MC74HC74ADR2G Logic - Flip Flops by ON Semiconductor
MC74HC74ADR2G is a Logic - Flip Flops from ON Semiconductor in 14SOIC packaging. It is commonly reviewed for IC FF D-TYPE DUAL 1BIT 14SOIC. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for MC74HC74ADR2G before RFQ, PO release, and shipment planning.
1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
2
Check stock and price
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3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
4
Arrange shipment
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Before PO release
Part confirmation
Exact MPN confirmed: MC74HC74ADR2G
Package to verify: 14SOIC
Commercial confirmation
Live stock and lead time confirmed by RFQ
Final price and tax terms confirmed before PO release
Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for MC74HC74ADR2G from ON Semiconductor, including product identity, application fit, package notes, and purchasing considerations.
Dual D Flip-Flop with Set and ResetHigh−Performance Silicon−Gate CMOS The MC74HC74A is identical in pinout to the LS74. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.This device consists of two D flip−flops with individual Set, Reset, and Clock inputs. Information at a D−input is transferred to the corresponding Q output on the next positive going edge of the clock input. Both Q and Q outputs are available from each flip−flop. The Set and Reset inputs are asynchronous. Features • Output Drive Capability: 10 LSTTL Loads • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 μA • High Noise Immunity Characteristic of CMOS Devices • In Compliance with the JEDEC Standard No. 7.0 A Requirements • Chip Complexity: 128 FETs or 32 Equivalent Gates • These Devices are Pb−Free, Halogen Free and are RoHS Compliant
Technical parameters
Parameters
Compare grouped MC74HC74ADR2G parameters from ON Semiconductor, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Parameter
Logic Function
AND, D-Type, Flip-Flop
Product Parameter
Output Current High/Low
5.2mA 5.2mA
Product Parameter
Propagation Delay
160 ns
Product Parameter
Number Of Channels
2
Product Parameter
Supply Voltage-Min (Vsup)
2V
Product Parameter
Time At Peak Reflow Temperature (Max)
40
MC74HC74ADR2G Product Parameter
Parameter
Value
Logic Function
Specifies the Boolean operation performed by the logic IC, such as AND, OR, NAND, or XOR. Engineers compare this to match the required signal processing in their circuit. Verify the exact function against the datasheet to ensure correct logic behavior.
AND, D-Type, Flip-Flop
Output Current High/Low
Specifies the maximum current the output can source or sink in high and low logic states. Compare with the load requirements to ensure reliable logic levels. Verify against the datasheet for absolute maximum ratings and derating conditions.
5.2mA 5.2mA
Propagation Delay
Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.
160 ns
Number Of Channels
Specifies how many independent signal paths or outputs the component provides. Compare this value with your circuit requirements to ensure each channel can be used separately. Verify the channel configuration in the datasheet, as some devices may share pins or have internal connections.
2
Supply Voltage-Min (Vsup)
Minimum supply voltage for proper operation. Check the datasheet to ensure your power rail meets this threshold. Critical for low-voltage designs and battery-powered applications. Compare across parts to avoid undervoltage failures.
2V
Time At Peak Reflow Temperature (Max)
Specifies the maximum duration a component can withstand at the peak reflow temperature during soldering. Critical for evaluating solder joint reliability and preventing thermal damage. Verify against the datasheet's recommended soldering profile to ensure proper assembly.
40
Supply Voltage-Max (Vsup)
Specifies the highest DC supply voltage the component can tolerate without damage or malfunction. Engineers compare this to the system's power rail to ensure safe operation. Always verify against the datasheet's absolute maximum ratings.
6V
Supply Voltage
Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.
2V~6V
Clock Edge Trigger Type
Indicates whether the device samples data on the rising or falling edge of the clock signal. This timing parameter is critical for interfacing with other logic. Verify the required edge against your system's timing diagram and the datasheet to ensure correct synchronization.
Positive Edge
Turn On Delay Time
Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.
17 ns
Number Of Bits Per Element
Specifies the bit width of each logic element in the device. Compare this value to the required data path width for your application. Verify against the datasheet to ensure the logic family and package variant meet your design's bit-level requirements.
1
Max Propagation Delay @ V, Max CL
Specifies the worst-case time for a signal to travel through the device from input to output, measured at a given supply voltage and load capacitance. Compare this value with your system's timing budget to ensure reliable operation, and verify it against the datasheet for your specific operating conditions.
17ns @ 6V, 50pF
MC74HC74ADR2G Product Attribute
Parameter
Value
Part Status
Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.
Active
Lead Free
Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.
Lead Free
Mounting Type
Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.
Surface Mount
Published
Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.
2007
Lifecycle Status
Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.
ACTIVE (Last Updated: 5 days ago)
Packaging
Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.
Tape & Reel (TR)
Halogen Free
Confirms whether the component is manufactured without halogenated compounds, such as bromine or chlorine, which are restricted in many industries due to environmental and safety regulations. Important for compliance with green standards and for use in sensitive applications.
Halogen Free
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
DUAL
Peak Reflow Temperature (Cel)
Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.
260
Terminal Form
Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.
GULL WING
Technology
Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.
CMOS
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
3V
Operating Temperature
Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.
-55°C~125°C TA
Polarity
Specifies whether the component or signal has a defined positive and negative orientation, such as for diodes, electrolytic capacitors, or connectors. Incorrect polarity can cause failure or unsafe operation. Always check the datasheet and board markings before installation.
Non-Inverting
Height
Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.
1.75mm
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
ON Semiconductor
Factory Lead Time
Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.
51 Weeks
Input Capacitance
Input capacitance is the effective capacitance measured at the input terminals of a component. It affects signal integrity, impedance matching, and filter design. Engineers compare this value to ensure proper circuit operation and stability, especially in high-frequency applications. Always verify against the datasheet for accurate performance.
10pF
Packing Method
Specifies the packaging format for delivery, such as tube, reel, tray, or tape and reel. This affects handling, storage, and assembly processes. Verify the packing method against your production requirements and the datasheet to ensure compatibility with your pick-and-place equipment.
TR
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
14-SOIC (0.154, 3.90mm Width)
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Logic - Flip Flops
Subcategory
A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.
FF/Latches
Series
Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.
74HC
Contact Plating
Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.
Tin
Radiation Hardening
Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.
No
Width
Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.
4mm
Number Of Pins
Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.
14
Number Of Terminations
Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.
14
Mounting Type
Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.
Surface Mount
Pb-Free Code
Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.
yes
Length
Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.
8.75mm
Load Capacitance
Specifies the capacitive load the component is designed to drive, affecting signal integrity and timing. Compare this value with your circuit's trace and input capacitance to ensure stable operation. Verify against the datasheet for optimal performance.
50pF
Type
Select the component category that best matches your application, such as resistor, capacitor, diode, or connector. This classification helps narrow down the correct part family and ensures compatibility with your circuit design. Verify the type against the datasheet to avoid mismatches.
D-Type
Output Current
Current supplied at the output, indicating the load-driving capability of the component. This is crucial for ensuring the component can drive downstream circuitry without overheating or voltage drop. Compare with your load requirements and check the datasheet for maximum ratings.
5.2mA
Number Of Outputs
Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.
4
Power Rating
Specifies the maximum power the component can safely dissipate under defined operating conditions. Compare this value with your circuit's power requirements to prevent overheating and ensure reliable operation. Always verify against the datasheet for derating curves and ambient temperature limits.
HC/UH
Nominal Input Voltage (DC)
Typical DC voltage level for which the component is designed to operate optimally. This value helps select appropriate power supplies and ensures the device functions within its specified input range. Check the datasheet for tolerance and absolute maximum ratings to avoid overvoltage conditions.
Positive Edge
Output Type
Specifies the electrical form of the output signal, such as digital, analog, or open collector. This determines how the component interfaces with your circuit. Verify the output type against your system requirements and the datasheet to ensure proper signal compatibility and avoid logic level mismatches.
Differential
Clock Frequency
Operating frequency of the clock signal that drives the device. Determines processing speed and timing accuracy. Compare with your system's required clock rate and check the datasheet for maximum and typical values.
35MHz
Current Rating
Specifies the maximum continuous current the component can safely carry under specified conditions. Compare this value with your circuit's expected load to ensure reliable operation. Always verify against the datasheet for temperature derating and mounting considerations.
4μA
Quiescent Current
Quiescent current is the current drawn by the device when it is in standby or no-load condition. It affects battery life in portable applications. Compare this value across similar components to ensure low power consumption. Always verify against the datasheet for your specific operating conditions.
2μA
Base Part Number
Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.
74HC74
Manufacturer'S Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
MC74HC74ADR2G
Access Time (Max)
Maximum time required to read or write data in memory devices. Lower values indicate faster performance. Critical for timing analysis in digital systems. Verify against the datasheet to ensure it meets your system's speed requirements.
1
Display & Interface Controllers
Specifies the type of controller IC used to drive displays or manage communication interfaces. Verify compatibility with your display panel or bus protocol. Compare power consumption, supported resolutions, and interface standards before selecting a part for your design.
This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.
e3
RoHS Status
Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.
ROHS3 Compliant
REACH SVHC
Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.
No SVHC
Moisture Sensitivity Level (MSL)
Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.
1 (Unlimited)
ECCN Code
Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.
EAR99
Datasheet preview
Datasheet PDF viewer
Preview the MC74HC74ADR2G datasheet from ON Semiconductor to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for MC74HC74ADR2G. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Targeted answers for buyers verifying the exact MC74HC74ADR2G ordering code, packaging, stock, datasheet, and replacement path.
What does MC74HC74ADR2G mean?
MC74HC74ADR2G is the exact ordering code listed for a Logic - Flip Flops component from ON Semiconductor. The current package reference is 14SOIC, with listed context including IC FF D-TYPE DUAL 1BIT 14SOIC. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the MC74HC74ADR2G ordering code?
Treat MC74HC74ADR2G as the full ordering code during RFQ and engineering review. Confirm the listed 14SOIC package, manufacturer documentation from ON Semiconductor, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is MC74HC74ADR2G supplied in?
MC74HC74ADR2G is currently listed with package reference 14SOIC from ON Semiconductor. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is MC74HC74ADR2G currently available?
MC74HC74ADR2G is currently marked with stock availability on this page. Before ordering, confirm the package (14SOIC), listed stock (153308), available quantity (70366), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare MC74HC74ADR2G alternatives?
A mapped alternative list is not currently published for MC74HC74ADR2G. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.