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CSD97396Q4MT PMIC - Full, Half-Bridge Drivers by Texas Instruments

CSD97396Q4MT is a PMIC - Full, Half-Bridge Drivers from Texas Instruments in manufacturer-listed packaging. It is commonly reviewed for IC NEXFET SYNC BUCK 8VSON. This page lists current TrustCompo stock, tier pricing, package data, datasheet access, compliance attributes, Hong Kong warehouse shipping options, payment confirmation, and RFQ options for buyers verifying this exact ordering code.

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CSD97396Q4MT PMIC - Full, Half-Bridge Drivers by Texas Instruments | TrustCompo
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Key specifications

Part Number

CSD97396Q4MT

Internal code

TCE000119106

Package

-

Manufacturer
Texas Instruments

Key specifications

Series

NexFET™

Min Quantity

1

Description

IC NEXFET SYNC BUCK 8VSON

key Attributes

-

Trust signals

Quality and trust signals

Review TrustCompo quality credentials, traceability support, anti-counterfeit handling, and inspection controls before sending an RFQ.

4 certifications
  • ISO 9001

    Quality management processes for more consistent sourcing and handling.

  • AS9120B

    Aerospace-focused distribution controls for traceability and reliability.

  • ISO 14001

    Environmental management discipline across warehouse and operating workflows.

  • ESD Control

    Electrostatic handling standards to help protect sensitive components.

RFQ checklist

Order process

Confirm the core buying details for CSD97396Q4MT before RFQ, PO release, and shipment planning.

  1. 1

    Confirm MPN

    Use the exact part number, manufacturer, package, and approval constraints in the RFQ.

  2. 2

    Check stock and price

    Verify live availability, MOQ, lead time, final unit price, and tax terms before PO release.

  3. 3

    Align documents

    Confirm datasheet, CoC, traceability, lifecycle notes, and inspection scope when required.

  4. 4

    Arrange shipment

    Release the PO and align DHL, FedEx, UPS, or buyer forwarder shipment from Hong Kong.

Before PO release

Part confirmation

  • Exact MPN confirmed: CSD97396Q4MT
  • Package to verify: -

Commercial confirmation

  • Live stock and lead time confirmed by RFQ
  • Final price and tax terms confirmed before PO release

Fulfillment & documents

  • Ship-from location: Hong Kong warehouse
  • Shipping method: DHL, FedEx, UPS, or buyer forwarder account

Product overview

Product overview

Review the sourcing context for CSD97396Q4MT from Texas Instruments, including product identity, application fit, package notes, and purchasing considerations.

The CSD97396Q4MT is a high-performance power MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) manufactured by Texas Instruments. This component is designed for applications requiring efficient power management, such as in power supplies, motor drivers, and other high-frequency switching applications.

Key Features:

  1. Package Type: The CSD97396Q4MT comes in a compact QFN (Quad Flat No-lead) package, which allows for efficient thermal management and space-saving on printed circuit boards (PCBs). The QFN package typically features a low profile and excellent thermal conductivity.
  2. Voltage Rating: This MOSFET is rated for a maximum drain-source voltage (V_DS) of around 30V, making it suitable for low to medium voltage applications.
  3. Current Rating: It can handle a continuous drain current (I_D) of up to 60A, depending on the thermal conditions and PCB layout, which makes it capable of driving significant loads.
  4. R_DS(on): The on-resistance (R_DS(on)) is exceptionally low, typically in the range of a few milliohms. This characteristic minimizes power loss during operation, enhancing overall efficiency.
  5. Gate Threshold Voltage: The gate threshold voltage (V_GS(th)) is designed to be low, allowing for easy drive with standard logic levels, which is beneficial for interfacing with microcontrollers and digital logic circuits.
  6. Switching Speed: The CSD97396Q4MT features fast switching capabilities, which is crucial for applications that require rapid turn-on and turn-off cycles, such as in synchronous rectification and DC-DC converters.
  7. Thermal Performance: The device is designed to operate efficiently at elevated temperatures, with a maximum junction temperature (T_J) rating that allows for reliable performance in demanding environments.

Applications:

  • Power Management: Ideal for use in power supply circuits, including buck converters and boost converters.
  • Motor Control: Suitable for driving DC motors and brushless DC motors in various applications, including robotics and automotive systems.
  • Battery Management Systems: Can be used in battery charging and protection circuits, ensuring safe and efficient operation.

Conclusion:

The CSD97396Q4MT from Texas Instruments is a versatile and efficient power MOSFET that meets the demands of modern electronic applications. Its combination of low on-resistance, high current handling capability, and fast switching speeds makes it an excellent choice for engineers looking to optimize power efficiency in their designs.

Technical parameters

Parameters

Compare grouped CSD97396Q4MT parameters from Texas Instruments, including package, series, key attributes, and technical values used for engineering and sourcing review.

  • Product Parameter

    Terminal Finish

    Matte Tin (Sn)

  • Product Parameter

    Control Technique

    PULSE WIDTH MODULATION

  • Product Parameter

    Analog IC - Other Type

    SWITCHING REGULATOR

  • Product Parameter

    Time At Peak Reflow Temperature (Max)

    NOT SPECIFIED

  • Product Parameter

    Nominal Input Voltage

    5V

  • Product Parameter

    Supply Voltage

    4.5V~5.5V

CSD97396Q4MT Product Parameter
ParameterValue
Terminal Finish

Specifies the plating material on component terminals, affecting solderability, corrosion resistance, and long-term reliability. Compare finishes like tin, gold, or silver for your assembly process and environmental requirements. Verify against datasheet for compliance.

Matte Tin (Sn)
Control Technique

Specifies the switching regulator control method, such as PWM, PFM, or burst mode. This affects efficiency, noise, and transient response. Engineers should verify the technique against the datasheet to ensure it matches the application's power requirements and EMI constraints.

PULSE WIDTH MODULATION
Analog IC - Other Type

Select this category when the analog integrated circuit does not fit standard classifications like op-amps, comparators, or regulators. Verify the exact function and pinout in the datasheet to ensure compatibility with your circuit design and performance requirements.

SWITCHING REGULATOR
Time At Peak Reflow Temperature (Max)

Specifies the maximum duration a component can withstand at the peak reflow temperature during soldering. Critical for evaluating solder joint reliability and preventing thermal damage. Verify against the datasheet's recommended soldering profile to ensure proper assembly.

NOT SPECIFIED
Nominal Input Voltage

Specifies the typical input voltage level for which the component is designed to operate. Compare this value with your power supply output to ensure compatibility. Always verify against the datasheet for absolute maximum ratings and operating conditions.

5V
Supply Voltage

Specifies the range of DC or AC input voltage the component requires for proper operation. Engineers compare this to the system power rail to ensure compatibility. Always verify against the datasheet's absolute maximum ratings to prevent damage.

4.5V~5.5V
Output Configuration

Specifies the topology of the output stage, such as push-pull, open collector, or half-bridge. This determines how the device drives loads and interfaces with external circuitry. Verify against the datasheet to ensure compatibility with your application's requirements.

Half Bridge
Voltage - Load

Specifies the voltage supplied to the load under normal operating conditions. Compare this value with your system's power supply and load requirements to ensure compatibility. Verify against the datasheet for exact tolerances and operating ranges.

4.5V~24V
Fault Protection

Indicates built-in safeguards against overcurrent, overvoltage, overtemperature, or short-circuit conditions. Compare this feature when selecting power ICs, regulators, or protection devices. Verify the specific fault response and recovery behavior in the datasheet.

Shoot-Through
CSD97396Q4MT Product Attribute
ParameterValue
Part Status

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Active
REACH Status

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

REACH Unaffected
ECCN

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

EAR99
Lead Free

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Contains Lead
Lifecycle Status

Current stage in the product's lifecycle, such as Active, Obsolete, or End of Life. This indicates availability and long-term supply risk. Check this before designing in a part to ensure it will be available for your product's production lifetime.

ACTIVE (Last Updated: 3 days ago)
Mounting Type

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Surface Mount
Factory Lead Time

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

8 Weeks
Packaging

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Tape & Reel (TR)
Categories

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Integrated Circuits (ICs)
Terminal Position

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

DUAL
Peak Reflow Temperature (Cel)

Maximum temperature during reflow soldering that the component can withstand. This is critical for solder joint reliability and preventing damage. Verify that the peak reflow temperature is compatible with your soldering profile and the component's moisture sensitivity level.

260
REACH Compliance Code

Indicates the component's compliance status with the EU REACH regulation. Buyers should verify this code against the manufacturer's declaration to ensure restricted substances are within allowable limits for their target market.

not_compliant
Manufacturer

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Texas
Thickness

Thickness of the component, a critical dimension for PCB clearance, enclosure fit, and thermal performance. This measurement is especially important for capacitors, inductors, and connectors. Ensure the thickness meets your design constraints and does not interfere with adjacent components. Check the datasheet for tolerance and recommended mounting height.

900μm
Terminal Form

Describes the physical configuration of the component's leads or pads, such as through-hole, surface mount, or gull-wing. This affects PCB layout, soldering process, and mechanical fit. Confirm compatibility with your assembly method and footprint.

NO LEAD
Terminal Pitch

Terminal pitch is the center-to-center distance between adjacent leads or pads on a component. It determines PCB layout compatibility and soldering feasibility. Verify against the datasheet to ensure your footprint matches the component's actual lead spacing.

0.4mm
Operating Temperature

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

-40°C~150°C TJ
Series

Indicates the product series or family, grouping components with similar design and specifications. Helps identify compatible parts and compare within a product line. Verify the series against the datasheet to ensure correct application.

NexFET™
Contact Plating

Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.

Gold
Number Of Functions

Specifies the count of independent functions or channels integrated into a single component package. This helps engineers determine if the part can handle multiple signal paths or operations simultaneously. Verify against the datasheet to ensure the device meets your circuit's functional requirements.

1
Mounting Type

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Surface Mount
Pb-Free Code

Indicates whether the component is lead-free per RoHS or other directives. Buyers use this to verify environmental compliance and avoid restricted substances. Always confirm with the datasheet or certificate of compliance.

yes
Number Of Outputs

Specifies how many independent output channels the component provides. Compare this when selecting power supplies, drivers, or modules to ensure the device can drive all required loads. Always verify against the datasheet for exact output configuration.

1
Number Of Pins

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

8
Number Of Terminations

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

8
Sub-Categories

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

PMIC - Full, Half-Bridge Drivers
Load Type

Specifies the kind of load the component is designed to drive, such as resistive, inductive, or capacitive. This affects switching performance and protection requirements. Verify compatibility with your application's load characteristics to ensure reliable operation and avoid overstress.

Inductive
Width

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

3.5mm
Length

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

4.5mm
Min Input Voltage

Minimum voltage required at the input for the component to operate correctly. Below this level, the device may not function or may produce incorrect outputs. Verify that your power supply provides at least this voltage under all load conditions.

4.5V
Applications

Specify the typical end-use scenarios for this electronic component, such as consumer electronics, automotive, industrial, or telecommunications. This helps engineers quickly assess suitability for their design. Verify against the datasheet's application section.

Synchronous Buck Converters
Interface

Specifies the communication protocol or interface type used by the component, such as I2C, SPI, UART, or USB. This determines how the device connects to a microcontroller or system. Verify compatibility with your host controller and bus voltage levels before design-in.

PWM
Max Input Voltage

Maximum voltage that can be applied to the input without causing damage or malfunction. Exceeding this limit may lead to breakdown or reduced reliability. Always compare with your supply voltage and check the datasheet for absolute maximum ratings.

24V
Technology

Manufacturing technology or process used for the component, such as thin film, thick film, or semiconductor process. Affects performance, stability, and cost. Confirm the technology matches your application requirements and environmental conditions.

Power MOSFET
Switching Frequency

Indicates the rate at which the power device toggles between on and off states. Higher frequencies allow smaller magnetics but increase switching losses. Verify this parameter against your application's requirements and the datasheet's recommended operating conditions.

2MHz
Package / Case

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

8-PowerVFDFN
Efficiency

Efficiency indicates how effectively a power component converts input power into useful output power, expressed as a percentage. Higher efficiency means less energy lost as heat, which is critical for thermal management and system reliability. Always verify the efficiency curve in the datasheet under your operating conditions.

93 %
Base Part Number

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

CSD97396
Feature

This attribute highlights special characteristics or functions of the component, such as built-in protection, mounting style, or unique performance traits. Engineers compare these features to match specific application requirements. Always verify against the datasheet for complete specifications.

Bootstrap Circuit, Diode Emulation
Output Current Per Channel

Specifies the maximum current each output channel can source or sink continuously. Compare this value with your load requirements to ensure the driver or amplifier can handle the current without overheating or damage. Always verify against the datasheet for absolute maximum ratings and derating curves.

30A
Max Output Current

Specifies the highest continuous current the device can supply at its output without exceeding thermal or electrical limits. Compare this value with your load requirements and derating curves. Always verify against the datasheet for your operating conditions.

65A
Manufacturer'S Part No.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

CSD97396Q4MT
CSD97396Q4MT Export Classifications & Environmental
ParameterValue
JESD-609 Code

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

e3
RoHS Status

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

ROHS3 Compliant
REACH SVHC

Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.

No SVHC
Moisture Sensitivity Level (MSL)

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

2 (1 Year)
HTSUS

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

8541.29.0095

Notice documents

PCN / product notice documents

0 documents

No public PCN / PDN records currently displayed

No public product notice document is currently displayed for CSD97396Q4MT. Confirm PCN, PDN, EOL, date code, and lifecycle status during RFQ before production purchase.

Common questions

Product FAQ

Targeted answers for buyers verifying the exact CSD97396Q4MT ordering code, packaging, stock, datasheet, and replacement path.

What does CSD97396Q4MT mean?

CSD97396Q4MT is the exact ordering code listed for a PMIC - Full, Half-Bridge Drivers component from Texas Instruments. The current package reference is -, with listed context including IC NEXFET SYNC BUCK 8VSON. Buyers should use the full code when requesting stock, price, datasheet, or compliance confirmation.

How should buyers verify the CSD97396Q4MT ordering code?

Treat CSD97396Q4MT as the full ordering code during RFQ and engineering review. Confirm the listed - package, manufacturer documentation from Texas Instruments, datasheet ordering table, reel or packing details, and any customer approval constraints before substitution or PO release.

What package is CSD97396Q4MT supplied in?

CSD97396Q4MT is currently listed with package reference - from Texas Instruments. Buyers should confirm the manufacturer package drawing, footprint, pinout, tape-and-reel details, and receiving requirements before approval.

Is CSD97396Q4MT currently available?

CSD97396Q4MT is currently marked with stock availability on this page. Before ordering, confirm the package (-), listed stock (73687), available quantity (43471), required quantity, lead time, final price, compliance needs, and exact ordering code match through RFQ.

Where can I compare CSD97396Q4MT alternatives?

A mapped alternative list is not currently published for CSD97396Q4MT. Send an RFQ with the target quantity, package constraints, and approval requirements so TrustCompo can help review credible replacement options.