IR2113PBF PMIC - Gate Drivers by Infineon Technologies
IR2113PBF is a PMIC - Gate Drivers from Infineon Technologies in DIP packaging. It is commonly reviewed for IC MOSFET DVR HI/LO SIDE 14-DIP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for IR2113PBF before RFQ, PO release, and shipment planning.
1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
Exact MPN confirmed: IR2113PBF
Package to verify: DIP
Commercial confirmation
Live stock and lead time confirmed by RFQ
Final price and tax terms confirmed before PO release
Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for IR2113PBF from Infineon Technologies, including product identity, application fit, package notes, and purchasing considerations.
Description The IR2110/IR2113 are high voltage, high speed power MOSFET and IGBT drivers with independent high and low side referenced output channels. Proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. Logic inputs are compatible with standard CMOS or LSTTL output, down to 3.3V logic. The output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction. Propagation delays are matched to simplify use in high frequency applications. The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high side configuration which operates up to 500 or 600 volts. Features • Floating channel designed for bootstrap operation Fully operational to +500V or +600V Tolerant to negative transient voltage dV/dt immune • Gate drive supply range from 10 to 20V • Undervoltage lockout for both channels • 3.3V logic compatible Separate logic supply range from 3.3V to 20V Logic and power ground ±5V offset • CMOS Schmitt-triggered inputs with pull-down • Cycle by cycle edge-triggered shutdown logic • Matched propagation delay for both channels • Outputs in phase with inputs
Technical parameters
Parameters
Compare grouped IR2113PBF parameters from Infineon Technologies, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Attribute
Part Status
Active
Product Attribute
Mounting Type
Through Hole
Product Attribute
REACH Status
REACH Unaffected
Product Attribute
ECCN
EAR99
Product Attribute
Packaging
Tube
Product Attribute
Mounting Type
Surface Mount, Through Hole
IR2113PBF Product Attribute
Parameter
Value
Part Status
Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.
Active
Mounting Type
Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.
Through Hole
REACH Status
Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.
REACH Unaffected
ECCN
Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.
EAR99
Packaging
Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.
Tube
Mounting Type
Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.
Surface Mount, Through Hole
Factory Lead Time
Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.
12 Weeks
Termination
Describes the method used to connect the component to the circuit board, such as solder, press-fit, or wire wrap. This affects assembly processes, reliability, and repairability. Check the termination type against your PCB footprint and soldering process to ensure compatibility.
SMD/SMT
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
DUAL
Technology
Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.
CMOS
Lead Free
Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.
Contains Lead, Lead Free
Height
Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.
2.35mm
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
14-DIP (0.300, 7.62mm)
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
Infineon Technologies
Operating Temperature
Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.
-40°C~150°C TJ
Published
Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.
1996
Length
Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.
10.4902mm
Number Of Functions
Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.
1
Radiation Hardening
Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.
No
Number Of Pins
Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.
14
Number Of Terminations
Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.
14
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
15V
Width
Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.
7.11mm
Operating Supply Voltage
Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.
15V
Max Output Voltage
Specifies the highest voltage the device can deliver at its output under specified conditions. Compare this limit with your application's supply and load requirements to ensure safe operation and avoid overvoltage damage.
20V
Power Dissipation
Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this rating with your application's expected power loss to ensure reliable operation. Always verify against the datasheet's derating curves and ambient temperature conditions.
1.25W
Number Of Outputs
Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.
2
Minimum Output Voltage
Specifies the lowest output voltage the component can reliably provide under specified conditions. Compare this value with your circuit's minimum required voltage to ensure proper operation. Always verify against the datasheet's electrical characteristics and test conditions.
10V
Output Voltage
Specifies the regulated voltage level available at the output pin under specified load and input conditions. Compare this value with your circuit requirements and verify against the datasheet's tolerance and temperature derating.
20V
Nominal Supply Current
Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.
340μA
Fall Time (Typ)
Typical time for the output signal to transition from 90% to 10% of its amplitude. This parameter indicates switching speed and affects high-frequency performance. Compare with rise time and verify against the datasheet for your specific operating conditions.
25 ns
Max Output Current
Specifies the highest continuous current the device can supply at its output without exceeding thermal or electrical limits. Compare this value with your load requirements and derating curves. Always verify against the datasheet for your operating conditions.
2A
Max Power Dissipation
Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.
1.25W
High Side Driver
Specifies whether the component integrates a high-side driver for controlling power switches. This is critical for motor control, power conversion, and half-bridge topologies. Verify the driver's voltage rating, current capability, and protection features against your application requirements.
YES
Subcategory
A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.
MOSFET Drivers
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
PMIC - Gate Drivers
Type
Select the component category that best matches your application, such as resistor, capacitor, diode, or connector. This classification helps narrow down the correct part family and ensures compatibility with your circuit design. Verify the type against the datasheet to avoid mismatches.
Integrated Circuit (IC)
Max Supply Current
Maximum current drawn from the power supply under specified operating conditions. Compare this value across similar components to estimate power consumption and thermal load. Always verify against the datasheet for your exact supply voltage and load scenario.
340μA
Rise / Fall Time (Typ)
Typical rise and fall time of the output signal, indicating how quickly the device transitions between logic levels. These values affect signal integrity and switching losses. Compare them with your application's required slew rate and check the datasheet for test conditions.
25ns 17ns
Turn On Time
Time required for the device to transition from off state to fully on state. This parameter is critical for timing analysis in power supplies, drivers, and switching circuits. Verify this value against your system's timing budget and switching frequency requirements.
0.15 μs
Output Current
Current supplied at the output, indicating the load-driving capability of the component. This is crucial for ensuring the component can drive downstream circuitry without overheating or voltage drop. Compare with your load requirements and check the datasheet for maximum ratings.
2.5A
Reference Voltage
Specifies the stable voltage output used as a benchmark for the component's operation. Compare this value when selecting voltage references or regulators. Always verify against the datasheet for accuracy and temperature stability.
600V
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
IR2113PBF
Manufacturer'S Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
IR2113PBF
IR2113PBF Export Classifications & Environmental
Parameter
Value
Moisture Sensitivity Level (MSL)
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
1 (Unlimited)
RoHS Status
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
RoHS non-compliant
REACH SVHC
Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.
No SVHC
HTSUS
Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.
8542.39.0001
ECCN Code
Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.
EAR99
IR2113PBF Product Parameter
Parameter
Value
Turn-Off Delay Time
Measures the time from when the turn-off command is applied to when the device actually begins to switch off. This delay affects switching losses and timing in power circuits. Engineers compare this parameter to ensure proper synchronization and to minimize power dissipation during high-frequency operation.
20 ns
Turn On Delay Time
Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.
20 ns
Input Type
Specifies the configuration of the input signal path, such as single-ended or differential. This affects noise immunity and interface compatibility. Verify the input type against your signal source and the datasheet to ensure proper connection and performance.
Non-Inverting
Propagation Delay
Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.
150 ns
Driven Configuration
Specifies the topology of power switches driven by the controller, such as half-bridge or full-bridge. This determines the circuit's voltage and current handling, efficiency, and application suitability. Verify against the datasheet to ensure the driver matches your power stage design.
Half-Bridge
Channel Type
Specifies the electrical channel configuration, such as unidirectional or bidirectional, for signal or power routing. This attribute is critical for selecting components like multiplexers, isolators, or level shifters. Verify the channel type against your application requirements and the datasheet to ensure correct signal flow and compatibility.
Independent
Gate Type
Specifies the semiconductor technology used for the gate terminal, such as IGBT or MOSFET. This determines drive requirements, switching speed, and voltage ratings. Verify compatibility with your gate driver and application before selection.
IGBT, N-Channel MOSFET
Supply Voltage
Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.
3.3V~20V
Output Peak Current Limit
Specifies the maximum instantaneous output current the device can deliver without damage or shutdown. Compare this limit with your inrush and transient load requirements. Verify against the datasheet's safe operating area and pulse conditions to ensure reliable operation.
2.5A
Peak Output Current (Source/Sink)
Indicates the maximum instantaneous current the device can deliver or absorb at its output. Compare source and sink ratings separately, as they may differ. Verify against the datasheet for your load conditions to ensure reliable operation.
2A 2A
Logic Voltage - VIL, VIH
Defines the input voltage thresholds for logic low (VIL) and logic high (VIH) states. Ensure your driving signals exceed VIH and stay below VIL to guarantee correct logic interpretation and noise immunity in your design.
6V 9.5V
Rise Time
Time required for a signal to transition from a low to a high level, typically measured between 10% and 90% of the amplitude. Important for digital interfaces, switching regulators, and pulse circuits. Check the datasheet for test conditions and load capacitance.
35ns
Datasheet preview
Datasheet PDF viewer
Preview the IR2113PBF datasheet from Infineon Technologies to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for IR2113PBF. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Targeted answers for buyers verifying the exact IR2113PBF ordering code, packaging, stock, datasheet, and replacement path.
What does IR2113PBF mean?
IR2113PBF is the exact ordering code listed for a PMIC - Gate Drivers component from Infineon Technologies. The current package reference is DIP, with listed context including IC MOSFET DVR HI/LO SIDE 14-DIP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the IR2113PBF ordering code?
Treat IR2113PBF as the full ordering code during RFQ and engineering review. Confirm the listed DIP package, manufacturer documentation from Infineon Technologies, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is IR2113PBF supplied in?
IR2113PBF is currently listed with package reference DIP from Infineon Technologies. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is IR2113PBF currently available?
IR2113PBF is currently marked with stock availability on this page. Before ordering, confirm the package (DIP), listed stock (114518), available quantity (87149), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare IR2113PBF alternatives?
A mapped alternative list is not currently published for IR2113PBF. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.