7201LA15J Logic - FIFOs Memory by Integrated Device Technology

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Specifies the lowest DC input voltage at which the component reliably operates. Compare this value with your system's power rail tolerances and the device's recommended operating conditions to ensure stable performance across all load and temperature ranges.

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

Specifies the voltage range within which the component operates correctly. Check the datasheet to ensure your power supply meets the minimum and maximum limits, as exceeding them can damage the device or cause malfunction.

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.

Describes the internal arrangement of components, such as resistor networks or switch contacts. This affects the circuit topology and pinout. Engineers must verify this configuration against the datasheet to ensure correct integration into the PCB layout and proper functionality.

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs.

Operating frequency of the clock signal that drives the device. Determines processing speed and timing accuracy. Compare with your system's required clock rate and check the datasheet for maximum and typical values.

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

Specifies the highest ambient temperature at which the component reliably functions. Compare this limit with your application's thermal environment to ensure safe operation. Always verify against the datasheet's derating curves and test conditions, as exceeding this value may cause performance degradation or permanent damage.

Indicates whether the component operates in synchronous or asynchronous mode. This affects timing, clocking, and data transfer protocols. Verify the mode against your system requirements and the datasheet to ensure proper integration and performance.

Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.

Maximum current drawn from the power supply under specified operating conditions. Compare this value across similar components to estimate power consumption and thermal load. Always verify against the datasheet for your exact supply voltage and load scenario.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Specifies the memory technology and architecture of the integrated circuit, such as SRAM, DRAM, or Flash. Buyers use this to match the memory type required by their application. Verify the exact part number and datasheet for compatibility.

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

First-word fall-through (FWFT) support indicates whether a FIFO memory device can output the first stored word without a read request. This feature reduces latency in data streaming. Check the datasheet to confirm FWFT mode availability and its effect on system timing.

Specifies the number of bits in a single data word for memory or processor components. Compare word sizes when selecting devices for data throughput and processing capability. Verify the exact word size in the datasheet to ensure compatibility with your system architecture.

Maximum current drawn by the component when in standby or sleep mode. Lower values extend battery life in portable designs. Verify against datasheet conditions, as standby current can vary with supply voltage and temperature.

Specifies the internal arrangement of memory cells, typically expressed as words by bits. This affects how data is accessed and stored. Engineers compare this to ensure compatibility with their system's bus width and addressing scheme. Always verify against the datasheet for exact configuration.

Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Indicates whether the bus supports data flow in one direction only or in both directions. This affects signal routing and buffer design. Verify against the datasheet to ensure compatibility with your system's communication requirements.

Indicates whether the device can re-transmit received signals, important for repeaters, isolators, or bus drivers. Check this attribute when the component must regenerate or forward data in a communication chain, and verify against the datasheet for supported protocols and signal integrity.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

Cycle time is the duration of one complete operation cycle for a component or system. Engineers compare this to ensure timing meets application requirements. Verify against the datasheet when designing time-critical circuits or selecting parts for high-speed operations.

Indicates whether the device has an output enable function that controls the output state. Engineers compare this feature to ensure proper bus control and tri-state operation. Check the datasheet for logic levels and timing requirements.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Thickness of the component, a critical dimension for PCB clearance, enclosure fit, and thermal performance. This measurement is especially important for capacitors, inductors, and connectors. Ensure the thickness meets your design constraints and does not interfere with adjacent components. Check the datasheet for tolerance and recommended mounting height.

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

Specifies the delay from address or control signal assertion until valid data is available at the output. Critical for memory and FPGA configuration devices. Compare with system clock requirements and verify against datasheet timing diagrams.

Indicates whether the component communicates via parallel or serial interface. This affects wiring complexity, data transfer speed, and compatibility with your microcontroller or system bus. Verify the interface type against your design requirements and the datasheet before integration.

Total storage capacity of the memory chip, typically expressed in bits or bytes. Compare densities to match your application's code and data requirements. Verify against the datasheet to ensure sufficient headroom for firmware and runtime variables.

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts.