AD6641BCPZ-500 RF Misc ICs and Modules by Analog Devices Inc
AD6641BCPZ-500 is a RF Misc ICs and Modules from Analog Devices Inc in CSP packaging. It is commonly reviewed for IC IF RCVR 11BIT 200MSPS 56LFCSP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for AD6641BCPZ-500 before RFQ, PO release, and shipment planning.
1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
Exact MPN confirmed: AD6641BCPZ-500
Package to verify: CSP
Commercial confirmation
Live stock and lead time confirmed by RFQ
Final price and tax terms confirmed before PO release
Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Technical parameters
Parameters
Compare grouped AD6641BCPZ-500 parameters from Analog Devices Inc, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Attribute
Part Status
Active
Product Attribute
Packaging
Tray
Product Attribute
REACH Status
REACH Unaffected
Product Attribute
Lead Free
Contains Lead
Product Attribute
Mounting Type
Surface Mount
Product Attribute
Factory Lead Time
8 Weeks
AD6641BCPZ-500 Product Attribute
Parameter
Value
Part Status
Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.
Active
Packaging
Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.
Tray
REACH Status
Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.
REACH Unaffected
Lead Free
Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.
Contains Lead
Mounting Type
Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.
Surface Mount
Factory Lead Time
Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.
8 Weeks
Minimum Operating Temperature
Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs.
-40°C
Length
Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.
8mm
Max Operating Temperature
Specifies the highest ambient temperature at which the component reliably functions. Compare this limit with your application's thermal environment to ensure safe operation. Always verify against the datasheet's derating curves and test conditions, as exceeding this value may cause performance degradation or permanent damage.
85°C
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
Analog Devices Inc./Maxim Integrated
Peak Reflow Temperature (Cel)
Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.
260
Qualification Status
Shows if the component meets a specific industry standard or reliability level. Buyers should verify this against the datasheet to ensure the part is suitable for their application's environmental and performance requirements.
Not Qualified
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
QUAD
Terminal Pitch
Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.
0.5mm
Lifecycle Status
Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.
PRODUCTION (Last Updated: 2 weeks ago)
Minimum Supply Voltage
Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges.
1.8V
Resolution
Resolution defines the smallest detectable change in a sensor's output or measurement. For electronic components, it determines precision and accuracy. Engineers compare resolution to ensure the component meets system requirements. Always verify the datasheet for exact resolution specifications under operating conditions.
1.5 B
Terminal Form
Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.
NO LEAD
Converter Type
Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.
ADC, PROPRIETARY METHOD
Technology
Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.
BICMOS
Temperature Grade
Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.
INDUSTRIAL
Sampling Rate
Number of analog signal samples taken per second by an ADC or digital sensor. Determines maximum signal frequency that can be accurately captured. Verify against datasheet for your application's bandwidth needs.
500 Msps
Input Capacitance
Input capacitance is the effective capacitance measured at the input terminals of a component. It affects signal integrity, impedance matching, and filter design. Engineers compare this value to ensure proper circuit operation and stability, especially in high-frequency applications. Always verify against the datasheet for accurate performance.
1.3pF
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
56-VFQFN Exposed Pad, CSP
Pb-Free Code
Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.
no
Number Of Bits
Bit width of digital data processed by a converter, processor, or memory. Higher bits mean better resolution or precision. Verify against datasheet to match your system's data width and accuracy needs.
12
Reflow Temperature-Max (S)
Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.
30
Contact Plating
Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.
Tin
Mounting Type
Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.
Surface Mount
Width
Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.
8mm
Height
Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.
800μm
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
1.9V
Max Supply Voltage
Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.
2V
Operating Supply Voltage
Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.
1.9V
Number Of Terminations
Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.
56
Number Of Pins
Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.
56
Integral Nonlinearity (INL)
Indicates the maximum deviation of the ADC or DAC transfer function from an ideal straight line. Compare this value to ensure conversion accuracy for precision measurement and control applications. Verify against the datasheet's specified conditions, such as temperature and supply voltage.
0.6 LSB
Max Input Voltage
Maximum voltage that can be applied to the input without causing damage or malfunction. Exceeding this limit may lead to breakdown or reduced reliability. Always compare with your supply voltage and check the datasheet for absolute maximum ratings.
1.6V
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
RF/IF and RFID
ECCN
Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.
5A991B
RF Type
Specifies the RF application or standard the component is designed for, such as Bluetooth, Wi-Fi, or Zigbee. Buyers use this to ensure compatibility with their wireless protocol and frequency band. Verify the exact RF type against the datasheet to avoid mismatches in your design.
General Purpose
Max Power Dissipation
Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.
779mW
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
RF Misc ICs and Modules
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
AD6641
Power Dissipation
Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this rating with your application's expected power loss to ensure reliable operation. Always verify against the datasheet's derating curves and ambient temperature conditions.
695mW
Secondary Attributes
Lists additional parameters that further define the component's performance or features beyond the primary specifications. Review these attributes to understand special capabilities, limitations, or compliance details that may affect your design, and always confirm them in the manufacturer's datasheet.
On-Chip A/D Converter
Manufacturer'S Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
AD6641BCPZ-500
AD6641BCPZ-500 Product Parameter
Parameter
Value
Sample And Hold / Track And Hold
Specifies the sampling technique in an ADC, affecting how the analog input is captured and held during conversion. Engineers compare this to ensure the ADC meets the required signal acquisition speed and accuracy for their application.
SAMPLE
Output Format
Specifies the electrical or digital format of the output signal, such as analog voltage, current loop, or digital protocol. Engineers compare this to ensure compatibility with downstream circuitry or controllers. Verify the exact format and levels in the datasheet before integration.
PARALLEL, WORD
Signal To Noise Ratio (SNR)
The ratio of signal power to noise power, expressed in decibels. Higher SNR indicates better signal quality and less noise interference. Compare this value when selecting components for high-fidelity or precision applications, and verify it under specified test conditions.
66 dB
Output Bit Code
Specifies the binary representation of the digital output signal. This code defines how the device encodes its output state. Engineers compare this to the datasheet to ensure compatibility with the receiving logic and to verify correct decoding of the output data.
OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE
Number Of Analog Input Channels
Indicates how many analog input channels the device supports. Compare this with your system's sensor or signal requirements. Verify against the datasheet to ensure the device has enough inputs for your application and that input voltage ranges match your signals.
1
Number Of Channels
Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections.
1
Supply Type
Indicates the required power source, such as AC or DC, for the component. Engineers compare this to ensure compatibility with the system's power architecture. Verify the supply type against the datasheet to avoid incorrect power connections.
Single
Differential Nonlinearity
Indicates the maximum deviation of an actual code step from the ideal one-step size in an ADC or DAC. Compare this parameter across converters to assess linearity and potential distortion. Verify the specified value in the datasheet for your operating conditions.
0.5 LSB
Logic Function
Specifies the Boolean operation performed by the logic IC, such as AND, OR, NAND, or XOR. Engineers compare this to match the required signal processing in their circuit. Verify the exact function against the datasheet to ensure correct logic behavior.
Receiver
Function
Specifies the logical or operational function of the component, such as switching, amplification, or regulation. This attribute helps identify the device's role in a circuit. Verify the function against the datasheet to ensure it matches your application requirements.
This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.
e3
RoHS Status
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
ROHS3 Compliant
REACH SVHC
Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.
No SVHC
HTSUS
Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.
8542.39.0001
Moisture Sensitivity Level (MSL)
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
3 (168 Hours)
Datasheet preview
Datasheet PDF viewer
Preview the AD6641BCPZ-500 datasheet from Analog Devices Inc to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for AD6641BCPZ-500. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Targeted answers for buyers verifying the exact AD6641BCPZ-500 ordering code, packaging, stock, datasheet, and replacement path.
What does AD6641BCPZ-500 mean?
AD6641BCPZ-500 is the exact ordering code listed for a RF Misc ICs and Modules component from Analog Devices Inc. The current package reference is CSP, with listed context including IC IF RCVR 11BIT 200MSPS 56LFCSP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the AD6641BCPZ-500 ordering code?
Treat AD6641BCPZ-500 as the full ordering code during RFQ and engineering review. Confirm the listed CSP package, manufacturer documentation from Analog Devices Inc, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is AD6641BCPZ-500 supplied in?
AD6641BCPZ-500 is currently listed with package reference CSP from Analog Devices Inc. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is AD6641BCPZ-500 currently available?
AD6641BCPZ-500 is currently marked with stock availability on this page. Before ordering, confirm the package (CSP), listed stock (88786), available quantity (98703), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare AD6641BCPZ-500 alternatives?
A mapped alternative list is not currently published for AD6641BCPZ-500. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.