FDPC8014S Transistors - FETs, MOSFETs - Arrays by ON Semiconductor

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Indicates the component's compliance status with the EU REACH regulation. Buyers should verify this code against the manufacturer's declaration to ensure restricted substances are within allowable limits for their target market.

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

Indicates how the component's case or package is electrically connected, such as to ground, a supply rail, or left floating. This affects thermal management, shielding, and circuit isolation. Always confirm with the datasheet to ensure proper PCB layout and avoid unintended shorts or noise coupling.

Specifies the functional mode of the component, such as continuous, pulsed, or burst. Engineers compare this to ensure the device operates correctly in their circuit topology. Verify the mode against the datasheet to match your application's requirements.

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Specifies the intended circuit role, such as switching, amplification, or RF. Engineers compare this to ensure the transistor's characteristics match the design's requirements. Verify against the datasheet's application section before selecting.

Specifies the semiconductor material used in the transistor's active region. This affects electrical characteristics such as switching speed and voltage rating. Verify the material against the datasheet when selecting for high-frequency or high-power applications.

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

Maximum gate threshold voltage at a specified drain current. This parameter indicates the gate voltage needed to begin conduction. Compare it with your gate drive voltage to ensure reliable switching. Verify against the datasheet for your operating conditions.

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

Maximum drain current under pulsed conditions, often specified with a pulse width and duty cycle. Compare this value with the continuous drain current rating to understand the device's peak current capability. Verify the pulse conditions in the datasheet to ensure they match your application's switching requirements.

Voltage applied between gate and source terminals that controls the MOSFET's conduction. This rating defines the absolute maximum allowable voltage to prevent gate oxide breakdown. Check the threshold voltage and recommended drive levels in the datasheet for reliable switching.

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

This is the total charge required to switch the MOSFET gate to a specified gate-source voltage. It determines switching speed and driver power losses. Compare values to optimize efficiency in high-frequency circuits. Verify against datasheet for your operating conditions.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Typical time for the output signal to transition from 90% to 10% of its amplitude. This parameter indicates switching speed and affects high-frequency performance. Compare with rise time and verify against the datasheet for your specific operating conditions.

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

Maximum continuous current the MOSFET can conduct in the on-state without exceeding thermal limits. Compare this rating with your circuit's peak and average current demands. Always verify against the datasheet's thermal resistance and ambient temperature conditions.

Maximum energy the device can absorb during a single avalanche event without failure. Compare this rating when designing inductive load switching or surge conditions. Verify against the datasheet to ensure your circuit's energy stress stays within safe limits.

Classification of field-effect transistor based on channel polarity and mode, such as N-channel or P-channel, enhancement or depletion. This determines the required gate drive polarity and circuit topology. Engineers select the appropriate type for switching or amplification applications. Always confirm the exact type from the datasheet before design.

Maximum continuous current the MOSFET can conduct at 25°C case temperature. This rating determines thermal performance and suitability for power applications. Verify against the datasheet's safe operating area and derating curves for reliable operation.

Absolute maximum continuous drain current the MOSFET can handle without damage. Compare this rating against your circuit's peak current demand. Always verify with the datasheet's safe operating area and thermal limits.

Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

Maximum drain-source on-resistance measured at a specified drain current and gate-source voltage. Lower values reduce conduction losses in power circuits. Compare this parameter when selecting MOSFETs for efficiency and thermal performance, and verify against the datasheet.

Maximum input capacitance of the MOSFET at a specified drain-source voltage. This value affects switching speed and gate drive requirements. Compare across devices to estimate switching losses and driver capability. Always verify against the datasheet for your operating conditions.

Maximum power the component can safely dissipate under specified conditions. Compare across parts to ensure thermal limits are not exceeded in your application. Always verify against the datasheet's derating curve and ambient temperature ratings.

Measures the time from when the turn-off command is applied to when the device actually begins to switch off. This delay affects switching losses and timing in power circuits. Engineers compare this parameter to ensure proper synchronization and to minimize power dissipation during high-frequency operation.

Specifies the field-effect transistor technology, such as MOSFET, JFET, or HEMT. This determines switching speed, on-resistance, and voltage ratings. Verify the exact technology against the datasheet to ensure compatibility with your circuit design and performance requirements.

Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections.

Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements.

Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.

Time required for a signal to transition from a low to a high level, typically measured between 10% and 90% of the amplitude. Important for digital interfaces, switching regulators, and pulse circuits. Check the datasheet for test conditions and load capacitance.

Indicates special characteristics of the field-effect transistor, such as logic-level gate drive, low threshold, or built-in ESD protection. Compare features to ensure compatibility with your driving circuit and application requirements. Verify against the datasheet for exact specifications.

Maximum voltage that can be applied between drain and source terminals without causing breakdown. Critical for MOSFET selection in power circuits. Verify against datasheet for safe operating area and derating.

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.