CY8C20436A-24LQXIT Embedded - Microcontrollers - Application Specific by Cypress Semiconductor
CY8C20436A-24LQXIT is a Embedded - Microcontrollers - Application Specific from Cypress Semiconductor in manufacturer-listed packaging. It is commonly reviewed for IC MCU PSOC 8K FLASH 1K 32QFN. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for CY8C20436A-24LQXIT before RFQ, PO release, and shipment planning.
1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
Exact MPN confirmed: CY8C20436A-24LQXIT
Package to verify: -
Commercial confirmation
Live stock and lead time confirmed by RFQ
Final price and tax terms confirmed before PO release
Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Technical parameters
Parameters
Compare grouped CY8C20436A-24LQXIT parameters from Cypress Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
ROHS3 Compliant
JESD-609 Code
This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.
e4
Moisture Sensitivity Level (MSL)
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
3 (168 Hours)
HTSUS
Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.
8542.31.0001
ECCN Code
Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.
EAR99
CY8C20436A-24LQXIT Package Parameter
Parameter
Value
Height Seated (Max)
Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.
0.6mm
CY8C20436A-24LQXIT Product Parameter
Parameter
Value
Memory Size
Indicates the total storage capacity of the memory device, typically in bits or bytes. Buyers use this to match firmware or data storage requirements. Confirm the exact organization and density in the datasheet before design-in.
8kB
RAM Size
Specifies the amount of random access memory available for data storage during operation. This determines the complexity of tasks the component can handle. Buyers should verify that the RAM size meets the application's memory requirements, especially for real-time processing or buffering.
1K x 8
ROM (Words)
Indicates the read-only memory capacity in words, representing the number of addressable storage units for firmware or fixed data. Compare sizes to ensure sufficient code space for your application. Check the datasheet for exact word width.
8192
Power Supplies
Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.
1.8/5V
Number Of Timers/Counters
Specifies how many built-in timer or counter channels are available. These are used for generating precise delays, measuring signal frequencies, or creating PWM signals. Engineers should ensure the count meets the timing requirements of their application, considering each timer's resolution and features.
3
Bit Size
Specifies the number of bits in a single data word for digital components. This determines the maximum data width the device can process or store. Compare bit sizes when selecting microcontrollers, ADCs, DACs, or memory chips to ensure compatibility with your system's data bus and processing requirements.
8
Data Bus Width
Specifies the number of parallel data lines in bits for microcontrollers, DSPs, or memory interfaces. Wider buses enable higher throughput but affect pin count and power. Verify against the datasheet to ensure compatibility with your system's architecture and required performance.
8b
Watchdog Timer
Indicates whether the component includes a watchdog timer and its type. This timer resets the system if software hangs, improving reliability. Verify the timeout period and enable/disable options in the datasheet for your application.
Yes
Core Processor
Identifies the processor architecture and core type, such as ARM Cortex-M or RISC-V. Determines instruction set, toolchain compatibility, and performance characteristics. Check the datasheet for core frequency and features to ensure it meets your processing needs.
M8C
Boundary Scan
Indicates whether the device supports JTAG boundary scan for testing interconnections and internal logic. Useful for board-level testing and debugging. Confirm the boundary scan description in the datasheet to ensure compatibility with your test tools and chain configuration.
NO
CPU Family
Identifies the processor architecture or family, such as ARM Cortex-M or RISC-V. This determines the instruction set, development tools, and software compatibility. Ensure the family matches your existing codebase and toolchain to minimize development effort and risk.
M8C
Supply Current-Max
Maximum current drawn from the power supply under specified operating conditions. Use this to estimate power dissipation and design your power supply and thermal management. Always check the datasheet for test conditions, as current can vary with voltage, frequency, and load.
4mA
RAM (Words)
Specifies the random access memory capacity expressed in words, a common unit for microcontrollers and digital signal processors. Compare this value when selecting devices for data buffering or real-time processing. Verify against the datasheet to ensure sufficient memory for your application.
1000
Number Of Programmable I/O
Indicates the total number of input/output pins that can be configured by the user. This is critical for FPGA, CPLD, and microcontroller designs. Verify against the datasheet to ensure sufficient I/O for your application.
28
Program Memory Type
Technology used for storing firmware, such as Flash, EEPROM, or OTP. Determines reprogrammability, endurance, and write speed. Choose based on update requirements and production volume. Verify the memory size and programming interface in the datasheet.
FLASH (8kB)
Speed
Specifies the maximum clock frequency or data rate of the component. This is critical for timing and performance. Verify the speed grade in the datasheet to ensure it meets your system's throughput requirements and that signal integrity is maintained at that speed.
25.2 MHz
Supply Voltage
Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.
1.71V~5.5V
CY8C20436A-24LQXIT Product Attribute
Parameter
Value
Part Status
Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.
Active
REACH Status
Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.
REACH Unaffected
ECCN
Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.
EAR99
Lead Free
Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.
Lead Free
Mounting Type
Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.
Surface Mount
Factory Lead Time
Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.
8 Weeks
Published
Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.
2003
Packaging
Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.
Tape & Reel (TR)
Operating Temperature
Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.
-40°C~85°C
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
Peak Reflow Temperature (Cel)
Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.
260
Technology
Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.
CMOS
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
QUAD
Terminal Pitch
Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.
0.5mm
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
3V
Subcategory
A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.
Microcontrollers
Frequency
Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications.
24MHz
Interface
Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in.
I2C, SPI
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
32-UFQFN Exposed Pad
Contact Plating
Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.
Gold
Surface Mount
Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process.
YES
Reflow Temperature-Max (S)
Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.
30
Radiation Hardening
Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.
No
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
Cypress Semiconductor
Length
Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.
5mm
Operating Supply Voltage
Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.
3V
Number Of Terminations
Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.
32
Number Of Pins
Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.
32
Pin Count
Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.
32
Memory Type
Defines the underlying technology used for data storage, such as SRAM, DRAM, or Flash. Determines volatility, speed, and endurance. Choose based on your application's need for persistence and access speed.
FLASH
Number Of I/O
Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.
28
Bus Compatibility
Indicates the bus standards or protocols the component supports, such as I2C, SPI, UART, or CAN. Check this attribute to ensure the part interfaces correctly with your system's communication architecture. Verify against the datasheet for protocol versions and electrical compatibility.
USB
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Embedded - Microcontrollers - Application Specific
Controller Series
Identifies the product family or series of the controller, which often indicates its feature set, performance level, and compatibility. Compare series to understand differences in capabilities and ensure the controller meets your application requirements. Always verify the exact series against the datasheet.
CY8C20xx6A
Series
Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.
CapSense® Controllers
Applications
Specify the typical end-use scenarios for this electronic component, such as consumer electronics, automotive, industrial, or telecommunications. This helps engineers quickly assess suitability for their design. Verify against the datasheet's application section.
Capacitive Sensing
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
CY8C20436
Manufacturer'S Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
CY8C20436A-24LQXIT
Datasheet preview
Datasheet PDF viewer
Preview the CY8C20436A-24LQXIT datasheet from Cypress Semiconductor to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for CY8C20436A-24LQXIT. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
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Targeted answers for buyers verifying the exact CY8C20436A-24LQXIT ordering code, packaging, stock, datasheet, and replacement path.
What does CY8C20436A-24LQXIT mean?
CY8C20436A-24LQXIT is the exact ordering code listed for a Embedded - Microcontrollers - Application Specific component from Cypress Semiconductor. The current package reference is -, with listed context including IC MCU PSOC 8K FLASH 1K 32QFN. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the CY8C20436A-24LQXIT ordering code?
Treat CY8C20436A-24LQXIT as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Cypress Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is CY8C20436A-24LQXIT supplied in?
CY8C20436A-24LQXIT is currently listed with package reference - from Cypress Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is CY8C20436A-24LQXIT currently available?
CY8C20436A-24LQXIT is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (132901), available quantity (46431), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare CY8C20436A-24LQXIT alternatives?
A mapped alternative list is not currently published for CY8C20436A-24LQXIT. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.