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MC100EP29DT Logic - Flip Flops by ON Semiconductor

MC100EP29DT is a Logic - Flip Flops from ON Semiconductor in TSSOP packaging. It is commonly reviewed for IC FF D-TYPE DUAL 1BIT 20TSSOP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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MC100EP29DT Logic - Flip Flops by ON Semiconductor | TrustCompo
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Key specifications

Part Number

MC100EP29DT

Internal code

TCE000096316

Package

TSSOP

Manufacturer
ON Semiconductor

Key specifications

Series

100EP

Min Quantity

1

Description

IC FF D-TYPE DUAL 1BIT 20TSSOP

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for MC100EP29DT before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: MC100EP29DT
  • Package to verify: TSSOP

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Product overview

Product overview

Review the sourcing context for MC100EP29DT from ON Semiconductor, including product identity, application fit, package notes, and purchasing considerations.


The MC10/100EP29 is a dual master−slave flip−flop.
The device features fully differential Data and Clock inputs as well as outputs.
The MC10/100EP29 is functionally equivalent to the MC10/100EL29. Data enters the master latch when the clock is LOW and transfers to the slave upon a positive transition on the clock input.
Features
• Maximum Frequency > 3 GHz Typical
• 500 ps Typical Propagation Delays
• PECL Mode Operating Range: VCC = 3.0 V to 5.5 V with VEE = 0 V
• NECL Mode Operating Range: VCC = 0 V with VEE = −3.0 V to −5.5 V
• Open Input Default State
• Safety Clamp on Inputs

These are Pb−Free Devices

Technical parameters

Parameters

Compare grouped MC100EP29DT parameters from ON Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Export Classifications & Environmental

    Moisture Sensitivity Level (MSL)

    1 (Unlimited)

  • Export Classifications & Environmental

    RoHS Status

    RoHS non-compliant

  • Export Classifications & Environmental

    JESD-609 Code

    e4

  • Export Classifications & Environmental

    HTSUS

    8542.39.0001

  • Export Classifications & Environmental

    ECCN Code

    EAR99

  • Product Attribute

    REACH Status

    REACH Unaffected

MC100EP29DT Export Classifications & Environmental
ParameterValue
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

1 (Unlimited)
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

RoHS non-compliant
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e4
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.39.0001
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99
MC100EP29DT Product Attribute
ParameterValue
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tube
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2007
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Obsolete
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

DUAL
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

260
Terminal Form

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

GULL WING
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-40°C~85°C TA
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

4.4mm
Polarity

Specifies whether the component or signal has a defined positive and negative orientation, such as for diodes, electrolytic capacitors, or connectors. Incorrect polarity can cause failure or unsafe operation. Always check the datasheet and board markings before installation.

Non-Inverting
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

0.65mm
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

20-TSSOP (0.173, 4.40mm Width)
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

ON Semiconductor
Packing Method

Specifies the packaging format for delivery, such as tube, reel, tray, or tape and reel. This affects handling, storage, and assembly processes. Verify the packing method against your production requirements and the datasheet to ensure compatibility with your pick-and-place equipment.

RAIL
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Logic - Flip Flops
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

FF/Latches
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

No
Reflow Temperature-Max (S)

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

40
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

20
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

20
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Surface Mount
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

3.3V
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

6.5mm
Type

Select the component category that best matches your application, such as resistor, capacitor, diode, or connector. This classification helps narrow down the correct part family and ensures compatibility with your circuit design. Verify the type against the datasheet to avoid mismatches.

D-Type
Number Of Input Lines

Specifies how many separate input channels or signal lines the component can accept. Compare this with your system's required inputs to ensure compatibility. Always verify against the datasheet for exact pin configuration and logic levels.

1
Number Of Bits

Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs.

1
Output Type

Specifies the electrical form of the output signal, such as digital, analog, or open collector. This determines how the component interfaces with your circuit. Verify the output type against your system requirements and the datasheet to ensure proper signal compatibility and avoid logic level mismatches.

Differential
Low Level Output Current

Specifies the current the device can sink when its output is driven to a low logic state. Compare this value with the input current of connected loads to ensure reliable logic levels. Verify against the datasheet for maximum ratings and temperature effects.

50mA
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

ECL
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

100EP
Clock Frequency

Operating frequency of the clock signal that drives the device. Determines processing speed and timing accuracy. Compare with your system's required clock rate and check the datasheet for maximum and typical values.

3GHz
High Level Output Current

Specifies the maximum current the output can source when the logic level is high. This is critical for driving loads such as LEDs, relays, or logic inputs. Check this value against your load requirements to avoid output saturation or damage.

-50mA
Additional Feature

Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

100EP29
Quiescent Current (Iq)

Quiescent current is the supply current consumed by the device when it is enabled but not driving a load. It affects battery life in portable applications. Compare Iq values for low-power designs and verify against the datasheet's test conditions.

57mA
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

MC100EP29DT
MC100EP29DT Product Parameter
ParameterValue
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Nickel/Palladium/Gold (Ni/Pd/Au)
Logic Function

Specifies the Boolean operation performed by the logic IC, such as AND, OR, NAND, or XOR. Engineers compare this to match the required signal processing in their circuit. Verify the exact function against the datasheet to ensure correct logic behavior.

AND, D-Type, Flip-Flop
Function

Specifies the logical or operational function of the component, such as switching, amplification, or regulation. This attribute helps identify the device's role in a circuit. Verify the function against the datasheet to ensure it matches your application requirements.

Set(Preset) and Reset
Supply Voltage-Max (Vsup)

Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings.

5.5V
Number Of Elements

Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements.

2
Supply Voltage-Min (Vsup)

Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures.

3V
Clock Edge Trigger Type

Indicates whether the device samples data on the rising or falling edge of the clock signal. This timing parameter is critical for interfacing with other logic. Verify the required edge against your system's timing diagram and the datasheet to ensure correct synchronization.

Positive Edge
Propagation Delay

Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.

500 ps
Trigger Type

Specifies the input trigger configuration, such as Schmitt trigger, for digital or switching components. This affects noise immunity and signal conditioning. Check the datasheet to confirm the trigger type matches your input signal characteristics and threshold requirements.

Positive, Negative
Supply Voltage

Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.

-3V~-5.5V
Power Supplies

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

-4.5V
Turn On Delay Time

Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.

420 ps

Datasheet preview

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Notice documents

PCN / product notice documents

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No public PCN / PDN records currently displayed

No public product notice document is currently displayed for MC100EP29DT. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact MC100EP29DT ordering code, packaging, stock, datasheet, and replacement path.

What does MC100EP29DT mean?

MC100EP29DT is the exact ordering code listed for a Logic - Flip Flops component from ON Semiconductor. The current package reference is TSSOP, with listed context including IC FF D-TYPE DUAL 1BIT 20TSSOP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the MC100EP29DT ordering code?

Treat MC100EP29DT as the full ordering code during RFQ and engineering review. Confirm the listed TSSOP package, manufacturer documentation from ON Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is MC100EP29DT supplied in?

MC100EP29DT is currently listed with package reference TSSOP from ON Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is MC100EP29DT currently available?

MC100EP29DT is currently marked with stock availability on this page. Before ordering, confirm the package (TSSOP), listed stock (10821), available quantity (10821), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare MC100EP29DT alternatives?

A mapped alternative list is not currently published for MC100EP29DT. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.