Get a Sample
Request engineering samples to evaluate fit, validate alternatives, and keep design decisions moving before a larger order is placed.
Request evaluation samplesCYDM256B16-55BVXI Memory by Cypress Semiconductor
CYDM256B16-55BVXI is a Memory model from Cypress Semiconductor, presented on TrustCompo for buyers who need clear sourcing and review context before RFQ. This listing sits in the Integrated Circuits (ICs) / Memory product path. IC SRAM 256K PARALLEL 100VFBGA. TrustCompo combines the available model, brand, hierarchy, and specification details around CYDM256B16-55BVXI so buyers can move faster from review to quotation.
RoHS
Datasheet
Pictures are for reference only. Please contact us for the latest pictures.
Traceability and authenticity checks
Fast RFQ turnaround
Documentation support
Pre-shipment inspection review
Key specifications
Series
-
Min Quantity
1
Category
Integrated Circuits (ICs)Sub Category
MemoryDescription
IC SRAM 256K PARALLEL 100VFBGA
key Attributes
-
Datasheet
View CYDM256B16-55BVXI DatasheetTechnical document
Open The Official Datasheet
Review the latest datasheet for CYDM256B16-55BVXI from Cypress Semiconductor in a separate tab so engineers and buyers can check package, electrical characteristics, and application details without leaving this product page.
Why request a quote
Use the RFQ step to confirm the commercial and documentation details buyers usually need before placing an order.
RoHS, REACH, and lead-free documentation can be confirmed during RFQ
Traceability and Certificate of Conformance support available on request
Pre-shipment inspection report support for quality review
Trust signals
Globally recognized certifications
Visible certifications work best when they are paired with clear operational promises around traceability, handling, and inspection.
ISO 9001
Quality management processes for more consistent sourcing and handling.
AS9120B
Aerospace-focused distribution controls for traceability and reliability.
ISO 14001
Environmental management discipline across warehouse and operating workflows.
ESD Control
Electrostatic handling standards to help protect sensitive components.
Ordering workflow
Understand how to order and what policies support the purchase
Use this section to see the fastest ordering path and the policy pages buyers usually review before confirming a component order.
How to order this product
A simple B2B flow helps engineering and procurement teams move from part review to commercial confirmation.
1
Confirm part and quantity
Review the part number, package, key specs, and target quantity so the quote request reflects the exact sourcing scope your team needs.
2
Send RFQ or sample request
Use Quick Quote for commercial pricing or Request Sample when engineering validation is still in progress and a smaller evaluation quantity is needed.
3
Align delivery, payment, and documentation
Before final release, confirm stock timing, shipment method, payment arrangement, and any traceability or inspection documents required by your process.
Policies buyers usually check
These pages explain the operating rules around samples, shipping, payment, and quality support before you place the order.
Shipping & Delivery
Review shipping origin, carrier options, delivery methods, and the practical factors that affect transit timing for global component orders.
Review shipping detailsPayment Terms
Understand supported payment methods, invoice handling, quote currency, and the commercial boundaries used for international B2B orders.
Review payment termsQuality & Traceability Center
See how incoming inspection, outgoing verification, traceability support, certifications, and additional testing fit into our quality workflow.
Review quality controlsStructured product content
Review The Product The Way Buyers Actually Evaluate It
Review overview, detailed specifications, and related sourcing content in one structured flow without scanning separate oversized sections.
Product overview
Overview
IC SRAM 256K PARALLEL 100VFBGA
Fast scan
Popular Specs Surfaced First
Product Attribute
Packaging
Tray
Product Attribute
Lead Free
Lead Free
Product Attribute
Mounting Type
Surface Mount
Product Attribute
Factory Lead Time
8 Weeks
Product Attribute
Part Status
Obsolete
Product Attribute
Categories
Integrated Circuits (ICs)
Packaging
Tray
Lead Free
Lead Free
Mounting Type
Surface Mount
Factory Lead Time
8 Weeks
Part Status
Obsolete
Categories
Integrated Circuits (ICs)
Peak Reflow Temperature (Cel)
260
Terminal Pitch
0.5mm
Operating Temperature
-40°C~85°C TA
Output Characteristics
3-STATE
Published
1996
Package / Case
100-VFBGA
Number Of Functions
1
Radiation Hardening
No
Mount
Surface Mount
Pbfree Code
yes
Manufacturer
Cypress Semiconductor
Terminal Position
BOTTOM
Supply Voltage
1.8V
Operating Supply Voltage
1.8V
Number Of Pins
100
Pin Count
100
Number Of Terminations
100
Number Of Ports
2
Length
6mm
Nominal Supply Current
25mA
Memory Interface
Parallel
Sub-Categories
Memory
Sync/Async
Asynchronous
Word Size
16b
Memory Width
16
Memory Type
Volatile
Write Cycle Time - Word, Page
55ns
Address Bus Width
28b
Standby Current-Max
0.000006A
Memory Format
SRAM
I/O Type
COMMON
Organization
16KX16
Technology
SRAM - Dual Port, MoBL
Manufacturer'S Part No.
CYDM256B16-55BVXI
Base Part Number
CYDM
RoHS Status
ROHS3 Compliant
JESD-609 Code
e1
Moisture Sensitivity Level (MSL)
3 (168 Hours)
ECCN Code
EAR99
Height Seated (Max)
1mm
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (S)
30
Power Supplies
1.8/3V
Integrated Cache
256 kb
Supply Voltage-Min (Vsup)
1.7V
Control Mode
55 ns
Supply Voltage-Max (Vsup)
1.9V
Voltage - Supply (Vcc\/Vdd)
256Kb 16K x 16
Standby Voltage-Min
1.7V
Voltage - Supply
1.7V~1.9V 2.4V~2.6V 2.7V~3.3V
Common questions
Product FAQ
Quick answers for buyers reviewing CYDM256B16-55BVXI, stock, documentation, and sourcing steps.
What is CYDM256B16-55BVXI?
CYDM256B16-55BVXI is a Memory component from Cypress Semiconductor. This product page summarizes the core sourcing details buyers need before checking price, availability, documentation, or samples.
What package and description are listed for CYDM256B16-55BVXI?
CYDM256B16-55BVXI is listed with package reference -. The current product description is IC SRAM 256K PARALLEL 100VFBGA, and buyers should confirm package, footprint, and electrical details against the datasheet or quotation notes before approval.
Is CYDM256B16-55BVXI available in stock?
This page currently shows 91858 units in stock and 42698 units available for CYDM256B16-55BVXI. Because electronic component availability can change quickly, submit an RFQ to confirm live stock, lead time, and final pricing.
Can I request a quote or sample for CYDM256B16-55BVXI?
Yes. Use the Quick Quote or Request Sample action on this page to send the quantity and sourcing requirements for CYDM256B16-55BVXI by Cypress Semiconductor. The TrustCompo team can review price, availability, and documentation support.
Is a datasheet available for CYDM256B16-55BVXI?
Yes. This page links to the datasheet for CYDM256B16-55BVXI by Cypress Semiconductor, so engineers and buyers can review package, ratings, and application details before purchase.
How should buyers verify CYDM256B16-55BVXI before ordering?
Buyers should confirm the manufacturer, package, quantity, target price, RoHS or compliance needs, and any Certificate of Conformance or traceability requirements for CYDM256B16-55BVXI before approving the order.
Memory
Recommended Products
Explore more parts from the same subcategory to compare fit, stock, and sourcing options.
More sourcing insights
Articles
Explore related articles around CYDM256B16-55BVXI, Memory, and adjacent sourcing decisions so buyers can compare context before moving from evaluation to RFQ.
Jul 17, 2026
FPGA Supply 2026: A Buyer's Framework for AMD Xilinx, Intel Altera, Microchip, and Lattice SourcingA production-BOM FPGA sourcing guide for 2026 covering lifecycle commitment, redesign cost, and qualification boundaries across AMD Xilinx, Intel Altera, Microchip PolarFire, and Lattice families.
FPGAAMD XilinxIntel Altera
Jul 11, 2026
2026 Q3 Wide-Bandgap Power Read: Where SiC Is Scaling, Where GaN Is Winning, and Why Silicon Still MattersA Q3 2026 read on SiC, GaN, and silicon power semiconductors: where wide-bandgap devices are winning now, where silicon still holds, and what engineers and sourcing teams should watch.
wide-bandgap semiconductorsSiCGaN
Jul 8, 2026
Texas Instruments Lead Time and Price Pressure in 2026: What Analog and Power Buyers Should Do NowA buyer-facing framework for Texas Instruments analog and power IC exposure in 2026, covering what is confirmed, where price and lead-time pressure is most likely to show up, and which actions sourcing teams should take first.
Texas Instrumentsanalog ICpower management IC