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MCP14E10-E/P PMIC - Gate Drivers by Microchip Technology

MCP14E10-E/P is a PMIC - Gate Drivers from Microchip Technology in DIP packaging. It is commonly reviewed for IC MOSFET DRIVER 3A 8DIP. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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MCP14E10-E/P PMIC - Gate Drivers by Microchip Technology | TrustCompo
Pictures are for reference only. Please contact us for the latest pictures.
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Key specifications

Part Number

MCP14E10-E/P

Internal code

TCE000056599

Package

DIP

Key specifications

Series

-

Min Quantity

1

Description

IC MOSFET DRIVER 3A 8DIP

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for MCP14E10-E/P before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: MCP14E10-E/P
  • Package to verify: DIP

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Technical parameters

Parameters

Compare grouped MCP14E10-E/P parameters from Microchip Technology, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Attribute

    Part Status

    Active

  • Product Attribute

    Mounting Type

    Through Hole

  • Product Attribute

    REACH Status

    REACH Unaffected

  • Product Attribute

    ECCN

    EAR99

  • Product Attribute

    Length

    10.16mm

  • Product Attribute

    Lead Free

    Lead Free

MCP14E10-E/P Product Attribute
ParameterValue
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Active
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Through Hole
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

10.16mm
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Lead Free
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tube
Published

Published indicates the date when the product data was released or updated in the catalog. It helps buyers assess the freshness of the information and whether the component is current or possibly obsolete. Check the datasheet for the latest revisions.

2011
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

7 Weeks
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

DUAL
Qualification Status

Shows if the component meets a specific industry standard or reliability level. Buyers should verify this against the datasheet to ensure the part is suitable for their application's environmental and performance requirements.

Not Qualified
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Microchip Technology
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

8-DIP (0.300, 7.62mm)
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-40°C~150°C TJ
Height

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.

4.953mm
Number Of Functions

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

1
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

8
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

8
Pin Count

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

8
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

7.112mm
Surface Mount

Mounting type: surface mount or through-hole. Surface mount components are placed directly on the PCB, saving space and enabling automated assembly. Through-hole components offer stronger mechanical bonds. Verify the mounting style matches your PCB design and assembly process.

NO
Supply Voltage

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

12V
Reflow Temperature-Max (S)

Maximum time the component can be exposed to the peak reflow temperature during soldering. Exceeding this duration may cause damage or degrade reliability. Ensure your soldering profile stays within this limit and check the datasheet for exact conditions.

NOT APPLICABLE
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

NOT APPLICABLE
Number Of Outputs

Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.

2
Input Bias Current

Specifies the DC current flowing into the input terminals of an operational amplifier or other analog IC. It affects offset voltage and signal accuracy. Compare values when selecting precision amplifiers, and verify against the datasheet for your operating conditions.

10μA
Nominal Supply Current

Typical current drawn from the supply under nominal operating conditions. Compare this value across similar components to estimate power consumption and thermal behavior. Always verify against the datasheet for your specific voltage and load conditions.

1.8mA
Output Current

Current supplied at the output, indicating the load-driving capability of the component. This is crucial for ensuring the component can drive downstream circuitry without overheating or voltage drop. Compare with your load requirements and check the datasheet for maximum ratings.

3A
High Side Driver

Specifies whether the component integrates a high-side driver for controlling power switches. This is critical for motor control, power conversion, and half-bridge topologies. Verify the driver's voltage rating, current capability, and protection features against your application requirements.

YES
Subcategory

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

MOSFET Drivers
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

PMIC - Gate Drivers
Fall Time (Typ)

Typical time for the output signal to transition from 90% to 10% of its amplitude. This parameter indicates switching speed and affects high-frequency performance. Compare with rise time and verify against the datasheet for your specific operating conditions.

17 ns
Turn On Time

Time required for the device to transition from off state to fully on state. This parameter is critical for timing analysis in power supplies, drivers, and switching circuits. Verify this value against your system's timing budget and switching frequency requirements.

0.04 µs
Max Supply Current

Maximum current drawn from the power supply under specified operating conditions. Compare this value across similar components to estimate power consumption and thermal load. Always verify against the datasheet for your exact supply voltage and load scenario.

1.8mA
Output Voltage

Specifies the regulated voltage level available at the output pin under specified load and input conditions. Compare this value with your circuit requirements and verify against the datasheet's tolerance and temperature derating.

18V
Max Output Current

Specifies the highest continuous current the device can supply at its output without exceeding thermal or electrical limits. Compare this value with your load requirements and derating curves. Always verify against the datasheet for your operating conditions.

3A
Input Current

Defines the current drawn at the input terminal under normal operating conditions. Essential for power supply design and thermal management. Check this value against your system's power budget and ensure the input source can deliver it without voltage drop.

1μA
Max Power Dissipation

Maximum power the component can safely dissipate as heat without damage. Exceeding this may cause failure. Check datasheet for thermal resistance and derating curves under your operating conditions.

1.12W
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

MCP14E10-E/P
Power Dissipation

Maximum power the component can safely dissipate as heat without exceeding its thermal limits. Compare this rating with your application's expected power loss to ensure reliable operation. Always verify against the datasheet's derating curves and ambient temperature conditions.

1.12W
Rise / Fall Time (Typ)

Typical rise and fall time of the output signal, indicating how quickly the device transitions between logic levels. These values affect signal integrity and switching losses. Compare them with your application's required slew rate and check the datasheet for test conditions.

25ns 25ns
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

MCP14E10
MCP14E10-E/P Export Classifications & Environmental
ParameterValue
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

1 (Unlimited)
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
REACH SVHC

Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.

No SVHC
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8542.39.0001
ECCN Code

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

EAR99
MCP14E10-E/P Product Parameter
ParameterValue
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Matte Tin (Sn) - annealed
Turn On Delay Time

Time from when the input signal crosses its threshold until the output begins to turn on. This parameter affects switching speed and power dissipation in high-frequency circuits. Verify it against the datasheet for your specific load and drive conditions.

65 ns
Rise Time

Time required for a signal to transition from a low to a high level, typically measured between 10% and 90% of the amplitude. Important for digital interfaces, switching regulators, and pulse circuits. Check the datasheet for test conditions and load capacitance.

14ns
Input Type

Specifies the configuration of the input signal path, such as single-ended or differential. This affects noise immunity and interface compatibility. Verify the input type against your signal source and the datasheet to ensure proper connection and performance.

Non-Inverting
Output Peak Current Limit

Specifies the maximum instantaneous output current the device can deliver without damage or shutdown. Compare this limit with your inrush and transient load requirements. Verify against the datasheet's safe operating area and pulse conditions to ensure reliable operation.

3A
Channel Type

Specifies the electrical channel configuration, such as unidirectional or bidirectional, for signal or power routing. This attribute is critical for selecting components like multiplexers, isolators, or level shifters. Verify the channel type against your application requirements and the datasheet to ensure correct signal flow and compatibility.

Independent
Propagation Delay

Specifies the time interval between an input transition and the corresponding output transition. Critical for timing analysis in digital circuits. Verify against datasheet for specific test conditions, supply voltage, and load capacitance.

65 ns
Driven Configuration

Specifies the topology of power switches driven by the controller, such as half-bridge or full-bridge. This determines the circuit's voltage and current handling, efficiency, and application suitability. Verify against the datasheet to ensure the driver matches your power stage design.

Low-Side
Turn Off Time

Time required for the device to transition from the on state to the off state. Critical for switching applications, power converters, and drivers. Verify against the datasheet to ensure it meets your timing requirements.

0.04 µs
Interface IC Type

Specifies the communication protocol or standard implemented by the interface IC, such as RS-232, RS-485, CAN, or USB. This determines compatibility with your system's bus architecture. Verify the exact type against the datasheet to ensure proper signal levels and protocol support for your application.

HALF BRIDGE BASED MOSFET DRIVER
Peak Output Current (Source/Sink)

Indicates the maximum instantaneous current the device can deliver or absorb at its output. Compare source and sink ratings separately, as they may differ. Verify against the datasheet for your load conditions to ensure reliable operation.

3A 3A
Logic Voltage - VIL, VIH

Defines the input voltage thresholds for logic low (VIL) and logic high (VIH) states. Ensure your driving signals exceed VIH and stay below VIL to guarantee correct logic interpretation and noise immunity in your design.

0.8V 2.4V
Supply Voltage

Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.

4.5V~18V
Gate Type

Specifies the semiconductor technology used for the gate terminal, such as IGBT or MOSFET. This determines drive requirements, switching speed, and voltage ratings. Verify compatibility with your gate driver and application before selection.

IGBT, N-Channel, P-Channel MOSFET

Datasheet preview

Datasheet PDF viewer

Preview the MCP14E10-E/P datasheet from Microchip Technology to check package, electrical characteristics, application notes, and document evidence before RFQ.

Microchip Technology

MCP14E10-E/P

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Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for MCP14E10-E/P. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact MCP14E10-E/P ordering code, packaging, stock, datasheet, and replacement path.

What does MCP14E10-E/P mean?

MCP14E10-E/P is the exact ordering code listed for a PMIC - Gate Drivers component from Microchip Technology. The current package reference is DIP, with listed context including IC MOSFET DRIVER 3A 8DIP. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the MCP14E10-E/P ordering code?

Treat MCP14E10-E/P as the full ordering code during RFQ and engineering review. Confirm the listed DIP package, manufacturer documentation from Microchip Technology, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is MCP14E10-E/P supplied in?

MCP14E10-E/P is currently listed with package reference DIP from Microchip Technology. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is MCP14E10-E/P currently available?

MCP14E10-E/P is currently marked with stock availability on this page. Before ordering, confirm the package (DIP), listed stock (49017), available quantity (40722), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare MCP14E10-E/P alternatives?

A mapped alternative list is not currently published for MCP14E10-E/P. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.