
W25Q128BVFIG Embedded - FPGAs (Field Programmable Gate Array) by Winbond
W25Q128BVFIG is a Embedded - FPGAs (Field Programmable Gate Array) from Winbond in SOP packaging. It is commonly reviewed for Embedded - FPGAs (Field Programmable Gate Array). This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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Key specifications
- Part Number
W25Q128BVFIG
- Internal code
TCE000121073
- Package
SOP
- Manufacturer
- Winbond
Key specifications
- Series
-
- Min Quantity
1
- Category
- Integrated Circuits (ICs)
- Sub Category
- Embedded - FPGAs (Field Programmable Gate Array)
- Description
-
- key Attributes
-
Trust signals
Quality and trust signals
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for W25Q128BVFIG before RFQ, PO release, and shipment planning.
- 1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
- 2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
- 3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
- 4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
- Exact MPN confirmed: W25Q128BVFIG
- Package to verify: SOP
Commercial confirmation
- Live stock and lead time confirmed by RFQ
- Final price and tax terms confirmed before PO release
Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for W25Q128BVFIG from Winbond, including product identity, application fit, package notes, and purchasing considerations.
The W25Q128BVFIG is a high-performance serial NOR flash memory chip manufactured by Winbond Electronics. It is designed for a variety of applications, including consumer electronics, automotive, and industrial systems, where reliable and efficient non-volatile storage is required.
Key Features:
- Memory Capacity: The W25Q128BVFIG offers a storage capacity of 128 megabits (16 megabytes), making it suitable for storing firmware, configuration data, and other critical information.
- Interface: This chip utilizes a Serial Peripheral Interface (SPI), which allows for high-speed data transfer and easy integration with microcontrollers and other digital devices. It supports both standard SPI and dual/quad SPI modes, enabling faster read and write operations.
- Operating Voltage: The device operates within a voltage range of 2.7V to 3.6V, making it compatible with a wide range of power supply systems. This low voltage operation helps in reducing power consumption, which is crucial for battery-powered applications.
- Speed: The W25Q128BVFIG supports high-speed read operations, with a maximum clock frequency of up to 104 MHz in quad SPI mode. This allows for rapid data retrieval, enhancing the overall performance of the system it is integrated into.
- Endurance and Reliability: The chip is designed for high endurance, with a typical program/erase cycle endurance of 100,000 cycles. It also features data retention of up to 20 years, ensuring that stored data remains intact over long periods.
- Package Options: The W25Q128BVFIG is available in various package types, including SOIC-8, WSON-8, and other compact forms, facilitating easy integration into different circuit designs and layouts.
- Security Features: The device includes several security features, such as a hardware write protection mechanism and a unique serial number for each chip, which helps in preventing unauthorized access and ensuring data integrity.
- Command Set: The W25Q128BVFIG supports a comprehensive command set, including commands for reading, writing, erasing, and status checking, allowing for flexible and efficient memory management.
- Temperature Range: It is available in different temperature grade options, including commercial and industrial grades, making it suitable for a wide range of operating environments.
Applications:
The W25Q128BVFIG is widely used in various applications, including:
- Firmware storage in embedded systems
- Configuration data storage in IoT devices
- Data logging in automotive and industrial applications
- Boot code storage in consumer electronics
Overall, the W25Q128BVFIG from Winbond Electronics is a versatile and reliable flash memory solution that meets the demands of modern electronic applications, providing high performance, security, and efficiency.
Technical parameters
Parameters
Compare grouped W25Q128BVFIG parameters from Winbond, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Attribute
Categories
Integrated Circuits (ICs)
Product Attribute
Sub-Categories
Embedded - FPGAs (Field Programmable Gate Array)
Product Attribute
Manufacturer
Winbond Electronics
Product Attribute
Manufacturer'S Part No.
W25Q128BVFIG
| Parameter | Value |
|---|---|
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Integrated Circuits (ICs) |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Embedded - FPGAs (Field Programmable Gate Array) |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Winbond Electronics |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | W25Q128BVFIG |
Notice documents
PCN / product notice documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for W25Q128BVFIG. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
Recommended products
Explore related Embedded - FPGAs (Field Programmable Gate Array) products to compare fit, stock status, datasheets, and sourcing options.
Common questions
Product FAQ
Targeted answers for buyers verifying the exact W25Q128BVFIG ordering code, packaging, stock, datasheet, and replacement path.
What does W25Q128BVFIG mean?
W25Q128BVFIG is the exact ordering code listed for a Embedded - FPGAs (Field Programmable Gate Array) component from Winbond. The current package reference is SOP, with listed context including -. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the W25Q128BVFIG ordering code?
Treat W25Q128BVFIG as the full ordering code during RFQ and engineering review. Confirm the listed SOP package, manufacturer documentation from Winbond, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is W25Q128BVFIG supplied in?
W25Q128BVFIG is currently listed with package reference SOP from Winbond. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is W25Q128BVFIG currently available?
W25Q128BVFIG is currently marked with stock availability on this page. Before ordering, confirm the package (SOP), listed stock (26430), available quantity (14939), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.
Where can I compare W25Q128BVFIG alternatives?
A mapped alternative list is not currently published for W25Q128BVFIG. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.





