Get a Sample
Request engineering samples to evaluate fit, validate alternatives, and keep design decisions moving before a larger order is placed.
Request evaluation samplesHiroseConnectors, InterconnectsRectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Supply original DF9-23S-1V(20), Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board), by Hirose
DF9-23S-1V(20) is a Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) model from Hirose, presented on TrustCompo for buyers who need clear sourcing and review context before RFQ. This listing sits in the Connectors, Interconnects / Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) product path. CONN RECEPT 23POS 1MM SMD TIN. TrustCompo combines the available model, brand, hierarchy, and specification details around DF9-23S-1V(20) so buyers can move faster from review to quotation.
RoHS
Datasheet
Pictures are for reference only. Please contact us for the latest pictures.
Traceability and authenticity checks
Fast RFQ turnaround
Documentation support
Pre-shipment inspection review
Key specifications
Series
DF9
Min Quantity
1
Category
Connectors, InterconnectsDescription
CONN RECEPT 23POS 1MM SMD TIN
key Attributes
-
Datasheet
View DF9-23S-1V(20) DatasheetTechnical document
Open The Official Datasheet
Review the latest datasheet for DF9-23S-1V(20) from Hirose in a separate tab so engineers and buyers can check package, electrical characteristics, and application details without leaving this product page.
Why request a quote
Use the RFQ step to confirm the commercial and documentation details buyers usually need before placing an order.
Confirm stock and lead-time expectations
Check CoC or traceability support
Align inspection and fulfillment details
Trust signals
Globally recognized certifications
Visible certifications work best when they are paired with clear operational promises around traceability, handling, and inspection.
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
Ordering workflow
Understand how to order and what policies support the purchase
Use this section to see the fastest ordering path and the policy pages buyers usually review before confirming a component order.
How to order this product
A simple B2B flow helps engineering and procurement teams move from part review to commercial confirmation.
1
Confirm part and quantity
Review the part number, package, key specs, and target quantity so the quote request reflects the exact sourcing scope your team needs.
2
Send RFQ or sample request
Use Quick Quote for commercial pricing or Request Sample when engineering validation is still in progress and a smaller evaluation quantity is needed.
3
Align delivery, payment, and documentation
Before final release, confirm stock timing, shipment method, payment arrangement, and any traceability or inspection documents required by your process.
Policies buyers usually check
These pages explain the operating rules around samples, shipping, payment, and quality support before you place the order.
Shipping & Delivery
Review shipping origin, carrier options, delivery methods, and the practical factors that affect transit timing for global component orders.
Review shipping detailsPayment Terms
Understand supported payment methods, invoice handling, quote currency, and the commercial boundaries used for international B2B orders.
Review payment termsQuality & Traceability Center
See how incoming inspection, outgoing verification, traceability support, certifications, and additional testing fit into our quality workflow.
Review quality controlsStructured product content
Review The Product The Way Buyers Actually Evaluate It
Review overview, detailed specifications, and related sourcing content in one structured flow without scanning separate oversized sections.
Product overview
Overview
CONN RECEPT 23POS 1MM SMD TIN
Fast scan
Popular Specs Surfaced First
Export Classifications & Environmental
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Export Classifications & Environmental
RoHS Status
Non-RoHS Compliant
Export Classifications & Environmental
ECCN Code
EAR99
Export Classifications & Environmental
JESD-609 Code
e3/e4
Product Attribute
UL Flammability Code
94V-0
Product Attribute
Option
GENERAL PURPOSE
Moisture Sensitivity Level (MSL)
1 (Unlimited)
RoHS Status
Non-RoHS Compliant
ECCN Code
EAR99
JESD-609 Code
e3/e4
UL Flammability Code
94V-0
Option
GENERAL PURPOSE
Filter Feature
NO
Subcategory
Headers and Edge Type Connectors
Flammability Rating
UL94 V-0
Number Of Rows
2
Categories
Connectors, Interconnects
Body Breadth
0.165 inch
Reliability
COMMERCIAL
Number Of Conductors
ONE
Housing Material
Nylon
Additional Feature
POLARIZED
Polarization Key
POLARIZED HOUSING
HTS Code
8536.69.40.40
Packaging
Tube
Contact Gender
Female
Lead Free
Contains Lead
Reference Standard
UL
Mounting Type
Surface Mount
Sub-Categories
Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Contact Material
Copper
Contact Style
BELLOWED TYPE
Published
2003
Insulation Resistance
500000000Ohm
Durability
30 Cycles
PCB Contact Pattern
STAGGERED
Part Status
Obsolete
Connector Type
Receptacle, Outer Shroud Contacts
Rated Current (Signal)
0.5A
Pitch
0.039 1.00mm
Feature
Board Guide, Solder Retention
Contact Resistance
50mOhm
Manufacturer
Hirose
PCB Contact Row Spacing
3.9116 mm
Mount
Surface Mount
Reach Compliance Code
unknown
DIN Conformance
NO
Mixed Contacts
NO
MIL Conformance
NO
IEC Conformance
NO
Contact Finish
Tin
Number Of PCB Rows
2
Housing Color
Beige
Operating Temperature (Max)
85°C
Lead Pitch
1mm
Contact Pattern
STAGGERED
Total Number Of Contacts
23
Number Of Positions
23
Body Length Or Diameter
0.673 inch
Height Above Board
0.130 3.30mm
Series
DF9
Body Depth
0.13 inch
Operating Temperature (Min)
-45°C
Stack Height (Mating)
4.3mm
Manufacturer'S Part No.
DF9-23S-1V(20)
Common questions
Product FAQ
Quick answers for buyers reviewing DF9-23S-1V(20), stock, documentation, and sourcing steps.
What is DF9-23S-1V(20)?
DF9-23S-1V(20) is a Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) component from Hirose. This product page summarizes the core sourcing details buyers need before checking price, availability, documentation, or samples.
What package and description are listed for DF9-23S-1V(20)?
DF9-23S-1V(20) is listed with package reference -. The current product description is CONN RECEPT 23POS 1MM SMD TIN, and buyers should confirm package, footprint, and electrical details against the datasheet or quotation notes before approval.
Is DF9-23S-1V(20) available in stock?
This page currently shows 10426 units in stock and 10337 units available for DF9-23S-1V(20). Because electronic component availability can change quickly, submit an RFQ to confirm live stock, lead time, and final pricing.
Can I request a quote or sample for DF9-23S-1V(20)?
Yes. Use the Quick Quote or Request Sample action on this page to send the quantity and sourcing requirements for DF9-23S-1V(20) by Hirose. The TrustCompo team can review price, availability, and documentation support.
Is a datasheet available for DF9-23S-1V(20)?
Yes. This page links to the datasheet for DF9-23S-1V(20) by Hirose, so engineers and buyers can review package, ratings, and application details before purchase.
How should buyers verify DF9-23S-1V(20) before ordering?
Buyers should confirm the manufacturer, package, quantity, target price, RoHS or compliance needs, and any Certificate of Conformance or traceability requirements for DF9-23S-1V(20) before approving the order.
Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Recommended Products
Explore more parts from the same subcategory to compare fit, stock, and sourcing options.
More sourcing insights
Articles
Explore related articles around DF9-23S-1V(20), Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board), and adjacent sourcing decisions so buyers can compare context before moving from evaluation to RFQ.
Jul 17, 2026
FPGA Supply 2026: A Buyer's Framework for AMD Xilinx, Intel Altera, Microchip, and Lattice SourcingA production-BOM FPGA sourcing guide for 2026 covering lifecycle commitment, redesign cost, and qualification boundaries across AMD Xilinx, Intel Altera, Microchip PolarFire, and Lattice families.
FPGAAMD XilinxIntel Altera
Jul 11, 2026
2026 Q3 Wide-Bandgap Power Read: Where SiC Is Scaling, Where GaN Is Winning, and Why Silicon Still MattersA Q3 2026 read on SiC, GaN, and silicon power semiconductors: where wide-bandgap devices are winning now, where silicon still holds, and what engineers and sourcing teams should watch.
wide-bandgap semiconductorsSiCGaN
Jul 8, 2026
Texas Instruments Lead Time and Price Pressure in 2026: What Analog and Power Buyers Should Do NowA buyer-facing framework for Texas Instruments analog and power IC exposure in 2026, covering what is confirmed, where price and lead-time pressure is most likely to show up, and which actions sourcing teams should take first.
Texas Instrumentsanalog ICpower management IC