S25FL128SAGMFI003 is a Memory from Cypress Semiconductor in 16SOIC packaging. It is commonly reviewed for IC FLASH 128M SPI 133MHZ 16SOIC. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for S25FL128SAGMFI003 before RFQ, PO release, and shipment planning.
1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
Exact MPN confirmed: S25FL128SAGMFI003
Package to verify: 16SOIC
Commercial confirmation
Live stock and lead time confirmed by RFQ
Final price and tax terms confirmed before PO release
Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Technical parameters
Parameters
Compare grouped S25FL128SAGMFI003 parameters from Cypress Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Parameter
Triac Type
Active
Product Parameter
Accessory Type
DUAL
Product Parameter
Maximum Data Rate Range (Kbps)
1
Product Parameter
Total Resistance
Tape & Reel (TR)
Product Parameter
Maximum Data Rate
1.27mm
Product Parameter
Nominal Attenuation
e3
S25FL128SAGMFI003 Product Parameter
Parameter
Value
Triac Type
Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements.
Active
Accessory Type
Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application.
DUAL
Maximum Data Rate Range (Kbps)
Range of maximum data transfer rates supported by the component, expressed in kilobits per second. This indicates the span of possible speeds the device can handle. Compare this range with your system's required throughput to ensure the component can support the necessary communication bandwidth without data loss.
1
Total Resistance
Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation.
Tape & Reel (TR)
Maximum Data Rate
Highest data transfer rate the component can reliably support, typically in bits per second. This is critical for serial interfaces, modems, or transceivers. Ensure your application's required data throughput does not exceed this limit to avoid communication errors and performance degradation.
1.27mm
Nominal Attenuation
Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies.
e3
Transmission Media Type
Specifies the physical medium through which signals travel, such as fiber optic, twisted pair, or coaxial cable. This attribute is critical for ensuring compatibility with your network infrastructure and for meeting performance requirements. Verify the media type against your system's specifications and the component datasheet to avoid signal integrity issues.
3V
Minimum Switching Frequency
Specifies the lowest switching frequency at which the power device can operate reliably. Compare this value with your application's required switching speed to ensure proper performance. Verify against the datasheet's recommended operating conditions.
3/3.3V
Programming Voltage
Programming voltage is the specific voltage required to write or erase data in programmable devices like EEPROMs, flash memory, or microcontrollers. It must be applied precisely during programming; incorrect levels can cause write failures or permanent damage, so always follow the datasheet's programming procedure.
3V
Output Current Flow Direction
Specifies whether the output current flows from the device into the load or from the load into the device. This matters for sourcing versus sinking configurations. Verify against the datasheet to ensure correct circuit topology and avoid reverse current damage.
8542.32.00.51
Memory Density
Total storage capacity of the memory chip, typically expressed in bits or bytes. Compare densities to match your application's code and data requirements. Verify against the datasheet to ensure sufficient headroom for firmware and runtime variables.
128 Mb
Output Peak Current Limit
Specifies the maximum instantaneous output current the device can deliver without damage or shutdown. Compare this limit with your inrush and transient load requirements. Verify against the datasheet's safe operating area and pulse conditions to ensure reliable operation.
2.65mm
Alternate Memory Width
Specifies an alternative memory bus width configuration supported by the device. This is relevant for memory modules, microcontrollers, and FPGAs. Compare this attribute to understand flexibility in interfacing with different memory types or to optimize bandwidth versus pin count.
2
Access Time
Specifies the delay from address or control signal assertion until valid data is available at the output. Critical for memory and FPGA configuration devices. Compare with system clock requirements and verify against datasheet timing diagrams.
8 ns
Typical Quiescent Current (MA)
Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency.
FLASH - NOR
Power Supplies
Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.
FL-S
Output Format
Specifies the electrical or digital format of the output signal, such as analog voltage, current loop, or digital protocol. Engineers compare this to ensure compatibility with downstream circuitry or controllers. Verify the exact format and levels in the datasheet before integration.
HARDWARE/SOFTWARE
Linearity Error-Max (EL)
Maximum deviation from ideal linearity in the conversion characteristic. This parameter indicates how accurately the output follows a straight-line response. Compare values across similar converters to assess precision. Verify against the datasheet for guaranteed limits.
20
Number Of Channels
Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections.
IT ALSO CONFIGURED AS 256M X 1
S25FL128SAGMFI003 Product Attribute
Parameter
Value
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
16-SOIC (0.295, 7.50mm Width)
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
Cypress Semiconductor
Housing Material
Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure.
ROHS3 Compliant
Number Of Contacts
Total number of electrical contacts in the connector, which determines the maximum number of circuits that can be connected. This is a critical parameter for matching the connector to your wire harness requirements. Ensure the contact count aligns with your signal and power needs.
No SVHC
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
Surface Mount
Locking Feature
Indicates the locking mechanism used to secure the connector or terminal in place. Choose the appropriate type for your application to ensure reliable mating and vibration resistance. Verify compatibility with the mating part and datasheet specifications.
Lead Free
Number Of Bits
Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs.
No
Max Supply Voltage
Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.
Surface Mount
Radiation Hardening
Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.
-40°C~85°C TA
Temperature Grade
Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.
16
Data Rate
Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.
16
Converter Type
Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.
3 (168 Hours)
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Memory
Boot Block
Specifies the memory region reserved for boot code in microcontrollers, flash, or EEPROM devices. This block is protected to ensure reliable startup. Verify its size and protection features against the datasheet when selecting parts for firmware updates or secure boot applications.
BOTTOM
Threshold Voltage
The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature.
10.3mm
Driver Number Of Bits
Specifies the number of bits the driver can handle, indicating the width of the data path or the number of channels. This determines the maximum data throughput and the number of outputs. Ensure it matches your system's bus width or channel requirements.
Tin
Sync/Async
Indicates whether the component operates in synchronous or asynchronous mode. This affects timing, clocking, and data transfer protocols. Verify the mode against your system requirements and the datasheet to ensure proper integration and performance.
Synchronous
Operating Supply Voltage
Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.
SPI, Serial
Standby Current-Max
Maximum current drawn by the component when in standby or sleep mode. Lower values extend battery life in portable designs. Verify against datasheet conditions, as standby current can vary with supply voltage and temperature.
0.0001A
Input Power-Max (CW)
Indicates the maximum continuous wave input power the component can safely handle without damage or excessive distortion. Exceeding this limit may cause failure. Verify this value against your signal power and consider peak-to-average ratio in modulated systems.
13 Weeks
Connector/Contact Type
Specifies the connector or contact style, such as pin, socket, or blade. This determines mating compatibility and mechanical fit. Verify against the datasheet to ensure correct pairing with the mating connector and proper application.
3.6V
Material Flammability Rating
Indicates the flammability classification of the insulating material used in the component, typically following UL 94 standards. This rating helps engineers assess fire safety and compliance with regulatory requirements. Check the datasheet for the specific test method and thickness conditions.
Non-Volatile
Reverse Recovery Time-Max
Specifies the maximum time required for a diode or rectifier to switch from conducting to blocking state. This parameter is critical for high-frequency rectification and switching power supplies. Compare this value to minimize switching losses and improve efficiency.
FLASH
Temperature Coefficient
Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment.
2.7V~3.6V
Cable End Type
This attribute indicates how the cable is terminated at its end, such as stripped, tinned, ferrule, or connectorized. It affects the ease of installation, reliability of the connection, and compatibility with terminal blocks or other components. Buyers should select the appropriate type based on the application and verify with the datasheet.
2.7V
Word Size
Specifies the number of bits in a single data word for memory or processor components. Compare word sizes when selecting devices for data throughput and processing capability. Verify the exact word size in the datasheet to ensure compatibility with your system architecture.
1b
Width
Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.
8b
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
2013
Diode Capacitance-Nom
Nominal capacitance of the diode, typically measured at a specified reverse voltage and frequency. This parameter is important for high-frequency applications, affecting switching speed and signal integrity. Check the datasheet for the test conditions and ensure the capacitance meets your circuit design.
SPI - Quad I/O
Current - Receiving
Specify the current consumption during receiving operation. This value is critical for battery life estimation in portable devices. Compare it with the datasheet's typical and maximum ratings to ensure your power supply can handle the load under worst-case conditions.
SPI
Tolerance
Allowed deviation from the nominal value, expressed as a percentage. Determines precision of resistors, capacitors, and inductors. Choose tighter tolerance for precision circuits, but verify actual performance in the datasheet.
1b
Current - Transmitting
Indicates the current consumption or output current during transmission mode. Essential for power budget calculations and thermal management in wireless modules. Check this value against your supply capability and compare with receiving current to estimate battery life.
100000 Write/Erase Cycles
Series
Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.
128Mb 16M x 8
Bottom Termination
Defines the method used to connect wires on the bottom side of the terminal block, such as solder lug, quick-connect, or PCB pin. This determines how the component mounts and connects to your circuit. Ensure compatibility with your board layout and assembly process.
32MX4
Wire Gauge (Max)
Indicates the largest wire size that can be terminated or accommodated by this connector or terminal. Compare with your application's wire gauge to ensure proper fit and reliable electrical contact. Verify against the datasheet for specific wire ranges and strip lengths.
4
Write Cycle Time-Max (TWC)
Specifies the maximum duration required to complete a single write operation in non-volatile memory. Compare this timing parameter across devices to ensure compatibility with your system's write timing budget. Always verify against the datasheet for worst-case conditions.
500ms
Manufacturer'S Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
S25FL128SAGMFI003
Mounting Type
Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.
133MHz
FFC, FCB Thickness
This attribute specifies the thickness of a flat flexible cable (FFC) or flat circuit board (FCB). It is important for ensuring proper insertion into connectors and for mechanical fit in tight enclosures. Engineers must verify this dimension against the connector's specifications to guarantee reliable contact and avoid damage during assembly.
75mA
Datasheet preview
Datasheet PDF viewer
Preview the S25FL128SAGMFI003 datasheet from Cypress Semiconductor to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for S25FL128SAGMFI003. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
Recommended products
Explore related Memory products to compare fit, stock status, datasheets, and sourcing options.
Targeted answers for buyers verifying the exact S25FL128SAGMFI003 ordering code, packaging, stock, datasheet, and replacement path.
What does S25FL128SAGMFI003 mean?
S25FL128SAGMFI003 is the exact ordering code listed for a Memory component from Cypress Semiconductor. The current package reference is 16SOIC, with listed context including IC FLASH 128M SPI 133MHZ 16SOIC. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the S25FL128SAGMFI003 ordering code?
Treat S25FL128SAGMFI003 as the full ordering code during RFQ and engineering review. Confirm the listed 16SOIC package, manufacturer documentation from Cypress Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is S25FL128SAGMFI003 supplied in?
S25FL128SAGMFI003 is currently listed with package reference 16SOIC from Cypress Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is S25FL128SAGMFI003 currently available?
S25FL128SAGMFI003 is currently marked with stock availability on this page. Before ordering, confirm the package (16SOIC), listed stock (132446), available quantity (63884), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare S25FL128SAGMFI003 alternatives?
A mapped alternative list is not currently published for S25FL128SAGMFI003. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.