Get a Sample
Request engineering samples to evaluate fit, validate alternatives, and keep design decisions moving before a larger order is placed.
Request evaluation samplesSupply original OMAPL138BZCED4, Embedded - Microprocessors, by Texas Instruments
OMAPL138BZCED4 is a Embedded - Microprocessors model from Texas Instruments, presented on TrustCompo for buyers who need clear sourcing and review context before RFQ. This listing sits in the Integrated Circuits (ICs) / Embedded - Microprocessors product path. IC MPU OMAP-L1X 456MHZ 361NFBGA. TrustCompo combines the available model, brand, hierarchy, and specification details around OMAPL138BZCED4 so buyers can move faster from review to quotation.
RoHS
Pictures are for reference only. Please contact us for the latest pictures.
Traceability and authenticity checks
Fast RFQ turnaround
Documentation support
Pre-shipment inspection review
Key specifications
Series
OMAP-L1x
Min Quantity
1
Category
Integrated Circuits (ICs)Sub Category
Embedded - MicroprocessorsDescription
IC MPU OMAP-L1X 456MHZ 361NFBGA
key Attributes
-
Why request a quote
Use the RFQ step to confirm the commercial and documentation details buyers usually need before placing an order.
Confirm stock and lead-time expectations
Check CoC or traceability support
Align inspection and fulfillment details
Trust signals
Globally recognized certifications
Visible certifications work best when they are paired with clear operational promises around traceability, handling, and inspection.
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
Ordering workflow
Understand how to order and what policies support the purchase
Use this section to see the fastest ordering path and the policy pages buyers usually review before confirming a component order.
How to order this product
A simple B2B flow helps engineering and procurement teams move from part review to commercial confirmation.
1
Confirm part and quantity
Review the part number, package, key specs, and target quantity so the quote request reflects the exact sourcing scope your team needs.
2
Send RFQ or sample request
Use Quick Quote for commercial pricing or Request Sample when engineering validation is still in progress and a smaller evaluation quantity is needed.
3
Align delivery, payment, and documentation
Before final release, confirm stock timing, shipment method, payment arrangement, and any traceability or inspection documents required by your process.
Policies buyers usually check
These pages explain the operating rules around samples, shipping, payment, and quality support before you place the order.
Shipping & Delivery
Review shipping origin, carrier options, delivery methods, and the practical factors that affect transit timing for global component orders.
Review shipping detailsPayment Terms
Understand supported payment methods, invoice handling, quote currency, and the commercial boundaries used for international B2B orders.
Review payment termsQuality & Traceability Center
See how incoming inspection, outgoing verification, traceability support, certifications, and additional testing fit into our quality workflow.
Review quality controlsStructured product content
Review The Product The Way Buyers Actually Evaluate It
Review overview, detailed specifications, and related sourcing content in one structured flow without scanning separate oversized sections.
Product overview
Overview
IC MPU OMAP-L1X 456MHZ 361NFBGA
Fast scan
Popular Specs Surfaced First
Product Attribute
Packaging
Tray
Product Attribute
REACH Status
REACH Unaffected
Product Attribute
Lead Free
Lead Free
Product Attribute
Part Status
Obsolete
Product Attribute
Categories
Integrated Circuits (ICs)
Product Attribute
Peak Reflow Temperature (Cel)
260
Packaging
Tray
REACH Status
REACH Unaffected
Lead Free
Lead Free
Part Status
Obsolete
Categories
Integrated Circuits (ICs)
Peak Reflow Temperature (Cel)
260
Technology
CMOS
Manufacturer
Texas
Terminal Pitch
0.65mm
ECCN
3A991A2
Terminal Form
BALL
Internal Bus Architecture
MULTIPLE
Number Of Cores/Bus Width
1 Core 32-Bit
Voltage - I/O
1.8V 3.3V
Sub-Categories
Embedded - Microprocessors
Operating Temperature
-40°C~90°C TJ
Display & Interface Controllers
LCD
Ethernet
10/100Mbps (1)
Mount
Surface Mount
Pbfree Code
yes
Terminal Position
BOTTOM
Barrel Shifter
NO
RAM Controllers
SDRAM
Graphics Acceleration
No
Supply Voltage
1V
Voltage
1.35V
Subcategory
Other uPs/uCs/Peripheral ICs
Series
OMAP-L1x
USB
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Max Supply Voltage
1.35V
Frequency
456MHz
Co-Processors/DSP
Signal Processing; C674x, System Control; CP15
Number Of Terminations
361
Operating Supply Voltage
1.3V
Number Of Pins
361
Min Supply Voltage
1.25V
Weight
789.392471mg
Package / Case
361-LFBGA
Base Part Number
OMAPL138
Pin Count
361
Security Features
Boot Security, Cryptography
Additional Interfaces
HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART
Number Of Cores
2
Interface
I2C, Parallel, SPI, USB
Manufacturer'S Part No.
OMAPL138BZCED4
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Core Architecture
ARM
UPs/UCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
Core Processor
ARM926EJ-S
Format
FLOATING POINT
Number Of Timers/Counters
3
Low Power Mode
YES
Data Bus Width
32b
Boundary Scan
YES
RAM Size
8kB
SATA
SATA 3Gbps (1)
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
HTSUS
8542.31.0001
JESD-609 Code
e1
Common questions
Product FAQ
Quick answers for buyers reviewing OMAPL138BZCED4, stock, documentation, and sourcing steps.
What is OMAPL138BZCED4?
OMAPL138BZCED4 is a Embedded - Microprocessors component from Texas Instruments. This product page summarizes the core sourcing details buyers need before checking price, availability, documentation, or samples.
What package and description are listed for OMAPL138BZCED4?
OMAPL138BZCED4 is listed with package reference -. The current product description is IC MPU OMAP-L1X 456MHZ 361NFBGA, and buyers should confirm package, footprint, and electrical details against the datasheet or quotation notes before approval.
Is OMAPL138BZCED4 available in stock?
This page currently shows 41561 units in stock and 62488 units available for OMAPL138BZCED4. Because electronic component availability can change quickly, submit an RFQ to confirm live stock, lead time, and final pricing.
Can I request a quote or sample for OMAPL138BZCED4?
Yes. Use the Quick Quote or Request Sample action on this page to send the quantity and sourcing requirements for OMAPL138BZCED4 by Texas Instruments. The TrustCompo team can review price, availability, and documentation support.
Is a datasheet available for OMAPL138BZCED4?
A dedicated datasheet link is not currently listed for OMAPL138BZCED4 by Texas Instruments. Contact us with the part number and required parameters so the team can help confirm documentation during quotation.
How should buyers verify OMAPL138BZCED4 before ordering?
Buyers should confirm the manufacturer, package, quantity, target price, RoHS or compliance needs, and any Certificate of Conformance or traceability requirements for OMAPL138BZCED4 before approving the order.
Embedded - Microprocessors
Recommended Products
Explore more parts from the same subcategory to compare fit, stock, and sourcing options.
More sourcing insights
Articles
Explore related articles around OMAPL138BZCED4, Embedded - Microprocessors, and adjacent sourcing decisions so buyers can compare context before moving from evaluation to RFQ.
Jul 17, 2026
FPGA Supply 2026: A Buyer's Framework for AMD Xilinx, Intel Altera, Microchip, and Lattice SourcingA production-BOM FPGA sourcing guide for 2026 covering lifecycle commitment, redesign cost, and qualification boundaries across AMD Xilinx, Intel Altera, Microchip PolarFire, and Lattice families.
FPGAAMD XilinxIntel Altera
Jul 11, 2026
2026 Q3 Wide-Bandgap Power Read: Where SiC Is Scaling, Where GaN Is Winning, and Why Silicon Still MattersA Q3 2026 read on SiC, GaN, and silicon power semiconductors: where wide-bandgap devices are winning now, where silicon still holds, and what engineers and sourcing teams should watch.
wide-bandgap semiconductorsSiCGaN
Jul 8, 2026
Texas Instruments Lead Time and Price Pressure in 2026: What Analog and Power Buyers Should Do NowA buyer-facing framework for Texas Instruments analog and power IC exposure in 2026, covering what is confirmed, where price and lead-time pressure is most likely to show up, and which actions sourcing teams should take first.
Texas Instrumentsanalog ICpower management IC