XC3S1500-4FG456C Embedded - FPGAs (Field Programmable Gate Array) by Xilinx

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Specifies the construction style of a flat flexible cable, such as FFC or FPC. This affects flexibility, bend radius, and termination method. Verify the exact type against the datasheet to ensure compatibility with your connector and application requirements.

Identifies the conversion architecture, such as ADC, DAC, or DC-DC. This determines the signal path, interface, and performance characteristics. Verify the type matches your system's analog or digital conversion needs before selecting the part.

Specifies the material of the component's outer casing, such as plastic, metal, or ceramic. This affects durability, thermal performance, and environmental resistance. Verify against datasheet for application-specific requirements like flammability or chemical exposure.

Specifies the nominal operating voltage that must be applied to the component for proper function. Verify this value against your system's power rail and the datasheet's absolute maximum ratings to ensure reliable operation and avoid damage.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

The minimum gate-to-source voltage that makes the device start conducting. Compare this value across parts to ensure your drive circuit can reliably turn the switch on. Always verify against the datasheet for your operating temperature.

Indicates the maximum continuous wave input power the component can safely handle without damage or excessive distortion. Exceeding this limit may cause failure. Verify this value against your signal power and consider peak-to-average ratio in modulated systems.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

Review the complete technical specifications for this electronic component, including electrical ratings, mechanical dimensions, and environmental limits. Verify these parameters against your application requirements and the manufacturer's datasheet to ensure compatibility and reliable operation.

Total number of input/output pins or channels available on the device. Determines connectivity and interface capability. Verify against your system requirements and datasheet to ensure sufficient I/O for your application.

Indicates how much a key parameter, such as voltage or resistance, changes per degree Celsius. Lower values mean better stability across temperature. Verify this against your operating temperature range to ensure consistent performance in your environment.

Electrical resistance value in ohms, defining opposition to current flow. Critical for current limiting, voltage division, and signal conditioning. Always check tolerance and power rating in the datasheet for reliable circuit operation.

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Specifies the maximum data transfer rate the component can handle, typically in bits per second. Compare this value with your system's required throughput to ensure adequate bandwidth. Verify against the datasheet for exact conditions and supported protocols.

Specifies the lowest ambient temperature at which the component is guaranteed to function within its electrical and mechanical specifications. Verify this limit against the datasheet for your application's thermal environment, especially for automotive or industrial designs.

Indicates whether the bus supports data flow in one direction only or in both directions. This affects signal routing and buffer design. Verify against the datasheet to ensure compatibility with your system's communication requirements.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

Specifies the triac construction or series, such as standard, snubberless, or logic-level. This affects switching performance, gate sensitivity, and commutation capability. Verify the exact type against the datasheet to ensure compatibility with your circuit's voltage, current, and triggering requirements.

Typical current consumed by the component in standby or idle state, measured in milliamperes. This is important for battery-powered or low-power applications. Compare this value with your power budget to ensure the component does not drain excessive current when inactive, affecting overall system efficiency.

Indicates the nominal matching of on-state resistance between multiple channels in a device, such as a dual MOSFET or analog switch. This parameter is critical for parallel operation and current sharing. Verify the specified match against the datasheet to ensure balanced performance.

Indicates the construction or configuration of the transformer, such as flyback, forward, or planar. Affects performance, size, and application suitability. Refer to datasheet for detailed specifications and recommended usage.

Specifies the physical medium through which signals travel, such as fiber optic, twisted pair, or coaxial cable. This attribute is critical for ensuring compatibility with your network infrastructure and for meeting performance requirements. Verify the media type against your system's specifications and the component datasheet to avoid signal integrity issues.

Specifies the category of accessory or add-on part for electronic components. Use this to filter compatible mounting hardware, connectors, or protective covers. Verify the accessory type against the component datasheet to ensure proper fit and function in your application.

Specifies the lowest supply voltage at which the component remains fully functional. Compare this value with your system's power rail tolerance and verify it against the datasheet's recommended operating conditions to ensure reliable startup and operation.

Specifies the typical signal loss introduced by the component under standard conditions. Compare this value across similar parts to match your circuit's allowable attenuation. Always verify against the datasheet for frequency and temperature dependencies.

Specifies the maximum continuous voltage the component can safely withstand without damage or performance degradation. Critical for ensuring proper operating margins in power supplies, signal lines, and isolation barriers. Always confirm with the datasheet for absolute maximum ratings.

Highest data transfer rate the component can reliably support, typically in bits per second. This is critical for serial interfaces, modems, or transceivers. Ensure your application's required data throughput does not exceed this limit to avoid communication errors and performance degradation.

Highest supply voltage at which the component can operate normally without damage or performance degradation. Exceeding this limit may cause overheating or failure. Always check this parameter against your power supply design to ensure the component operates within its safe voltage range for reliable long-term performance.

Speed grade indicates the maximum operating frequency or propagation delay category for digital ICs, memory, or programmable logic. Compare grades when selecting parts for timing-critical designs. Verify the exact speed rating in the datasheet to ensure it meets your system's clock and signal integrity requirements.

Number of turns in a coil or winding. Affects inductance, transformer ratio, and impedance. Critical for designing transformers, inductors, and magnetic components. Check datasheet for tolerance.

Total resistance is the end-to-end resistance of a component, such as a potentiometer or resistor network. It defines the maximum resistance available and is critical for circuit design. Verify this value against the datasheet to ensure proper operation.

Typical switching frequency of a power converter or driver. Compare this value to your application's needs to ensure efficient operation. Verify against the datasheet for exact conditions.

This is the on-state resistance between the drain and source terminals of a MOSFET. It affects power dissipation and efficiency. Lower values are preferred for high-current switching. Always check the datasheet for the specified test conditions, as RDS(on) varies with gate voltage and temperature.

Maximum voltage that can be applied between collector and emitter without breakdown. Critical for BJT and IGBT selection. Verify against datasheet to ensure safe operation within your circuit's supply and transient conditions.

Specifies the filter topology used in the component, such as low-pass, high-pass, band-pass, or notch. This determines the frequency response and attenuation characteristics. Engineers must verify the filter type against the datasheet to ensure it meets the required signal conditioning and interference rejection for the application.

Specifies the maximum instantaneous output current the device can deliver without damage or shutdown. Compare this limit with your inrush and transient load requirements. Verify against the datasheet's safe operating area and pulse conditions to ensure reliable operation.

Specifies the required power supply voltages for the component. Engineers use this to ensure the board's power rails match the device's needs. Verify against the datasheet's recommended operating conditions to avoid undervoltage or overvoltage issues.

Capacitance value of the component, typically expressed in farads (pF, nF, µF). This parameter determines energy storage and filtering characteristics. Compare capacitance when selecting capacitors for power supply decoupling, signal coupling, or timing applications. Always check the rated voltage and tolerance in the datasheet.

Specifies the lowest switching frequency at which the power device can operate reliably. Compare this value with your application's required switching speed to ensure proper performance. Verify against the datasheet's recommended operating conditions.

Specifies the mechanical configuration of the terminal block, such as pluggable, fixed, or barrier style. This affects mounting, wiring, and compatibility with mating connectors. Verify the exact type against the datasheet to ensure proper fit and reliable electrical connections in your assembly.

Indicates the total count of programmable logic elements or cells in the FPGA or CPLD. This parameter determines the device's logic capacity and complexity. Compare this value with your design requirements to ensure sufficient resources. Always verify against the datasheet for exact specifications.

Specifies the internal circuit topology or arrangement of the component, such as single, dual, or bridge configuration. This attribute helps engineers select the right part for their circuit design. Always verify the exact configuration against the datasheet to ensure compatibility with your application.

Indicates the count of logic array blocks or configurable logic blocks in an FPGA or CPLD. This metric helps compare logic capacity and complexity across devices. Verify against the datasheet for your specific design requirements.

Specifies the minimum voltage level that the output can drive when in a high logic state. Compare this value with the input high threshold of the receiving device to ensure proper logic compatibility. Verify against the datasheet for your operating conditions.