ADP3419JRMZ-REEL PMIC - Gate Drivers by ON Semiconductor
ADP3419JRMZ-REEL is a PMIC - Gate Drivers from ON Semiconductor in MSOP packaging. It is commonly reviewed for IC MOSFET DVR DUAL BOOTST 10MSOP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
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1
Confirm MPN
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2
Check stock and price
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3
Align documents
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4
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Part confirmation
Exact MPN confirmed: ADP3419JRMZ-REEL
Package to verify: MSOP
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Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for ADP3419JRMZ-REEL from ON Semiconductor, including product identity, application fit, package notes, and purchasing considerations.
ADP3419JRMZ-REEL Description
The ADP3419JRMZ-REEL gate driver includes an anticross-conduction protection circuit, Undervoltage lockout to hold the switches off until the driver has a sufficient voltage for proper operation, a crowbar input that turns on the low-side MOSFET independently of the input signal state, and a low-side MOSFET disable pin to provide higher efficiency at light loads.
ADP3419JRMZ-REEL Features
• All-In-One Synchronous Buck Driver • One PWM Signal Generates Both Drives • Anticross-Conduction Protection Circuitry • Output Disable Function • Crowbar Control • Synchronous Override Control • Undervoltage Lockout • Pb−Free Package is Available
ADP3419JRMZ-REEL Applications
• Mobile Computing CPU Core Power Converters • Multiphase Desk-Note CPU Supplies • Single-Supply Synchronous Buck Converters • Non-Synchronous-to-Synchronous Drive Conversion
Technical parameters
Parameters
Compare grouped ADP3419JRMZ-REEL parameters from ON Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Parameter
Terminal Finish
Tin (Sn)
Product Parameter
Turn On Delay Time
70 ns
Product Parameter
Power Supplies
5V
Product Parameter
Input Type
Non-Inverting
Product Parameter
Driven Configuration
Half-Bridge
Product Parameter
Rise Time
35ns
ADP3419JRMZ-REEL Product Parameter
Parameter
Value
Terminal Finish
Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.
Tin (Sn)
Turn On Delay Time
Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.
70 ns
Power Supplies
Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.
5V
Input Type
Specifies the configuration of the input signal path, such as single-ended or differential. This affects noise immunity and interface compatibility. Verify the input type against your signal source and the datasheet to ensure proper connection and performance.
Non-Inverting
Driven Configuration
Specifies the topology of power switches driven by the controller, such as half-bridge or full-bridge. This determines the circuit's voltage and current handling, efficiency, and application suitability. Verify against the datasheet to ensure the driver matches your power stage design.
Half-Bridge
Rise Time
Time required for a signal to transition from a low to a high level, typically measured between 10% and 90% of the amplitude. Important for digital interfaces, switching regulators, and pulse circuits. Check the datasheet for test conditions and load capacitance.
35ns
Gate Type
Specifies the semiconductor technology used for the gate terminal, such as IGBT or MOSFET. This determines drive requirements, switching speed, and voltage ratings. Verify compatibility with your gate driver and application before selection.
N-Channel MOSFET
Logic Voltage - VIL, VIH
Defines the input voltage thresholds for logic low (VIL) and logic high (VIH) states. Ensure your driving signals exceed VIH and stay below VIL to guarantee correct logic interpretation and noise immunity in your design.
0.8V 2V
Channel Type
Specifies the electrical channel configuration, such as unidirectional or bidirectional, for signal or power routing. This attribute is critical for selecting components like multiplexers, isolators, or level shifters. Verify the channel type against your application requirements and the datasheet to ensure correct signal flow and compatibility.
Synchronous
Propagation Delay
Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.
70 ns
High Side Voltage - Max (Bootstrap)
Specifies the maximum allowable bootstrap voltage for the high-side gate driver. This limit ensures reliable switching and prevents damage to the driver IC. Verify against the datasheet when designing half-bridge or full-bridge circuits, especially at high supply voltages.
30V
Supply Voltage
Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.
This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.
e3
RoHS Status
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
RoHS Compliant
HTSUS
Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.
8542.39.0001
Moisture Sensitivity Level (MSL)
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
3 (168 Hours)
ECCN Code
Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.
EAR99
ADP3419JRMZ-REEL Product Attribute
Parameter
Value
REACH Status
Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.
REACH Unaffected
ECCN
Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.
EAR99
Lead Free
Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.
Lead Free
Mounting Type
Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.
Surface Mount
Published
Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.
2007
Packaging
Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.
Tape & Reel (TR)
Part Status
Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.
Obsolete
Halogen Free
Confirms whether the component is manufactured without halogenated compounds, such as bromine or chlorine, which are restricted in many industries due to environmental and safety regulations. Important for compliance with green standards and for use in sensitive applications.
Halogen Free
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
DUAL
Peak Reflow Temperature (Cel)
Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.
260
Terminal Form
Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.
GULL WING
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
5V
Terminal Pitch
Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.
0.5mm
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
ON Semiconductor
Nominal Supply Current
Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.
800μA
Number Of Functions
Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.
1
Radiation Hardening
Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.
No
Reflow Temperature-Max (S)
Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.
40
Mounting Type
Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.
Surface Mount
Pb-Free Code
Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.
yes
Max Output Current
Specifies the highest continuous current the device can supply at its output without exceeding thermal or electrical limits. Compare this value with your load requirements and derating curves. Always verify against the datasheet for your operating conditions.
1A
Number Of Outputs
Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.
1
Length
Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.
3mm
Width
Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.
3mm
Number Of Pins
Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.
10
Number Of Terminations
Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.
10
Pin Count
Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.
10
Fall Time (Typ)
Typical time for the output signal to transition from 90% to 10% of its amplitude. This parameter indicates switching speed and affects high-frequency performance. Compare with rise time and verify against the datasheet for your specific operating conditions.
25 ns
Max Supply Current
Maximum current drawn from the power supply under specified operating conditions. Compare this value across similar components to estimate power consumption and thermal load. Always verify against the datasheet for your exact supply voltage and load scenario.
1.5mA
High Side Driver
Specifies whether the component integrates a high-side driver for controlling power switches. This is critical for motor control, power conversion, and half-bridge topologies. Verify the driver's voltage rating, current capability, and protection features against your application requirements.
YES
Subcategory
A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.
MOSFET Drivers
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
PMIC - Gate Drivers
Number Of Drivers
Number of independent driver channels integrated into a single IC, such as LED drivers, gate drivers, or motor drivers. Determines how many loads can be controlled. Ensure the count matches your application's requirements for channels and consider current per channel.
2
Operating Temperature
Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.
0°C~150°C TJ
Lifecycle Status
Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.
OBSOLETE (Last Updated: 3 days ago)
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
ADP3419
Manufacturer'S Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
ADP3419JRMZ-REEL
Rise / Fall Time (Typ)
Typical rise and fall time of the output signal, indicating how quickly the device transitions between logic levels. These values affect signal integrity and switching losses. Compare them with your application's required slew rate and check the datasheet for test conditions.
14ns 11ns
Datasheet preview
Datasheet PDF viewer
Preview the ADP3419JRMZ-REEL datasheet from ON Semiconductor to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for ADP3419JRMZ-REEL. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Targeted answers for buyers verifying the exact ADP3419JRMZ-REEL ordering code, packaging, stock, datasheet, and replacement path.
What does ADP3419JRMZ-REEL mean?
ADP3419JRMZ-REEL is the exact ordering code listed for a PMIC - Gate Drivers component from ON Semiconductor. The current package reference is MSOP, with listed context including IC MOSFET DVR DUAL BOOTST 10MSOP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
Is ADP3419JRMZ-REEL the same as ADP3419JRMZ?
ADP3419JRMZ-REEL may share the same base part family as ADP3419JRMZ, but the suffix can identify ordering, reel, tape, packing, or logistics details. Confirm the MSOP package, manufacturer code from ON Semiconductor, datasheet ordering table, and reel quantity before treating the two codes as interchangeable.
What package is ADP3419JRMZ-REEL supplied in?
ADP3419JRMZ-REEL is currently listed with package reference MSOP from ON Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is ADP3419JRMZ-REEL currently available?
ADP3419JRMZ-REEL is currently marked with stock availability on this page. Before ordering, confirm the package (MSOP), listed stock (13484), available quantity (13484), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare ADP3419JRMZ-REEL alternatives?
A mapped alternative list is not currently published for ADP3419JRMZ-REEL. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.