BTW69-1200RG Thyristors - SCRs by STMicroelectronics

This code indicates the terminal finish material per JESD-609 standard. It helps identify the plating type for soldering compatibility and environmental compliance. Check the datasheet for the exact code and its meaning.

Indicates the floor life of a component before it must be baked prior to soldering. Higher levels require stricter handling and shorter exposure times. Verify the MSL rating in the datasheet to ensure proper storage and assembly conditions.

Indicates whether the component complies with the EU RoHS directive restricting hazardous substances. Buyers should verify this status for regulatory compliance and market access. Check the datasheet or certificate for exact compliance details.

Indicates whether the product contains substances of very high concern as per the REACH regulation. Buyers should verify this for compliance with EU environmental standards, especially when exporting to Europe. Check the manufacturer's declaration or datasheet for accurate SVHC status.

Export Control Classification Number assigned by the U.S. Commerce Department. It determines export licensing requirements for electronic components. Verify the ECCN against the manufacturer's datasheet or export compliance documentation before shipping internationally.

Harmonized Tariff Schedule of the United States code for customs classification. Essential for import/export documentation and duty calculation. Verify the correct code with a trade specialist to avoid customs delays.

Indicates how many independent functional sections are integrated into a single component package. This matters when comparing multi-channel devices or resistor networks. Always verify the exact element count against the datasheet to ensure it matches your circuit design requirements.

Specifies the internal circuit topology or arrangement of the component, such as single, dual, or bridge configuration. This attribute helps engineers select the right part for their circuit design. Always verify the exact configuration against the datasheet to ensure compatibility with your application.

Indicates the highest repetitive reverse voltage the diode can withstand in blocking mode. Engineers compare this to the circuit's peak reverse stress to ensure reliable operation. Always verify against the datasheet for your specific application.

Forward voltage is the voltage drop across a diode or LED when it conducts current in the forward direction. It affects power dissipation and efficiency. Compare this value with your circuit's supply voltage and check the datasheet for the specified test current.

Nominal time required to turn off the device using circuit commutation. This parameter is critical for thyristors and other power semiconductors. Verify it against the datasheet to ensure proper switching performance in your application.

Maximum non-repetitive surge current at 50 or 60 Hz. This value indicates the device's ability to withstand brief overcurrents. Compare it with your circuit's fault conditions and verify against the datasheet to ensure reliability.

Maximum leakage current flowing through the device when it is in the off state. Compare this value across similar components to ensure low power loss and reliable blocking. Verify against the datasheet for your operating voltage and temperature conditions.

Maximum gate trigger voltage required to turn on the device. This parameter is essential for designing gate drive circuits. Ensure your driver can supply this voltage under all conditions. Check the datasheet for temperature and current dependencies.

Maximum current flowing through the component when it is in the off state. Compare this value across parts to ensure minimal power loss and proper circuit isolation. Verify against the datasheet for your operating voltage and temperature conditions.

Specifies the maximum gate current needed to switch the device from off to on. Compare this value with your driver capability to ensure reliable triggering. Verify against the datasheet for your operating temperature and gate circuit conditions.

Maximum forward voltage drop when the device is conducting. Affects power dissipation and efficiency. Critical for thermal design and low-voltage applications. Verify this value in the datasheet under specified current and temperature.

This parameter indicates the minimum dv/dt that can trigger unintended turn-on in a thyristor or triac. Engineers compare it to ensure reliable operation in circuits with fast voltage transients. Verify against the datasheet for your application's worst-case conditions.

Specifies the silicon-controlled rectifier variant, such as standard, sensitive gate, or logic level. This determines triggering sensitivity and switching behavior. Verify the exact type against the datasheet to ensure compatibility with your gate drive circuit and load requirements.

Maximum average on-state current the SCR can conduct continuously without exceeding its thermal limits. This parameter is critical for power handling and heatsink sizing. Always compare with your application's average current demand and derating curves in the datasheet.

Maximum repetitive peak leakage current flowing when the device is in the off state. This parameter indicates the highest leakage expected under specified voltage and temperature conditions. Verify against the datasheet to ensure it meets your circuit's power loss and safety requirements.

Lifecycle status of the part, such as active or obsolete. Indicates availability and long-term support from the manufacturer. Check this before design-in to avoid last-time buys or supply disruptions. Verify with the datasheet or distributor for current status.

Specifies how the component is attached to the PCB, such as through-hole or surface mount. This affects assembly processes, thermal performance, and mechanical strength. Buyers should verify compatibility with their manufacturing capabilities and design requirements.

Shows whether the component complies with the EU REACH regulation. Essential for legal market access in Europe. Check the manufacturer's latest statement to confirm that no substances of very high concern are present above the threshold.

Export Control Classification Number assigned by the U.S. government. Determines whether the component requires an export license. Essential for international trade compliance. Verify the ECCN with the manufacturer or supplier before shipping to avoid legal issues.

Indicates whether the component is manufactured without lead, complying with RoHS and similar regulations. Check this attribute to ensure environmental compliance for your market. Verify against the datasheet for exact material declarations.

Indicates the form of delivery for the component, such as tape and reel, tube, or tray. This affects handling, storage, and assembly processes. Verify the packaging type matches your production requirements and equipment compatibility.

Indicates the typical duration from order confirmation to shipment from the manufacturer's facility. This helps you plan production schedules and inventory. Verify current lead times with your distributor or supplier, as they may vary based on order quantity, product availability, and market conditions.

Specifies the ambient temperature range within which the component reliably functions. Compare this with your application's thermal environment to ensure proper operation. Always verify against the datasheet for derating curves and maximum ratings.

Identifies the company that designed and produced the component. Buyers often filter by manufacturer to ensure brand reliability, quality standards, and supply chain consistency. Verify the manufacturer against the datasheet and official packaging to avoid counterfeit parts.

Lists the product categories or classifications assigned to this component, such as connectors, capacitors, or modules. This helps in filtering and comparing similar parts. Review the categories to ensure the component fits your application and to find alternative parts in the same class.

Lists any extra characteristics or capabilities beyond the standard specifications, such as built-in protection, special mounting options, or enhanced performance. Review these features to ensure they meet your application's specific needs and compare them across similar parts.

Specifies the maximum continuous current the component can safely carry under specified conditions. Compare this value with your circuit's expected load to ensure reliable operation. Always verify against the datasheet for temperature derating and mounting considerations.

Specifies the metal coating applied to the contact surfaces of connectors, switches, or relays. This finish affects conductivity, corrosion resistance, and durability. Engineers should verify the plating material and thickness against the datasheet to ensure reliable performance in the intended environment.

Indicates if the component is designed to withstand ionizing radiation in space, nuclear, or high-energy physics applications. Compare radiation-tolerant vs. radiation-hardened parts for mission-critical designs. Verify the total ionizing dose (TID) and single-event effect (SEE) ratings in the datasheet.

Specifies how the component attaches to the PCB or assembly, such as surface mount, through-hole, or chassis mount. This affects soldering process, mechanical stability, and thermal performance. Verify compatibility with your board layout and assembly capabilities.

Total number of pins or contacts on the component. This determines the footprint and mating connector requirements. Always match the pin count to your PCB layout and connector specification to ensure proper electrical and mechanical connection.

Position of the terminals on the package, such as dual-in-line, gull-wing, or J-lead. This affects PCB layout, soldering, and thermal performance. Engineers must ensure the terminal position matches the footprint and assembly capabilities of their manufacturing line.

Total number of pins or terminals on the component package. Essential for footprint design, PCB layout, and connector mating. Verify against the datasheet to ensure compatibility with your board and assembly process.

Indicates the total number of electrical connection points on the component, such as pins or pads. This is critical for PCB footprint design and assembly. Verify it matches the package specification to ensure proper soldering and connectivity.

Indicates how the component's case or package is electrically connected, such as to ground, a supply rail, or left floating. This affects thermal management, shielding, and circuit isolation. Always confirm with the datasheet to ensure proper PCB layout and avoid unintended shorts or noise coupling.

Specifies the physical length of the component body, typically in millimeters. This dimension is critical for PCB layout and mechanical fit. Verify against the datasheet to ensure proper clearance and alignment in your design.

Specifies the maximum DC voltage the component can safely handle under rated conditions. Engineers compare this to the circuit's operating voltage to ensure adequate margin. Always verify against the datasheet's derating curves for temperature and reliability.

Physical width of the component body, typically in millimeters. Essential for PCB footprint design and mechanical fit. Verify against the datasheet to ensure proper clearance and compatibility with your board layout and enclosure.

Specifies the maximum continuous current that a resettable fuse or PTC device can carry without tripping. Compare this value with your circuit's normal operating current to ensure stable operation. Verify against the datasheet for temperature derating and tolerance.

Specifies the physical weight of the electronic component, important for logistics, shipping cost, and mechanical design. Verify the exact weight in the datasheet or packaging information, as it may vary with packaging type and quantity.

The unique part number assigned by the original component manufacturer. Use this to cross-reference datasheets, verify specifications, and ensure the exact component matches your design requirements. Always confirm the number against the manufacturer's official documentation.

Indicates the specific product subcategories or classifications within the broader component family. Helps narrow down search results and identify the exact type of component needed for your design. Review the subcategory to ensure compatibility with your application.

Identifies the core product family without package, grade, or option suffixes. Use this to compare equivalent components across manufacturers and to locate the primary datasheet. Verify the full ordering code against the manufacturer's specification before design-in.

This is the maximum repetitive peak voltage that can be applied across the device in the off state. It is a critical rating for thyristors and triacs, defining the safe operating limit under normal AC conditions. Always verify this value against the datasheet to ensure reliable performance.

Specifies the semiconductor or electromechanical component that initiates conduction in power circuits. Compare types like DIAC, SIDAC, or thyristor triggers. Verify against datasheet for compatibility with your gate drive and voltage requirements.

A more specific classification within the main product category, such as 'Ceramic Capacitor' under 'Capacitors'. This helps narrow down search results and compare similar components. Use it to filter products with similar characteristics and intended applications.

Defines the maximum continuous root-mean-square current the component can handle without exceeding thermal limits. Compare ratings for power handling and reliability. Verify against datasheet derating curves for ambient temperature and frequency.

Maximum single-pulse current that the device can withstand without damage. Critical for surge and inrush conditions. Verify against datasheet for pulse duration and junction temperature.

Physical package or case type of the component, defining its dimensions, mounting style, and thermal characteristics. Common types include SMD, through-hole, BGA, and QFN. Choose the package that fits your PCB layout and assembly process. Verify the exact package code in the datasheet for footprint compatibility.

Physical height of the component, measured from the mounting surface to the topmost point. This dimension is critical for clearance in compact assemblies and for ensuring proper fit within enclosures. Always verify against the datasheet for tolerance and mounting considerations.