
EFR32MG13P632F512GM32-DR RF Transceiver ICs by Silicon Labs
EFR32MG13P632F512GM32-DR is a RF Transceiver ICs from Silicon Labs in QFN packaging. It is commonly reviewed for MIGHTY GECKO QFN32 2.4 GHZ 512KB. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.
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Key specifications
- Part Number
EFR32MG13P632F512GM32-DR
- Internal code
TCE000120550
- Package
QFN
- Manufacturer
- Silicon Labs
Key specifications
- Series
-
- Min Quantity
1
- Category
- RF/IF and RFID
- Sub Category
- RF Transceiver ICs
- Description
MIGHTY GECKO QFN32 2.4 GHZ 512KB
- key Attributes
-
Trust signals
Quality and trust signals
Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
RFQ checklist
Order process
Confirm the core buying details for EFR32MG13P632F512GM32-DR before RFQ, PO release, and shipment planning.
- 1
Confirm MPN
Use the exact part number, manufacturer, package, and approval constraints in the RFQ.
- 2
Check stock and price
Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.
- 3
Align documents
Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.
- 4
Arrange shipment
Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.
Before PO release
Part confirmation
- Exact MPN confirmed: EFR32MG13P632F512GM32-DR
- Package to verify: QFN
Commercial confirmation
- Live stock and lead time confirmed by RFQ
- Final price and tax terms confirmed before PO release
Fulfillment & documents
- Ship-from location: Hong Kong warehouse
- Shipping method: DHL, FedEx, UPS, or buyer forwarder account
Technical parameters
Parameters
Compare grouped EFR32MG13P632F512GM32-DR parameters from Silicon Labs, including package, series, key attributes, and technical values used for engineering and sourcing review.
Export Classifications & Environmental
RoHS Status
ROHS3 Compliant
Export Classifications & Environmental
HTSUS
8542.39.0001
Export Classifications & Environmental
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Product Parameter
Supply Voltage
1.8V~3.8V
Product Parameter
Memory Size
512kB Flash 64kB RAM
Package Parameter
GPIO
16
| Parameter | Value |
|---|---|
RoHS Status Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details. | ROHS3 Compliant |
HTSUS Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays. | 8542.39.0001 |
Moisture Sensitivity Level (MSL) Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions. | 3 (168 Hours) |
| Parameter | Value |
|---|---|
Supply Voltage Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage. | 1.8V~3.8V |
Memory Size Indicates the total storage capacity of the memory device, typically in bits or bytes. Buyers use this to match firmware or data storage requirements. Confirm the exact organization and density in the datasheet before design-in. | 512kB Flash 64kB RAM |
| Parameter | Value |
|---|---|
GPIO Number of general-purpose input/output pins available on the component. Compare this count to your design's requirements for interfacing with peripherals, sensors, or LEDs. Verify the exact pin functions and electrical characteristics in the datasheet. | 16 |
| Parameter | Value |
|---|---|
Part Status Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status. | Active |
Mounting Type Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements. | Surface Mount |
Factory Lead Time Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions. | 8 Weeks |
Packaging Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility. | Tape & Reel (TR) |
Operating Temperature Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings. | -40°C~85°C TA |
Package / Case Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility. | 32-VFQFN Exposed Pad |
ECCN Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues. | 5A992C |
RF Family/Standard Select the RF standard or family that the component complies with, such as Bluetooth, Wi-Fi, Zigbee, or proprietary protocols. This defines compatibility with existing wireless infrastructure and regulatory certifications. Verify against the datasheet to ensure the device meets your target network requirements. | 802.15.4, Bluetooth |
Sub-Categories Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application. | RF Transceiver ICs |
Categories Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class. | RF/IF and RFID |
Manufacturer Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts. | Silicon Labs |
Type Select the component category that best matches your application, such as resistor, capacitor, diode, or connector. This classification helps narrow down the correct part family and ensures compatibility with your circuit design. Verify the type against the datasheet to avoid mismatches. | TxRx + MCU |
Power - Output Output power rating of the component. This is critical for amplifiers, transmitters, and power supplies. Ensure the component can deliver the required power to your load without exceeding its ratings. Check the datasheet for conditions and tolerances. | 10dBm |
Data Rate (Max) Maximum data transfer rate supported. This is crucial for high-speed communication interfaces. Ensure the component can handle your required throughput with margin. Compare with the datasheet's specifications to avoid bottlenecks in your data path. | 2Mbps |
Current - Transmitting Indicates the current consumption or output current during transmission mode. Essential for power budget calculations and thermal management in wireless modules. Check this value against your supply capability and compare with receiving current to estimate battery life. | 8.5mA~134.3mA |
Series Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application. | Mighty Gecko |
Protocol Communication protocol supported by the device, such as I2C, SPI, UART, CAN, or USB. This determines how the component interfaces with microcontrollers or other system devices. Ensure compatibility with your system's bus architecture and check protocol version and features in the datasheet. | Bluetooth v5.0, Thread, Zigbee® |
Frequency Operating frequency of the component, typically the clock or switching frequency. This determines the speed of operation and affects power dissipation and signal integrity. Verify the frequency range against your application's requirements and the datasheet specifications. | 2.4GHz~2.4835GHz |
Serial Interfaces List of supported serial communication interfaces, such as SPI, I2C, UART, or CAN. This determines how the component communicates with your system. Verify that the required interfaces are available and compatible with your microcontroller or processor. | I2C, I2S, SPI, IrDA, UART, USART |
Manufacturer'S Part No. The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation. | EFR32MG13P632F512GM32-DR |
Current - Receiving Specify the current consumption during receiving operation. This value is critical for battery life estimation in portable devices. Compare it with the datasheet's typical and maximum ratings to ensure your power supply can handle the load under worst-case conditions. | 8.4mA~14mA |
Sensitivity Specifies the minimum input signal level required for the component to operate correctly. Compare sensitivity values when selecting sensors, microphones, or receivers for low-signal applications. Always verify against the datasheet for exact test conditions and frequency response. | -103.3dBm |
Modulation Specifies the modulation scheme used by the component for signal encoding. Compare modulation types to ensure compatibility with your communication protocol and system bandwidth. Verify the supported modulation formats in the datasheet before design-in. | 2-FSK, 4-FSK, ASK, BPSK, DBPSK, DSSS, GFSK, GMSK, MSK, OOK, O-QPSK |
Notice documents
PCN / product notice documents
No public PCN / PDN records currently displayed
No public product notice document is currently displayed for EFR32MG13P632F512GM32-DR. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.
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Common questions
Product FAQ
Targeted answers for buyers verifying the exact EFR32MG13P632F512GM32-DR ordering code, packaging, stock, datasheet, and replacement path.
What does EFR32MG13P632F512GM32-DR mean?
EFR32MG13P632F512GM32-DR is the exact ordering code listed for a RF Transceiver ICs component from Silicon Labs. The current package reference is QFN, with listed context including MIGHTY GECKO QFN32 2.4 GHZ 512KB. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.
How should buyers verify the EFR32MG13P632F512GM32-DR ordering code?
Treat EFR32MG13P632F512GM32-DR as the full ordering code during RFQ and engineering review. Confirm the listed QFN package, manufacturer documentation from Silicon Labs, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.
What package is EFR32MG13P632F512GM32-DR supplied in?
EFR32MG13P632F512GM32-DR is currently listed with package reference QFN from Silicon Labs. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.
Is EFR32MG13P632F512GM32-DR in stock at TrustCompo?
This page currently displays 2 public stock records for EFR32MG13P632F512GM32-DR with 10,878 listed pieces. Before ordering, confirm the package (QFN), required quantity, live availability, lead time, final price, date code, MOQ, packaging evidence, and RFQ documentation.
Where can I compare EFR32MG13P632F512GM32-DR alternatives?
A mapped alternative list is not currently published for EFR32MG13P632F512GM32-DR. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.
