive, affecting signal integrity and timing. Compare this value with your circuit's trace and input capacitance to ensure stable operation. Verify against the datasheet for optimal performance. | 50pF |
Number Of Ports Indicates how many independent connection points or interfaces the component provides. Compare this when selecting connectors, switches, or modules for multi-channel designs. Verify against the datasheet to ensure the port count matches your system's required I/O configuration. | 2 |
Output Type Specifies the electrical form of the output signal, such as digital, analog, or open collector. This determines how the component interfaces with your circuit. Verify the output type against your system requirements and the datasheet to ensure proper signal compatibility and avoid logic level mismatches. | 3-State |
Number Of Outputs Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration. | 6 |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | 74HCT |
Additional Feature Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts. | WITH DUAL OUTPUT ENABLE |
Number Of Bits Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs. | 6 |
Power Rating Specifies the maximum power the component can safely dissipate under defined operating conditions. Compare this value with your circuit's power requirements to prevent overheating and ensure reliable operation. Always verify against the datasheet for derating curves and ambient temperature limits. | HCT |
Base Part Number Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in. | 74HCT365 |
Propagation Delay At Nominal Supply Time from input transition to output response under nominal supply voltage. Compare across devices to gauge speed for timing-critical logic. Verify against datasheet conditions, including load capacitance and temperature, as these affect measured delay. | 38 ns |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | CD74HCT365MT |
| Parameter | Value |
|---|---|
Propagation Delay Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance. | 25 ns |
Power Supplies Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues. | 5V |
Number Of Elements Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements. | 1 |
Number Of Channels Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections. | 6 |
Time At Peak Reflow Temperature (Max) Specifies the maximum duration a component can withstand at the peak reflow temperature during soldering. Critical for evaluating solder joint reliability and preventing thermal damage. Verify against the datasheet's recommended soldering profile to ensure proper assembly. | NOT SPECIFIED |
Supply Voltage Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage. | 4.5V~5.5V |
Logic Type Specifies the logic family or functional type of the integrated circuit, such as AND, OR, inverter, or buffer. This determines voltage levels, speed, and compatibility with other logic families. Verify the exact type against the datasheet to ensure correct circuit operation and signal integrity. | Buffer, Non-Inverting |
Logic Function Specifies the Boolean operation performed by the logic IC, such as AND, OR, NAND, or XOR. Engineers compare this to match the required signal processing in their circuit. Verify the exact function against the datasheet to ensure correct logic behavior. | Buffer, Inverting |
Output Current High/Low Specifies the maximum current the output can source or sink in high and low logic states. Compare with the load requirements to ensure reliable logic levels. Verify against the datasheet for absolute maximum ratings and derating conditions. | 4mA 4mA |
Turn On Delay Time Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions. | 53 ns |
Max Input Voltage (DC) Specifies the highest DC voltage that can be safely applied to the input terminals without damaging the component. Verify this limit against the datasheet to ensure your power supply or signal source stays within the safe operating area for reliable performance. | ENABLE LOW |
Minimum Breakdown Voltage Specifies the lowest voltage at which the component begins to conduct in reverse or breakdown mode. Compare this value with the operating voltage to ensure sufficient margin. Verify against the datasheet for temperature and tolerance effects. | 0.004 A |
Notice documents
PCN / product notice documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for CD74HCT365MT. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
Recommended products
Explore related Logic - Buffers, Drivers, Receivers, Transceivers products to compare fit, stock status, datasheets, and sourcing options.
Common questions
Product FAQ
Targeted answers for buyers verifying the exact CD74HCT365MT ordering code, packaging, stock, datasheet, and replacement path.
What does CD74HCT365MT mean?
CD74HCT365MT is the exact ordering code listed for a Logic - Buffers, Drivers, Receivers, Transceivers component from Texas Instruments. The current package reference is 16SOIC, with listed context including IC BUF NON-INVERT 5.5V 16SOIC. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the CD74HCT365MT ordering code?
Treat CD74HCT365MT as the full ordering code during RFQ and engineering review. Confirm the listed 16SOIC package, manufacturer documentation from Texas Instruments, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is CD74HCT365MT supplied in?
CD74HCT365MT is currently listed with package reference 16SOIC from Texas Instruments. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is CD74HCT365MT currently available?
CD74HCT365MT is currently marked with stock availability on this page. Before ordering, confirm the package (16SOIC), listed stock (14198), available quantity (14198), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare CD74HCT365MT alternatives?
A mapped alternative list is not currently published for CD74HCT365MT. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.





