XC3S500E-5FGG320C Embedded - FPGAs (Field Programmable Gate Array) by Xilinx
XC3S500E-5FGG320C is a Embedded - FPGAs (Field Programmable Gate Array) from Xilinx in BGA packaging. It is commonly reviewed for IC FPGA 232 I/O 320FBGA
ALIAS: XC3S500E-5FG320C. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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4 certifications
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
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1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
2
Check stock and price
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3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
4
Arrange shipment
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Before PO release
Part confirmation
Exact MPN confirmed: XC3S500E-5FGG320C
Package to verify: BGA
Commercial confirmation
Live stock and lead time confirmed by RFQ
Final price and tax terms confirmed before PO release
Fulfillment & documents
Ship-from location: Hong Kong warehouse
Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Product overview
Product overview
Review the sourcing context for XC3S500E-5FGG320C from Xilinx, including product identity, application fit, package notes, and purchasing considerations.
Features • Surface mouont type suitable for auto pick-and-place • Reflow soldering compatible • Supply voltage VCC=3.3/ 5.0V available • for DTV, DVD Applications
Technical parameters
Parameters
Compare grouped XC3S500E-5FGG320C parameters from Xilinx, including package, series, key attributes, and technical values used for engineering and sourcing review.
Product Parameter
Maximum Operating Supply Voltage
260
Product Parameter
Triac Type
Active
Product Parameter
Typical Quiescent Current (MA)
CMOS
Product Parameter
Transformer Type
yes
Product Parameter
On-State Resistance Match-Nom
Not Qualified
Product Parameter
Transmission Media Type
1.2V
XC3S500E-5FGG320C Product Parameter
Parameter
Value
Maximum Operating Supply Voltage
Highest supply voltage at which the component can operate normally without damage or performance degradation. Exceeding this limit may cause overheating or failure. Always check this parameter against your power supply design to ensure the component operates within its safe voltage range for reliable long-term performance.
260
Triac Type
Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements.
Active
Typical Quiescent Current (MA)
Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency.
CMOS
Transformer Type
Indicates the construction or configuration of the transformer, such as flyback, forward, or planar. Affects performance, size, and application suitability. Refer to datasheet for detailed specifications and recommended usage.
yes
On-State Resistance Match-Nom
Indicates the nominal matching of on-state resistance between multiple channels in a device, such as a dual MOSFET or analog switch. This parameter is critical for parallel operation and current sharing. Verify the specified match against the datasheet to ensure balanced performance.
Not Qualified
Transmission Media Type
Specifies the physical medium through which signals travel, such as fiber optic, twisted pair, or coaxial cable. This attribute is critical for ensuring compatibility with your network infrastructure and for meeting performance requirements. Verify the media type against your system's specifications and the component datasheet to avoid signal integrity issues.
1.2V
Total Resistance
Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation.
Tray
Nominal Attenuation
Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies.
e1
Accessory Type
Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application.
BOTTOM
Minimum Operating Supply Voltage
Specifies the lowest supply voltage at which the component remains fully functional. Compare this value with your system's power rail tolerance and verify it against the datasheet's recommended operating conditions to ensure reliable startup and operation.
BALL
Voltage Rating
Specifies the maximum continuous voltage the component can safely withstand without damage or performance degradation. Critical for ensuring proper operating margins in power supplies, signal lines, and isolation barriers. Always confirm with the datasheet for absolute maximum ratings.
30
Maximum Data Rate
Highest data transfer rate the component can reliably support, typically in bits per second. This is critical for serial interfaces, modems, or transceivers. Ensure your application's required data throughput does not exceed this limit to avoid communication errors and performance degradation.
1mm
Output Peak Current Limit
Specifies the maximum instantaneous output current the device can deliver without damage or shutdown. Compare this limit with your inrush and transient load requirements. Verify against the datasheet's safe operating area and pulse conditions to ensure reliable operation.
2mm
Speed Grade
Speed grade indicates the maximum operating frequency or propagation delay category for digital ICs, memory, or programmable logic. Compare grades when selecting parts for timing-critical designs. Verify the exact speed rating in the datasheet to ensure it meets your system's clock and signal integrity requirements.
5
Typical Switching Frequency (KHz)
Typical switching frequency of a power converter or driver. Compare this value to your application's needs to ensure efficient operation. Verify against the datasheet for exact conditions.
Field Programmable Gate Arrays
Drain To Source Resistance
This is the on-state resistance between the drain and source terminals of a MOSFET. It affects power dissipation and efficiency. Lower values are preferred for high-current switching. Always check the datasheet for the specified test conditions, as RDS(on) varies with gate voltage and temperature.
3A991.D
Collector-Emitter Voltage-Max
Maximum voltage that can be applied between collector and emitter without breakdown. Critical for BJT and IGBT selection. Verify against datasheet to ensure safe operation within your circuit's supply and transient conditions.
FIELD PROGRAMMABLE GATE ARRAY
Capacitance
Capacitance value of the component, typically expressed in farads (pF, nF, µF). This parameter determines energy storage and filtering characteristics. Compare capacitance when selecting capacitors for power supply decoupling, signal coupling, or timing applications. Always check the rated voltage and tolerance in the datasheet.
176
Terminal Block Type
Specifies the mechanical configuration of the terminal block, such as pluggable, fixed, or barrier style. This affects mounting, wiring, and compatibility with mating connectors. Verify the exact type against the datasheet to ensure proper fit and reliable electrical connections in your assembly.
45kB
Power Supplies
Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.
Spartan®-3E
Number Of LABs/CLBs
Indicates the count of logic array blocks or configurable logic blocks in an FPGA or CPLD. This metric helps compare logic capacity and complexity across devices. Verify against the datasheet for your specific design requirements.
1164
Output High Voltage-Min
Specifies the minimum voltage level that the output can drive when in a high logic state. Compare this value with the input high threshold of the receiving device to ensure proper logic compatibility. Verify against the datasheet for your operating conditions.
368640
Number Of Logic Elements/Cells
Indicates the total count of programmable logic elements or cells in the FPGA or CPLD. This parameter determines the device's logic capacity and complexity. Compare this value with your design requirements to ensure sufficient resources. Always verify against the datasheet for exact specifications.
10476
Configuration
Specifies the internal circuit topology or arrangement of the component, such as single, dual, or bridge configuration. This attribute helps engineers select the right part for their circuit design. Always verify the exact configuration against the datasheet to ensure compatibility with your application.
500000
Number Of Turns
Number of turns in a coil or winding. Affects inductance, transformer ratio, and impedance. Critical for designing transformers, inductors, and magnetic components. Check datasheet for tolerance.
19mm
Filter Type
Specifies the filter topology used in the component, such as low-pass, high-pass, band-pass, or notch. This determines the frequency response and attenuation characteristics. Engineers must verify the filter type against the datasheet to ensure it meets the required signal conditioning and interference rejection for the application.
320
XC3S500E-5FGG320C Product Attribute
Parameter
Value
Categories
Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.
Integrated Circuits (ICs)
Housing Material
Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure.
ROHS3 Compliant
Terminal Position
Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.
Surface Mount
Max Supply Voltage
Indicates the highest DC or AC voltage that can be safely applied to the power supply pin without risking damage or malfunction. Verify this limit against the datasheet before designing your circuit to ensure reliable operation under all conditions.
Surface Mount
Converter Type
Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.
3 (168 Hours)
Specifications
Review the complete technical specifications for this electronic component, including electrical ratings, mechanical dimensions, and environmental limits. Verify these parameters against your application requirements and the manufacturer's datasheet to ensure compatibility and reliable operation.
Tin/Silver/Copper (Sn/Ag/Cu)
Supply Voltage
Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.
2008
Sub-Categories
Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.
Embedded - FPGAs (Field Programmable Gate Array)
Input Power-Max (CW)
Indicates the maximum continuous wave input power the component can safely handle without damage or excessive distortion. Exceeding this limit may cause failure. Verify this value against your signal power and consider peak-to-average ratio in modulated systems.
10 Weeks
Manufacturer
Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.
Xilinx
Radiation Hardening
Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.
0°C~85°C TJ
Temperature Coefficient
Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment.
1.14V~1.26V
Resistance
Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation.
1.2V
Series
Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.
Spartan®-3E
Technology
Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.
XC3S500E
FWFT Support
First-word fall-through (FWFT) support indicates whether a FIFO memory device can output the first stored word without a read request. This feature reduces latency in data streaming. Check the datasheet to confirm FWFT mode availability and its effect on system timing.
9312
Bus Directional
Indicates whether the bus supports data flow in one direction only or in both directions. This affects signal routing and buffer design. Verify against the datasheet to ensure compatibility with your system's communication requirements.
0.66 ns
Number Of I/O
Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.
232
Data Rate
Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.
320
Temperature Grade
Defines the operating temperature range classification for the component, such as commercial, industrial, or automotive. This indicates the environmental conditions the device can withstand. Ensure the grade matches your application's ambient temperature requirements.
320
Threshold Voltage
The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature.
19mm
Package / Case
Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.
320-BGA
Manufacturer'S Part No.
The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.
XC3S500E-5FGG320C
Datasheet preview
Datasheet PDF viewer
Preview the XC3S500E-5FGG320C datasheet from Xilinx to check package, electrical characteristics, application notes, and document evidence before RFQ.
No public product notice document is currently displayed for XC3S500E-5FGG320C. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Targeted answers for buyers verifying the exact XC3S500E-5FGG320C ordering code, packaging, stock, datasheet, and replacement path.
What does XC3S500E-5FGG320C mean?
XC3S500E-5FGG320C is the exact ordering code listed for a Embedded - FPGAs (Field Programmable Gate Array) component from Xilinx. The current package reference is BGA, with listed context including IC FPGA 232 I/O 320FBGA
ALIAS: XC3S500E-5FG320C. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the XC3S500E-5FGG320C ordering code?
Treat XC3S500E-5FGG320C as the full ordering code during RFQ and engineering review. Confirm the listed BGA package, manufacturer documentation from Xilinx, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is XC3S500E-5FGG320C supplied in?
XC3S500E-5FGG320C is currently listed with package reference BGA from Xilinx. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is XC3S500E-5FGG320C in stock at TrustCompo?
This page currently displays 1 public stock records for XC3S500E-5FGG320C with 27 listed pieces. Before ordering, confirm the package (BGA), required quantity, live availability, lead time, final price, date code, MOQ, packaging evidence, and RFQ documentation.
Where can I compare XC3S500E-5FGG320C alternatives?
A mapped alternative list is not currently published for XC3S500E-5FGG320C. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.