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S29GL256P10TFI010 Memory by Cypress Semiconductor

S29GL256P10TFI010 is a Memory from Cypress Semiconductor in manufacturer-listed packaging. It is commonly reviewed for IC FLASH 256M PARALLEL 56TSOP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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S29GL256P10TFI010 Memory by Cypress Semiconductor | TrustCompo
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Key specifications

Part Number

S29GL256P10TFI010

Internal code

TCE000077963

Package

-

Key specifications

Series

GL-P

Min Quantity

1

Sub Category
Memory
Description

IC FLASH 256M PARALLEL 56TSOP

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for S29GL256P10TFI010 before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

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  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

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  4. 4

    Arrange shipment

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Before PO release

Part confirmation

  • Exact MPN confirmed: S29GL256P10TFI010
  • Package to verify: -

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Product overview

Product overview

Review the sourcing context for S29GL256P10TFI010 from Cypress Semiconductor, including product identity, application fit, package notes, and purchasing considerations.

The S29GL256P10TFI010 is a high-performance flash memory device manufactured by Cypress Semiconductor, designed for a variety of applications requiring non-volatile storage. Here’s a detailed description of its key features and specifications:

General Overview

  • Type: NOR Flash Memory
  • Density: 256 Megabits (32 Megabytes)
  • Architecture: The S29GL256P is based on a single-level cell (SLC) architecture, which provides high reliability and performance.

Key Features

  • Access Time: The device offers a maximum access time of 10 nanoseconds, allowing for fast read operations.
  • Interface: It utilizes a parallel interface, which is compatible with standard microcontroller and processor architectures, making it easy to integrate into various systems.
  • Voltage Range: The S29GL256P operates within a supply voltage range of 2.7V to 3.6V, making it suitable for low-power applications.
  • Programming and Erasing: The device supports sector-based programming and erasing, allowing for flexible data management. It features a fast programming time of approximately 10 microseconds per word and a sector erase time of around 1 second.
  • Endurance: The S29GL256P is rated for a minimum of 100,000 program/erase cycles per sector, ensuring long-term reliability for data storage.
  • Data Retention: The device guarantees data retention for up to 20 years at 85°C, making it suitable for applications where data integrity over time is critical.

Package Options

  • The S29GL256P10TFI010 is available in various package options, including:
    • TSOP (Thin Small Outline Package): A compact form factor ideal for space-constrained applications.
    • BGA (Ball Grid Array): Provides excellent thermal performance and is suitable for high-density designs.

Applications

The S29GL256P is widely used in various applications, including:

  • Consumer electronics (e.g., smartphones, tablets)
  • Automotive systems (e.g., infotainment, navigation)
  • Industrial control systems
  • Networking equipment
  • Medical devices

Reliability and Quality

Cypress Semiconductor emphasizes high reliability in its products, and the S29GL256P is no exception. It is manufactured in accordance with stringent quality standards, ensuring that it meets the demands of critical applications.

Conclusion

The S29GL256P10TFI010 from Cypress Semiconductor is a versatile and reliable flash memory solution, offering high performance, endurance, and data retention capabilities. Its compatibility with various interfaces and architectures makes it an excellent choice for a wide range of applications in the consumer, automotive, industrial, and medical sectors.

Technical parameters

Parameters

Compare grouped S29GL256P10TFI010 parameters from Cypress Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Attribute

    Categories

    Integrated Circuits (ICs)

  • Product Attribute

    Manufacturer

    Cypress Semiconductor

  • Product Attribute

    Housing Material

    ROHS3 Compliant

  • Product Attribute

    Number Of Contacts

    No SVHC

  • Product Attribute

    Terminal Position

    Surface Mount

  • Product Attribute

    Locking Feature

    Lead Free

S29GL256P10TFI010 Product Attribute
ParameterValue
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Cypress Semiconductor
Housing Material

Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure.

ROHS3 Compliant
Number Of Contacts

Total number of electrical contacts in the connector, which determines the maximum number of circuits that can be connected. This is a critical parameter for matching the connector to your wire harness requirements. Ensure the contact count aligns with your signal and power needs.

No SVHC
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Surface Mount
Locking Feature

Indicates the locking mechanism used to secure the connector or terminal in place. Choose the appropriate type for your application to ensure reliable mating and vibration resistance. Verify compatibility with the mating part and datasheet specifications.

Lead Free
Number Of Bits

Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs.

No
Max Supply Voltage

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

Surface Mount
Terminal Form

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

SMD/SMT
Radiation Hardening

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

-40°C~85°C TA
Converter Type

Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.

3 (168 Hours)
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Memory
Ready/Busy

Indicates whether the device is ready to accept commands or busy processing. Check this status pin or register before initiating operations to avoid communication errors. Verify timing and logic levels in the datasheet for reliable system integration.

YES
Sync/Async

Indicates whether the component operates in synchronous or asynchronous mode. This affects timing, clocking, and data transfer protocols. Verify the mode against your system requirements and the datasheet to ensure proper integration and performance.

Asynchronous
Driver Number Of Bits

Specifies the number of bits the driver can handle, indicating the width of the data path or the number of channels. This determines the maximum data throughput and the number of outputs. Ensure it matches your system's bus width or channel requirements.

Tin
Input Power-Max (CW)

Indicates the maximum continuous wave input power the component can safely handle without damage or excessive distortion. Exceeding this limit may cause failure. Verify this value against your signal power and consider peak-to-average ratio in modulated systems.

16 Weeks
Standby Current-Max

Maximum current drawn by the component when in standby or sleep mode. Lower values extend battery life in portable designs. Verify against datasheet conditions, as standby current can vary with supply voltage and temperature.

0.000005A
FET Type

Classification of field-effect transistor based on channel polarity and mode, such as N-channel or P-channel, enhancement or depletion. This determines the required gate drive polarity and circuit topology. Engineers select the appropriate type for switching or amplification applications. Always confirm the exact type from the datasheet before design.

YES
Connector/Contact Type

Specifies the connector or contact style, such as pin, socket, or blade. This determines mating compatibility and mechanical fit. Verify against the datasheet to ensure correct pairing with the mating connector and proper application.

3.6V
Material Flammability Rating

Indicates the flammability classification of the insulating material used in the component, typically following UL 94 standards. This rating helps engineers assess fire safety and compliance with regulatory requirements. Check the datasheet for the specific test method and thickness conditions.

Non-Volatile
Companding Law

Specifies the companding algorithm used for signal compression and expansion, such as A-law or μ-law. This affects the signal-to-noise ratio and dynamic range in audio or telecommunication systems. Verify the companding law matches the system requirements and the datasheet.

YES
Diode Capacitance-Nom

Nominal capacitance of the diode, typically measured at a specified reverse voltage and frequency. This parameter is important for high-frequency applications, affecting switching speed and signal integrity. Check the datasheet for the test conditions and ensure the capacitance meets your circuit design.

Parallel
Reverse Recovery Time-Max

Specifies the maximum time required for a diode or rectifier to switch from conducting to blocking state. This parameter is critical for high-frequency rectification and switching power supplies. Compare this value to minimize switching losses and improve efficiency.

FLASH
Temperature Coefficient

Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment.

2.7V~3.6V
Cable End Type

This attribute indicates how the cable is terminated at its end, such as stripped, tinned, ferrule, or connectorized. It affects the ease of installation, reliability of the connection, and compatibility with terminal blocks or other components. Buyers should select the appropriate type based on the application and verify with the datasheet.

2.7V
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

56-TFSOP (0.724, 18.40mm Width)
Sector Size

Specifies the smallest erasable block size in memory devices. Compare sector sizes when selecting flash or EEPROM for firmware updates or data storage. Verify against the datasheet to ensure compatibility with your file system and wear-leveling requirements.

128K
Access Time (Max)

Maximum time required to read or write data in memory devices. Lower values indicate faster performance. Critical for timing analysis in digital systems. Verify against the datasheet to ensure it meets your system's speed requirements.

100 ns
Write Cycle Time - Word, Page

Specifies the duration needed to program a single word or a page in non-volatile memory. Compare this timing when selecting EEPROM or flash devices for write-intensive applications. Verify against the datasheet to ensure your system meets the required write throughput.

100ns
Threshold Voltage

The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature.

18.4mm
Number Of Sectors/Size

Specifies the number of sectors and their individual size for rotary switches or encoders. This attribute helps engineers determine the number of positions and the angular spacing between them. Verify against the datasheet to ensure compatibility with your control panel or circuit design.

256
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

8b
Temperature Grade

Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.

56
Data Rate

Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.

56
Vgs(Th) Max @ Id

Maximum gate threshold voltage at a specified drain current. This parameter indicates the gate voltage needed to begin conduction. Compare it with your gate drive voltage to ensure reliable switching. Verify against the datasheet for your operating conditions.

8/16words
Wire Gauge (Max)

Indicates the largest wire size that can be terminated or accommodated by this connector or terminal. Compare with your application's wire gauge to ensure proper fit and reliable electrical contact. Verify against the datasheet for specific wire ranges and strip lengths.

1
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

2015
FFC, FCB Thickness

This attribute specifies the thickness of a flat flexible cable (FFC) or flat circuit board (FCB). It is important for ensuring proper insertion into connectors and for mechanical fit in tight enclosures. Engineers must verify this dimension against the connector's specifications to guarantee reliable contact and avoid damage during assembly.

110mA
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

S29GL256P10TFI010
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

256Mb 32M x 8
S29GL256P10TFI010 Product Parameter
ParameterValue
Maximum Operating Supply Voltage

Highest supply voltage at which the component can operate normally without damage or performance degradation. Exceeding this limit may cause overheating or failure. Always check this parameter against your power supply design to ensure the component operates within its safe voltage range for reliable long-term performance.

260
Maximum Data Rate

Highest data transfer rate the component can reliably support, typically in bits per second. This is critical for serial interfaces, modems, or transceivers. Ensure your application's required data throughput does not exceed this limit to avoid communication errors and performance degradation.

0.5mm
Triac Type

Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements.

Active
Accessory Type

Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application.

DUAL
Maximum Data Rate Range (Kbps)

Range of maximum data transfer rates supported by the component, expressed in kilobits per second. This indicates the span of possible speeds the device can handle. Compare this range with your system's required throughput to ensure the component can support the necessary communication bandwidth without data loss.

1
Nominal Attenuation

Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies.

e3
Voltage Rating

Specifies the maximum continuous voltage the component can safely withstand without damage or performance degradation. Critical for ensuring proper operating margins in power supplies, signal lines, and isolation barriers. Always confirm with the datasheet for absolute maximum ratings.

40
Total Resistance

Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation.

Tray
Transmission Media Type

Specifies the physical medium through which signals travel, such as fiber optic, twisted pair, or coaxial cable. This attribute is critical for ensuring compatibility with your network infrastructure and for meeting performance requirements. Verify the media type against your system's specifications and the component datasheet to avoid signal integrity issues.

3V
Output Peak Current Limit

Specifies the maximum instantaneous output current the device can deliver without damage or shutdown. Compare this limit with your inrush and transient load requirements. Verify against the datasheet's safe operating area and pulse conditions to ensure reliable operation.

1.2mm
Minimum Switching Frequency

Specifies the lowest switching frequency at which the power device can operate reliably. Compare this value with your application's required switching speed to ensure proper performance. Verify against the datasheet's recommended operating conditions.

3/3.3V
Programming Voltage

Programming voltage is the specific voltage required to write or erase data in programmable devices like EEPROMs, flash memory, or microcontrollers. It must be applied precisely during programming; incorrect levels can cause write failures or permanent damage, so always follow the datasheet's programming procedure.

3V
Alternate Memory Width

Specifies an alternative memory bus width configuration supported by the device. This is relevant for memory modules, microcontrollers, and FPGAs. Compare this attribute to understand flexibility in interfacing with different memory types or to optimize bandwidth versus pin count.

8
Filter Type

Specifies the filter topology or technology used in the component, such as low-pass, high-pass, band-pass, or EMI filtering. This attribute helps engineers select the right filter for signal conditioning or noise suppression. Verify the exact filter type against the datasheet to ensure it meets your circuit requirements.

YES
Drain To Source Voltage (Vdss)

Maximum voltage that can be applied between drain and source terminals without causing breakdown. Critical for MOSFET selection in power circuits. Verify against datasheet for safe operating area and derating.

YES
Output Current Flow Direction

Specifies whether the output current flows from the device into the load or from the load into the device. This matters for sourcing versus sinking configurations. Verify against the datasheet to ensure correct circuit topology and avoid reverse current damage.

8542.32.00.51
Drain To Source Resistance

This is the on-state resistance between the drain and source terminals of a MOSFET. It affects power dissipation and efficiency. Lower values are preferred for high-current switching. Always check the datasheet for the specified test conditions, as RDS(on) varies with gate voltage and temperature.

3A991.B.1.A
Memory Density

Total storage capacity of the memory chip, typically expressed in bits or bytes. Compare densities to match your application's code and data requirements. Verify against the datasheet to ensure sufficient headroom for firmware and runtime variables.

256 Mb
Typical Quiescent Current (MA)

Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency.

FLASH - NOR
Power Supplies

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

GL-P

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Cypress Semiconductor

S29GL256P10TFI010

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PCN / product notice documents

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Common questions

Product FAQ

Targeted answers for buyers verifying the exact S29GL256P10TFI010 ordering code, packaging, stock, datasheet, and replacement path.

What does S29GL256P10TFI010 mean?

S29GL256P10TFI010 is the exact ordering code listed for a Memory component from Cypress Semiconductor. The current package reference is -, with listed context including IC FLASH 256M PARALLEL 56TSOP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the S29GL256P10TFI010 ordering code?

Treat S29GL256P10TFI010 as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Cypress Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is S29GL256P10TFI010 supplied in?

S29GL256P10TFI010 is currently listed with package reference - from Cypress Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is S29GL256P10TFI010 currently available?

S29GL256P10TFI010 is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (48453), available quantity (45541), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare S29GL256P10TFI010 alternatives?

A mapped alternative list is not currently published for S29GL256P10TFI010. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.