
DE2F3KY103MA3BM02 Ceramic Capacitors by Murata
DE2F3KY103MA3BM02 is a Ceramic Capacitors from Murata in DIP packaging. It is commonly reviewed for CAPACITOR, CERAMIC, MULTILAYER, F, 0.01uF, THROUGH HOLE MOUNT, RADIAL LEADED. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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Key specifications
- Part Number
DE2F3KY103MA3BM02
- Internal code
TCE000120963
- Package
DIP
- Manufacturer
- Murata
Key specifications
- Series
-
- Min Quantity
1
- Category
- Capacitors
- Sub Category
- Ceramic Capacitors
- Description
CAPACITOR, CERAMIC, MULTILAYER, F, 0.01uF, THROUGH HOLE MOUNT, RADIAL LEADED
- key Attributes
-
Trust signals
Quality and trust signals
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for DE2F3KY103MA3BM02 before RFQ, PO release, and shipment planning.
- 1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
- 2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
- 3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
- 4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
- Exact MPN confirmed: DE2F3KY103MA3BM02
- Package to verify: DIP
Commercial confirmation
- Live stock and lead time confirmed by RFQ
- Final price and tax terms confirmed before PO release
Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Technical parameters
Parameters
Compare grouped DE2F3KY103MA3BM02 parameters from Murata, including package, series, key attributes, and technical values used for engineering and sourcing review.
Export Classifications & Environmental
RoHS Status
RoHS Compliant
Export Classifications & Environmental
REACH SVHC
No SVHC
Export Classifications & Environmental
JESD-609 Code
e2
Export Classifications & Environmental
ECCN Code
EAR99
Product Attribute
Lead Free
Lead Free
Product Attribute
Max Operating Temperature
85°C
| Parameter | Value |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | RoHS Compliant |
REACH SVHC Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status. | No SVHC |
JESD-609 Code This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning. | e2 |
ECCN Code Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally. | EAR99 |
| Parameter | Value |
|---|---|
Lead Free Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations. | Lead Free |
Max Operating Temperature Specifies the highest ambient temperature at which the component reliably functions. Compare this limit with your application's thermal environment to ensure safe operation. Always verify against the datasheet's derating curves and test conditions, as exceeding this value may cause performance degradation or permanent damage. | 85°C |
Tolerance Allowed deviation from the nominal value, expressed as a percentage. Determines precision of resistors, capacitors, and inductors. Choose tighter tolerance for precision circuits, but verify actual performance in the datasheet. | 20% |
Minimum Operating Temperature Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs. | -25°C |
Radiation Hardening Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet. | No |
Pb-Free Code Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance. | yes |
Mounting Type Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities. | Through Hole |
Number Of Terminations Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity. | 2 |
Packing Method Specifies the packaging format for delivery, such as tube, reel, tray, or tape and reel. This affects handling, storage, and assembly processes. Verify the packing method against your production requirements and the datasheet to ensure compatibility with your pick-and-place equipment. | BULK |
Number Of Pins Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection. | 2 |
Voltage - Rated DC Specifies the maximum DC voltage the component can safely handle under rated conditions. Engineers compare this to the circuit's operating voltage to ensure adequate margin. Always verify against the datasheet's derating curves for temperature and reliability. | 250V |
Depth Physical depth of the component body, measured in millimeters or inches. This dimension affects PCB layout and mechanical fit. Verify against the datasheet for proper clearance in your enclosure or assembly. | 5mm |
Voltage - Rated AC Maximum AC voltage that the component can safely withstand under specified conditions. This rating is critical for insulation and safety margins. Always compare it with the operating voltage in your circuit and derate according to the datasheet guidelines. | 300V |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | Radial |
Terminal Shape Indicates the physical configuration of component leads, such as straight, angled, or formed. This affects PCB mounting, clearance, and soldering. Verify the terminal shape against your board layout and assembly process to ensure proper fit and reliable connections. | WIRE |
Voltage Indicates the maximum voltage the component can withstand or operate at, depending on context. Critical for ensuring the part is not overstressed in your application. Always compare with your circuit's voltage levels and consider transient spikes. | 250V |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Cut Tape |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Murata Electronics |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | Capacitors |
Lead Pitch Distance between centers of adjacent leads on a component. Critical for PCB layout and soldering. Engineers compare this to ensure the part fits the footprint. Verify against the datasheet for accurate mounting. | 7.5mm |
Lead Diameter Specifies the diameter of the component lead wire, which determines PCB hole size and solder joint reliability. Check this value against your board design and assembly requirements to ensure proper fit and avoid mechanical stress. | 600 μm |
Lead/Base Style Indicates the physical configuration of the component's leads or mounting base. This affects PCB layout, soldering process, and mechanical stability. Verify compatibility with your board design and assembly equipment before ordering. | Formed Leads |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | Ceramic Capacitors |
Material Specifies the base material of the component, such as ceramic, tantalum, or aluminum. This affects thermal performance, durability, and frequency characteristics. Verify material against datasheet for application-specific requirements like high-temperature or high-frequency operation. | Ceramic |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | DE2 |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | DE2F3KY103MA3BM02 |
Temperature Coefficient Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment. | -80/+30% ppm/°C |
Temperature Characteristics Code Identifies how capacitance changes with temperature, often using EIA or IEC codes. This code helps engineers select capacitors with stable performance across the operating temperature range. Compare codes when designing for precision or harsh environments, and confirm the exact behavior in the datasheet. | F |
| Parameter | Value |
|---|---|
Terminal Finish Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance. | Tin/Copper (Sn/Cu) |
Capacitance Capacitance value of the component, typically expressed in farads (pF, nF, µF). This parameter determines energy storage and filtering characteristics. Compare capacitance when selecting capacitors for power supply decoupling, signal coupling, or timing applications. Always check the rated voltage and tolerance in the datasheet. | 10nF |
Multilayer This attribute specifies whether the component uses a multilayer construction, which affects electrical performance and reliability. Compare this parameter when selecting capacitors, inductors, or varistors for high-frequency or high-density circuits. Always verify the layer count and material specifications in the datasheet. | Yes |
| Parameter | Value |
|---|---|
Diameter Specifies the physical diameter of the component package, typically for cylindrical parts like capacitors, resistors, or fuses. Verify this dimension against your PCB layout and mechanical clearance requirements to ensure proper fit and assembly. | 14mm |
Height Seated (Max) Maximum vertical dimension from the seating plane to the top of the component body. Critical for PCB clearance and enclosure fit. Verify against the datasheet when designing mechanical constraints or checking compatibility with mating parts. | 16.9926mm |
Notice documents
PCN / product notice documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for DE2F3KY103MA3BM02. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
Related sourcing options
Recommended products
Explore related Ceramic Capacitors products to compare fit, stock status, datasheets, and sourcing options.
Common questions
Product FAQ
Targeted answers for buyers verifying the exact DE2F3KY103MA3BM02 ordering code, packaging, stock, datasheet, and replacement path.
What does DE2F3KY103MA3BM02 mean?
DE2F3KY103MA3BM02 is the exact ordering code listed for a Ceramic Capacitors component from Murata. The current package reference is DIP, with listed context including CAPACITOR, CERAMIC, MULTILAYER, F, 0.01uF, THROUGH HOLE MOUNT, RADIAL LEADED. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the DE2F3KY103MA3BM02 ordering code?
Treat DE2F3KY103MA3BM02 as the full ordering code during RFQ and engineering review. Confirm the listed DIP package, manufacturer documentation from Murata, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is DE2F3KY103MA3BM02 supplied in?
DE2F3KY103MA3BM02 is currently listed with package reference DIP from Murata. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is DE2F3KY103MA3BM02 in stock at TrustCompo?
This page currently displays 1 public stock records for DE2F3KY103MA3BM02 with 795 listed pieces. Before ordering, confirm the package (DIP), required quantity, live availability, lead time, final price, date code, MOQ, packaging evidence, and RFQ documentation.
Where can I compare DE2F3KY103MA3BM02 alternatives?
A mapped alternative list is not currently published for DE2F3KY103MA3BM02. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.





